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9DB233AFILF Equivalent & Substitute Parts
Part Overview
The 9DB233AFILF is a PCI Express (PCIe) Fanout Buffer with Zero Delay distribution capability manufactured by Renesas Electronics Corporation. This IC functions as a clock fanout/buffer in 20-QSOP packaging, supporting 110MHz maximum frequency with HCSL output format. The device is classified as obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 9DB233AFILF |
| Manufacturer | Renesas Electronics Corporation |
| Category | Clock/Timing |
| Product Status | Obsolete |
| Main Purpose | PCI Express (PCIe) |
| Frequency - Max | 110MHz |
| Output Type | HCSL |
| Number of Circuits | 1 |
| Ratio - Input:Output | 1:2 |
| Differential - Input:Output | Yes/Yes |
| Voltage - Supply | 3.135V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 20-QSOP (0.154", 3.90mm Width) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Substitute Part Grouping Explanation
Substitution eligibility for the 9DB233AFILF is determined by the following critical parameters:
- Functional Equivalence: PCI Express (PCIe) fanout buffer application with zero delay distribution
- Electrical Specifications: Maximum frequency of 110MHz, HCSL output format, 1:2 input-to-output ratio, differential input and output configuration
- Supply Voltage: 3.135V ~ 3.465V operating range
- Temperature Range: -40°C ~ 85°C operating window
- Mounting and Packaging: Surface mount technology with compatible package footprint and pin configuration
- Regulatory Compliance: REACH and ECCN classification alignment
The 9DB233AGILF qualifies as a manufacturer-recommended substitute based on identical electrical specifications, functional purpose, and regulatory status. The primary distinction lies in packaging format and product lifecycle status.
Parameter Comparison
| Parameter | 9DB233AFILF (Main) | 9DB233AGILF (Substitute) |
|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Base Product Number | 9DB233 | 9DB233 |
| Product Status | Obsolete | Active |
| Main Purpose | PCI Express (PCIe) | PCI Express (PCIe) |
| Frequency - Max | 110MHz | 110MHz |
| Output Type | HCSL | HCSL |
| Number of Circuits | 1 | 1 |
| Ratio - Input:Output | 1:2 | 1:2 |
| Differential - Input:Output | Yes/Yes | Yes/Yes |
| Voltage - Supply | 3.135V ~ 3.465V | 3.135V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 20-QSOP (0.154", 3.90mm Width) | 20-TSSOP (0.173", 4.40mm Width) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | EAR99 | EAR99 |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The 9DB233AGILF is the manufacturer-recommended substitute for the obsolete 9DB233AFILF. Both devices share identical electrical specifications, functional characteristics, and regulatory compliance profiles. The substitute maintains full compatibility with the original part's electrical and thermal operating parameters.
The primary consideration for selection is packaging format. The 9DB233AGILF uses 20-TSSOP packaging (0.173", 4.40mm width) compared to the original 20-QSOP format (0.154", 3.90mm width). This represents a minor dimensional increase that may require PCB layout evaluation for space-constrained applications.
The 9DB233AGILF carries Active product status and ROHS3 compliance certification, providing extended lifecycle support and regulatory alignment for new designs. The substitute is available in higher inventory quantities, supporting both replacement and new production requirements.
Frequently Asked Questions (FAQ)
Q: Can the 9DB233AGILF directly replace the 9DB233AFILF in existing designs?
A: Electrical and functional compatibility is complete. Pin configuration and electrical specifications are identical. PCB layout modification may be required due to package dimension differences (QSOP vs. TSSOP format). Verify footprint compatibility with your PCB design before implementation.
Q: What is the primary difference between these two parts?
A: The main differences are product lifecycle status and packaging format. The 9DB233AFILF is obsolete with 20-QSOP packaging, while the 9DB233AGILF is active with 20-TSSOP packaging. All electrical specifications, frequency ratings, voltage requirements, and temperature ranges are identical.
Q: Are there any compliance or regulatory differences?
A: Both parts maintain REACH Unaffected and EAR99 ECCN classifications. The 9DB233AGILF additionally carries ROHS3 compliance certification, providing enhanced regulatory alignment for current manufacturing standards.
Q: What are the package dimension implications?
A: The 9DB233AGILF (20-TSSOP) is 0.173" wide compared to the 9DB233AFILF (20-QSOP) at 0.154" wide. This 0.019" increase requires PCB layout verification for applications with tight spacing constraints.
Q: Is the 9DB233AGILF suitable for new PCIe fanout buffer designs?
A: Yes. The active product status, ROHS3 compliance, and identical electrical specifications make the 9DB233AGILF appropriate for new PCI Express clock distribution applications requiring 110MHz fanout buffering with zero delay characteristics.
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