AB0814-T3 Equivalent & Substitute Parts

Part Overview

The AB0814-T3 is a Real Time Clock (RTC) IC with Clock/Calendar functionality manufactured by Abracon LLC. This device integrates a 256-byte SRAM, SPI interface, and features including alarm, leap year compensation, trickle-charger, and watchdog timer capabilities. The AB0814-T3 is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. Substitute parts are selected based on matching electrical specifications, interface compatibility, and functional feature parity.

Substiute Parts

AB0814-T3

Abracon LLCIn Stock: 890AB0814-T3 Datasheet

Current PartRFQ

AB0815-T3

Abracon LLCIn Stock: 127337AB0815-T3 Datasheet

MFR RecommendedRFQ

MCP79510T-I/MS

Microchip TechnologyIn Stock: 40253MCP79510T-I/MS Datasheet

MFR RecommendedRFQ

MCP79511T-I/MS

Microchip TechnologyIn Stock: 5437MCP79511T-I/MS Datasheet

MFR RecommendedRFQ

MCP79522T-I/MS

Microchip TechnologyIn Stock: 732MCP79522T-I/MS Datasheet

MFR RecommendedRFQ

MCP795W11T-I/ST

Microchip TechnologyIn Stock: 1114MCP795W11T-I/ST Datasheet

MFR RecommendedRFQ

PCF2123BS/1,518

NXP USA Inc.In Stock: 3277PCF2123BS/1,518 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the AB0814-T3 are grouped based on the following critical parameters that determine functional compatibility:

Primary Substitution Criteria:

• Interface type: SPI
• Operating temperature range: -40°C ~ 85°C
• RoHS3 compliance
• Surface mount packaging
• Clock/Calendar functionality with time and date format support

Grouping Logic:

Group 1 - Direct Package Match (16-VFQFN): AB0815-T3 and PCF2123BS/1,518 maintain the same 16-VFQFN package footprint as the AB0814-T3, enabling direct PCB layout compatibility.

Group 2 - Alternative Packages (10-MSOP / 14-TSSOP): MCP79510T-I/MS, MCP79511T-I/MS, MCP79522T-I/MS, and MCP795W11T-I/ST use different package geometries (10-MSOP or 14-TSSOP) but maintain SPI interface, operating temperature range, and RoHS3 compliance. These require PCB redesign but offer functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

AB0815-T3 (Abracon LLC) is the primary recommended substitute. It maintains identical electrical specifications, memory capacity (256B), package geometry (16-VFQFN), and MSL rating (1) as the AB0814-T3. The AB0815-T3 is in active production status with significantly higher inventory availability (127,301 units), ensuring supply chain continuity. This part requires no PCB redesign.

PCF2123BS/1,518 (NXP USA Inc.) provides package-compatible substitution with the same 16-VFQFN footprint. It maintains SPI interface and operating temperature range. However, the PCF2123BS/1,518 has a higher MSL rating (3 vs. 1), indicating greater moisture sensitivity during storage and handling. Supply voltage range extends to 5.5V, offering broader compatibility with mixed-voltage systems.

Microchip MCP795xx Series (MCP79510T-I/MS, MCP79511T-I/MS, MCP79522T-I/MS, MCP795W11T-I/ST) offers functional equivalence with SPI interface and matching operating temperature range. These parts use alternative packages (10-MSOP or 14-TSSOP), requiring PCB layout redesign. Memory capacity is reduced to 64B. MCP79511T-I/MS and MCP79522T-I/MS maintain MSL rating 1. MCP795W11T-I/ST includes watchdog timer functionality matching the AB0814-T3 feature set.

All substitute parts maintain ROHS3 compliance and EAR99 export classification consistent with the original part.

Frequently Asked Questions (FAQ)

Q: Can AB0815-T3 be used as a direct replacement for AB0814-T3?

A: Yes. The AB0815-T3 is electrically and mechanically identical to the AB0814-T3. Both use the 16-VFQFN package, support identical voltage ranges (1.7V ~ 3.6V supply, 1.5V ~ 3.6V battery), and provide 256B memory with SPI interface. No design changes are required.

Q: What are the key differences between the Abracon AB0815-T3 and Microchip MCP795xx series?

A: The primary differences are package geometry and memory capacity. AB0815-T3 uses 16-VFQFN with 256B memory. MCP79510T-I/MS, MCP79511T-I/MS, and MCP79522T-I/MS use 10-MSOP packages with 64B memory. MCP795W11T-I/ST uses 14-TSSOP with 64B memory. All maintain SPI interface and -40°C ~ 85°C operating range. Microchip parts have higher timekeeping current consumption (1µA vs. 0.17µA ~ 0.22µA).

Q: Is PCF2123BS/1,518 suitable for battery-backed applications?

A: The PCF2123BS/1,518 datasheet does not specify battery supply voltage range, unlike the AB0814-T3 (1.5V ~ 3.6V battery) and Microchip alternatives (1.3V ~ 3.6V battery). Verify battery backup requirements with the PCF2123BS/1,518 detailed specifications before selection.

Q: What does MSL rating mean for RTC IC selection?

A: Moisture Sensitivity Level (MSL) indicates the maximum time a component can be stored in standard conditions (30°C, 60% relative humidity) before requiring baking. MSL 1 (Unlimited) allows indefinite storage. MSL 2 (1 Year) and MSL 3 (168 Hours) require more frequent baking cycles. For supply chain flexibility, MSL 1 rated parts (AB0815-T3, MCP79511T-I/MS, MCP79522T-I/MS, MCP795W11T-I/ST) are preferred.

Q: Can Microchip MCP795xx parts be used in designs requiring 256B memory?

A: No. Microchip MCP795xx series provides only 64B memory compared to the AB0814-T3 and AB0815-T3 (256B). If application firmware or data storage requires 256B capacity, Microchip parts are not suitable. AB0815-T3 is the required substitute.

Q: What is the impact of different package types on PCB design?

A: AB0815-T3 and PCF2123BS/1,518 use identical 16-VFQFN (3x3mm) packages, enabling direct PCB footprint reuse. Microchip MCP79510T-I/MS, MCP79511T-I/MS, and MCP79522T-I/MS use 10-MSOP packages (different pin count and layout). MCP795W11T-I/ST uses 14-TSSOP. Switching to Microchip parts requires PCB redesign, schematic updates, and firmware validation for pin mapping differences.