AD831AP-REEL RF Mixer IC Equivalent & Substitute Parts

Part Overview

The AD831AP-REEL is an RF mixer integrated circuit designed for HF and VHF down conversion applications with a maximum frequency of 500MHz. This component operates as a single-channel mixer with 0dB gain and 14dB noise figure, housed in a 20-PLCC (9x9) surface mount package. The AD831AP-REEL is classified as obsolete, making identification of equivalent and substitute parts essential for ongoing system support and new design implementations.

Substiute Parts

AD831AP-REEL

Analog Devices Inc.In Stock: 1079AD831AP-REEL Datasheet

Current PartRFQ

AD831APZ-REEL

Analog Devices Inc.In Stock: 1967AD831APZ-REEL Datasheet

DirectRFQ

AD831APZ-REEL7

Analog Devices Inc.In Stock: 1662AD831APZ-REEL7 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the AD831AP-REEL is determined by strict equivalence across the following critical parameters: RF type classification (HF, VHF), operating frequency (500MHz), mixer count (1), electrical performance metrics (0dB gain, 14dB noise figure), supply current (125mA), supply voltage range (4.5V ~ 5.5V), package type (20-LCC J-Lead), and physical package designation (20-PLCC 9x9). All substitute parts maintain identical electrical and mechanical specifications, ensuring direct functional compatibility in existing circuit designs.

The AD831APZ-REEL and AD831APZ-REEL7 are classified as direct manufacturer equivalents within the AD831 series. Both parts satisfy all parametric requirements for substitution. The primary distinction between these alternatives relates to product status and packaging format rather than electrical performance.

Parameter Comparison

Engineering Selection Recommendations

For applications currently using the obsolete AD831AP-REEL, the AD831APZ-REEL and AD831APZ-REEL7 provide direct parametric equivalence with the advantage of active product status from Analog Devices Inc. Both substitute parts maintain identical electrical performance and physical package specifications.

The AD831APZ-REEL is supplied in standard reel packaging format. The AD831APZ-REEL7 is supplied in Cut Tape (CT) and Digi-Reel® packaging format, offering flexibility for different procurement and assembly workflows.

Both substitute parts carry ROHS3 compliance and REACH unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution. Selection between AD831APZ-REEL and AD831APZ-REEL7 should be based on packaging and supply chain requirements rather than electrical performance, as both parts are electrically and mechanically identical.

Frequently Asked Questions (FAQ)

Q: Can AD831APZ-REEL directly replace AD831AP-REEL in existing designs?

A: Yes. The AD831APZ-REEL maintains identical electrical specifications (500MHz frequency, 0dB gain, 14dB noise figure, 125mA supply current, 4.5V ~ 5.5V supply voltage) and physical package configuration (20-PLCC 9x9 surface mount). No circuit modifications are required.

Q: What is the difference between AD831APZ-REEL and AD831APZ-REEL7?

A: Both parts are electrically and mechanically identical. The primary difference is packaging format: AD831APZ-REEL uses standard reel packaging, while AD831APZ-REEL7 uses Cut Tape (CT) and Digi-Reel® packaging. Selection depends on procurement and assembly requirements.

Q: Why is the AD831AP-REEL classified as obsolete?

A: The AD831AP-REEL has been discontinued by Analog Devices Inc. The active equivalents AD831APZ-REEL and AD831APZ-REEL7 provide continued access to this RF mixer functionality with current manufacturing and regulatory compliance.

Q: Are there any compliance differences between the substitute parts and the original?

A: The substitute parts AD831APZ-REEL and AD831APZ-REEL7 carry ROHS3 compliance and REACH unaffected status. Compliance information for the obsolete AD831AP-REEL is not specified in available documentation.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes. All three parts use identical 20-PLCC (9x9) surface mount packages with 20-LCC J-Lead case configuration. PCB footprints and assembly processes remain unchanged.