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AD669BN Equivalent & Substitute Parts
Part Overview
The AD669BN is a 16-bit digital-to-analog converter (DAC) manufactured by Analog Devices Inc., designed for data acquisition applications. It features a parallel data interface, buffered voltage output, and operates with dual supply voltages (±14.6V to ±16.5V analog, 5V digital). The AD669BN is classified as obsolete, making equivalent and substitute parts necessary for new designs and ongoing production support.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | AD669BN |
| Manufacturer | Analog Devices Inc. |
| Category | Data Acquisition |
| Number of Bits | 16 |
| Number of D/A Converters | 1 |
| Settling Time | 13µs |
| Output Type | Voltage - Buffered |
| Data Interface | Parallel |
| Reference Type | External, Internal |
| Voltage - Supply, Analog | ±14.6V ~ 16.5V |
| Voltage - Supply, Digital | 5V |
| INL/DNL (LSB) | ±2 (Max), ±2 (Max) |
| Architecture | R-2R |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 28-DIP (0.600", 15.24mm) |
| Mounting Type | Through Hole |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the AD669BN is determined by the following critical parameters:
- Resolution: 16-bit conversion capability
- Number of Converters: Single D/A converter
- Output Configuration: Voltage output with buffering
- Data Interface: Parallel input (primary requirement for direct substitution)
- Reference Support: External and/or internal reference capability
- Supply Voltage Compatibility: Analog and digital supply ranges
- Accuracy: INL/DNL specifications
- Architecture: R-2R ladder topology
- Temperature Range: Operating temperature limits
- Package Type: Through-hole or surface-mount alternatives
The AD669BNZ is a direct equivalent with identical electrical specifications but different packaging (Tube vs. standard). The AD5761RBCPZ-RL7, AD5542AACPZ-REEL7, AD5760BCPZ, and AD5541ABCPZ-REEL7 are similar parts that share core 16-bit DAC functionality but differ in interface type (SPI/DSP instead of parallel), output buffering, supply voltage ranges, and package form factors. These alternatives require design evaluation for interface compatibility and supply voltage requirements.
Parameter Comparison
| Parameter | AD669BN | AD669BNZ | AD5761RBCPZ-RL7 | AD5542AACPZ-REEL7 | AD5760BCPZ | AD5541ABCPZ-REEL7 |
|---|---|---|---|---|---|---|
| Number of Bits | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of D/A Converters | 1 | 1 | 1 | 1 | 1 | 1 |
| Settling Time | 13µs | 13µs | 9µs | 1µs (Typ) | 4.6µs (Typ) | 1µs |
| Output Type | Voltage - Buffered | Voltage - Buffered | Voltage - Buffered | Voltage - Unbuffered | Voltage - Unbuffered | Voltage - Unbuffered |
| Data Interface | Parallel | Parallel | SPI | SPI, DSP | SPI, DSP | SPI, DSP |
| Reference Type | External, Internal | External, Internal | External, Internal | External | External | External |
| Voltage - Supply, Analog | ±14.6V ~ 16.5V | ±14.6V ~ 16.5V | 4.5V ~ 30V, -16.5V | 2.7V ~ 5.5V | 7.5V ~ 16.5V, -2.5V ~ 16.5V | 2.7V ~ 5.5V |
| Voltage - Supply, Digital | 5V | 5V | 1.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| INL/DNL (LSB) | ±2, ±2 | ±2, ±2 | ±2, ±1 | ±0.5, ±0.5 | ±2, ±1 | ±0.5, ±0.5 |
| Architecture | R-2R | R-2R | R-2R | R-2R | R-2R | R-2R |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Package / Case | 28-DIP (0.600", 15.24mm) | 28-DIP (0.600", 15.24mm) | 16-WFQFN Exposed Pad, CSP | 16-WFQFN Exposed Pad, CSP | 24-VFQFN Exposed Pad, CSP | 10-VFDFN Exposed Pad, CSP |
| Mounting Type | Through Hole | Through Hole | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active | Active | Active | Active | Active |
| RoHS Status | Not Specified | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
AD669BNZ: This part is the direct functional equivalent of the AD669BN with identical electrical specifications and through-hole 28-DIP packaging. It maintains active product status and ROHS3 compliance, making it the primary choice for direct replacement in existing through-hole designs.
AD5761RBCPZ-RL7: This part offers buffered voltage output and dual reference support (external and internal) with improved settling time (9µs vs. 13µs). It requires SPI interface instead of parallel, operates across an extended temperature range (-40°C to 125°C), and uses surface-mount packaging. Selection requires interface redesign but provides superior performance and compliance.
AD5542AACPZ-REEL7 and AD5541ABCPZ-REEL7: These parts feature faster settling times (1µs typical) and superior accuracy (±0.5 LSB INL/DNL) but operate at lower supply voltages (2.7V to 5.5V), use SPI/DSP interfaces, and provide external reference only. They are suitable for low-voltage, high-speed applications requiring surface-mount technology.
AD5760BCPZ: This part supports higher analog supply voltages (7.5V to 16.5V, -2.5V to 16.5V) with moderate settling time (4.6µs typical) and improved accuracy (±2/±1 LSB). It uses SPI/DSP interface and surface-mount packaging, suitable for applications requiring extended supply voltage ranges.
Frequently Asked Questions (FAQ)
Q: Can AD669BNZ be used as a direct replacement for AD669BN?
A: Yes. The AD669BNZ is electrically identical to the AD669BN with the same 16-bit resolution, parallel interface, buffered output, dual supply voltage requirements (±14.6V to ±16.5V analog, 5V digital), and R-2R architecture. The only difference is packaging format (Tube vs. standard). It is the recommended direct substitute.
Q: What is the primary difference between AD669BN and the AD5761RBCPZ-RL7?
A: The AD5761RBCPZ-RL7 uses SPI serial interface instead of parallel, requires circuit redesign for data communication. It offers faster settling time (9µs vs. 13µs), extended temperature range (-40°C to 125°C vs. -40°C to 85°C), and surface-mount packaging. Supply voltage ranges differ: AD5761 supports 4.5V to 30V and -16.5V analog, while AD669 requires ±14.6V to ±16.5V.
Q: Why do AD5542AACPZ-REEL7 and AD5541ABCPZ-REEL7 have different supply voltage requirements?
A: These parts are designed for low-voltage applications and operate at 2.7V to 5.5V for both analog and digital supplies, compared to the AD669BN's ±14.6V to ±16.5V analog and 5V digital. They are not suitable for systems requiring dual ±supply voltages.
Q: Can I use a surface-mount substitute in a through-hole design?
A: No. Surface-mount packages (LFCSP, VFQFN, VFDFN) require different PCB layouts, soldering processes, and mounting techniques than through-hole 28-DIP packages. Design and manufacturing changes are necessary.
Q: Which substitute offers the best accuracy?
A: AD5542AACPZ-REEL7 and AD5541ABCPZ-REEL7 offer the best accuracy with ±0.5 LSB INL/DNL specifications, compared to ±2 LSB for the AD669BN. However, they operate at lower supply voltages and require SPI/DSP interface redesign.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All active substitute parts (AD669BNZ, AD5761RBCPZ-RL7, AD5542AACPZ-REEL7, AD5760BCPZ, AD5541ABCPZ-REEL7) are ROHS3 compliant. The original AD669BN does not specify RoHS status due to its obsolete classification.
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