Request Quote
(Ships tomorrow)
AD669BNZ Equivalent & Substitute Parts
Part Overview
The AD669BNZ is a 16-bit Digital to Analog Converter manufactured by Analog Devices Inc., designed for data acquisition applications. This through-hole mounted device operates with dual supply voltages (±14.6V to 16.5V analog, 5V digital) and delivers voltage-buffered output with 13µs settling time. The part is Active status and ROHS3 compliant. Substitute parts are identified for applications requiring alternative packaging formats, supply voltage ranges, or mounting technologies while maintaining core 16-bit DAC functionality.
Substiute Parts
Key Parameters
| Parameter | AD669BNZ |
|---|---|
| Number of Bits | 16 |
| Number of D/A Converters | 1 |
| Output Type | Voltage - Buffered |
| Data Interface | Parallel |
| Reference Type | External, Internal |
| Architecture | R-2R |
| Settling Time | 13µs |
| INL/DNL (LSB) | ±2 (Max) |
| Voltage - Supply, Analog | ±14.6V ~ 16.5V |
| Voltage - Supply, Digital | 5V |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 28-DIP (0.600", 15.24mm) |
| Mounting Type | Through Hole |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitute parts for the AD669BNZ are selected based on the following core substitution criteria:
- Resolution: All substitutes maintain 16-bit resolution with single D/A converter configuration
- Architecture: All substitutes use R-2R architecture, ensuring equivalent conversion methodology
- Output Type & Reference: Substitutes support voltage output with external reference capability
- Compliance: All substitutes maintain ROHS3 compliance and Active product status
- Functional Equivalence: All substitutes perform 16-bit digital-to-analog conversion
Substitutes differ in the following allowed parameters:
- Packaging & Mounting: Surface mount alternatives (LFCSP) replace through-hole DIP format
- Data Interface: SPI/DSP interfaces replace parallel interface
- Supply Voltage Ranges: Reduced voltage requirements (2.7V ~ 5.5V) or extended ranges (4.5V ~ 30V)
- Settling Time: Faster settling times (1µs to 9µs) compared to 13µs
- Operating Temperature: Extended upper temperature limits (125°C vs. 85°C)
- Output Buffering: Unbuffered output options available
Parameter Comparison
| Parameter | AD669BNZ | AD5541ABCPZ-REEL7 | AD5542AACPZ-REEL7 | AD5761RBCPZ-RL7 |
|---|---|---|---|---|
| Number of Bits | 16 | 16 | 16 | 16 |
| Number of D/A Converters | 1 | 1 | 1 | 1 |
| Output Type | Voltage - Buffered | Voltage - Unbuffered | Voltage - Unbuffered | Voltage - Buffered |
| Data Interface | Parallel | SPI, DSP | SPI, DSP | SPI |
| Reference Type | External, Internal | External | External | External, Internal |
| Architecture | R-2R | R-2R | R-2R | R-2R |
| Settling Time | 13µs | 1µs | 1µs (Typ) | 9µs |
| INL/DNL (LSB) | ±2 (Max) | ±0.5, ±0.5 | ±0.5, ±0.5 | ±2 (Max), ±1 (Max) |
| Voltage - Supply, Analog | ±14.6V ~ 16.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 4.5V ~ 30V, -16.5V |
| Voltage - Supply, Digital | 5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 1.7V ~ 5.5V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 125°C | -40°C ~ 85°C | -40°C ~ 125°C |
| Package / Case | 28-DIP (0.600", 15.24mm) | 10-VFDFN Exposed Pad, CSP | 16-WFQFN Exposed Pad, CSP | 16-WFQFN Exposed Pad, CSP |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
All substitute parts maintain Active product status and ROHS3 compliance, ensuring regulatory alignment with the AD669BNZ.
AD5541ABCPZ-REEL7 is suitable for applications requiring the smallest footprint (10-LFCSP) and fastest settling time (1µs). This part operates on reduced supply voltages (2.7V ~ 5.5V) and provides superior INL/DNL performance (±0.5 LSB). Selection requires interface redesign from parallel to SPI/DSP and acceptance of unbuffered output.
AD5542AACPZ-REEL7 provides a mid-range footprint (16-LFCSP) with equivalent settling time (1µs) and INL/DNL performance (±0.5 LSB) to the AD5541ABCPZ-REEL7. Operating temperature range matches the AD669BNZ (-40°C ~ 85°C). This part requires SPI/DSP interface implementation and unbuffered output handling.
AD5761RBCPZ-RL7 maintains buffered output architecture matching the AD669BNZ and supports both external and internal reference types. This part operates across extended supply voltage ranges (4.5V ~ 30V, -16.5V) and extended operating temperature (-40°C ~ 125°C). Settling time (9µs) is faster than the AD669BNZ. Selection requires SPI interface implementation instead of parallel.
Frequently Asked Questions (FAQ)
Q: Can AD5541ABCPZ-REEL7, AD5542AACPZ-REEL7, or AD5761RBCPZ-RL7 directly replace AD669BNZ without circuit modification?
A: No. All substitutes require interface redesign. The AD669BNZ uses parallel data interface, while all substitutes use SPI or DSP interfaces. Additionally, AD5541ABCPZ-REEL7 and AD5542AACPZ-REEL7 provide unbuffered output, requiring external buffering if the application depends on buffered output characteristics.
Q: What are the key differences in supply voltage requirements?
A: The AD669BNZ requires ±14.6V to 16.5V analog supply and 5V digital supply. AD5541ABCPZ-REEL7 and AD5542AACPZ-REEL7 operate on 2.7V to 5.5V for both supplies, reducing power requirements. AD5761RBCPZ-RL7 supports 4.5V to 30V analog supply with -16.5V capability and 1.7V to 5.5V digital supply, offering extended voltage flexibility.
Q: Which substitute offers the best linearity performance?
A: AD5541ABCPZ-REEL7 and AD5542AACPZ-REEL7 both provide ±0.5 LSB INL/DNL performance, superior to the AD669BNZ specification of ±2 LSB. AD5761RBCPZ-RL7 maintains ±2 LSB INL and ±1 LSB DNL, matching or exceeding AD669BNZ performance.
Q: Are all substitutes suitable for high-temperature applications?
A: AD5541ABCPZ-REEL7 and AD5761RBCPZ-RL7 support -40°C to 125°C operating range, extending the upper temperature limit by 40°C compared to AD669BNZ. AD5542AACPZ-REEL7 maintains the same -40°C to 85°C range as the AD669BNZ.
Q: What packaging considerations apply to these substitutes?
A: AD669BNZ uses through-hole 28-DIP mounting. All substitutes are surface-mount devices: AD5541ABCPZ-REEL7 uses 10-LFCSP, while AD5542AACPZ-REEL7 and AD5761RBCPZ-RL7 use 16-LFCSP packages. PCB layout and assembly process changes are required.
Q: Which substitute provides the fastest settling time?
A: AD5541ABCPZ-REEL7 and AD5542AACPZ-REEL7 both achieve 1µs settling time, significantly faster than the AD669BNZ at 13µs. AD5761RBCPZ-RL7 provides 9µs settling time, intermediate between the AD669BNZ and the faster alternatives.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts


