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Amphenol ICC 95066-230H Equivalent & Substitute Parts
Part Overview
The Amphenol ICC 95066-230H is a rectangular connector header featuring 30 positions arranged in 2 rows with 0.100" (2.54mm) pitch spacing. This through-hole mounted connector is part of the BERGSTIK® II series and is designed for board-to-board applications. The part is currently active in production with 793 units in stock. Substitute parts are identified when equivalent electrical and mechanical parameters are required due to availability constraints, design revisions, or supply chain considerations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Connector Type | Header |
| Contact Type | Male Pin |
| Number of Positions | 30 |
| Number of Rows | 2 |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Contact Finish - Mating | Gold or Gold, GXT™ |
| Insulation Material | Polycyclohexylenedimethylene Terephthalate (PCT) |
| Material Flammability Rating | UL94 V-0 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the Amphenol ICC 95066-230H is based on the following critical parameters that must remain equivalent:
- Connector positioning and pitch: 30 positions in 2 rows at 0.100" (2.54mm) pitch and row spacing
- Mounting and termination: Through-hole solder termination for PCB integration
- Contact system: Male pin configuration with gold plating for reliable mating
- Insulation and flammability: PCT material with UL94 V-0 rating for safety compliance
- Moisture sensitivity: MSL 1 classification for unlimited shelf life
The Samtec Inc. ZW-15-14-G-D-1015-180 meets these core electrical and mechanical requirements as a direct substitute. Both parts share identical pitch spacing, position count, row configuration, and through-hole solder termination. Physical dimensions vary in stack height and post length, which are application-dependent parameters that must be evaluated for specific board designs.
Parameter Comparison
| Parameter | Amphenol ICC 95066-230H | Samtec Inc. ZW-15-14-G-D-1015-180 |
|---|---|---|
| Manufacturer | Amphenol ICC (FCI) | Samtec Inc. |
| Number of Positions | 30 | 30 |
| Number of Rows | 2 | 2 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole |
| Termination | Kinked Pin, Solder | Solder |
| Contact Finish - Mating | Gold or Gold, GXT™ | Gold |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) | 10.0µin (0.25µm) |
| Insulation Color | Black | Black |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| ECCN | EAR99 | EAR99 |
| HTSUS | 8536.69.4040 | 8536.69.4040 |
Engineering Selection Recommendations
Both the Amphenol ICC 95066-230H and Samtec Inc. ZW-15-14-G-D-1015-180 are active production parts with identical core electrical and mechanical specifications for 30-position, 2-row, 0.100" pitch through-hole header applications.
The Samtec ZW-15-14-G-D-1015-180 offers ROHS3 compliance, which may be required for applications subject to RoHS regulations. The Amphenol ICC 95066-230H is RoHS non-compliant and should be selected only when RoHS exemptions apply or when legacy design requirements mandate this specific part.
Contact finish thickness differs between the two parts: the Amphenol ICC part specifies 15.0µin (0.38µm) while the Samtec part specifies 10.0µin (0.25µm). Both thicknesses are within industry standards for gold plating durability. Physical dimensions, including stack height and post length, differ and must be evaluated against specific PCB layout and mating connector requirements.
Frequently Asked Questions (FAQ)
Q: Can the Samtec ZW-15-14-G-D-1015-180 directly replace the Amphenol ICC 95066-230H in existing designs?
A: Direct replacement is possible if the physical dimensions, particularly stack height (1.015" for Samtec vs. unspecified for Amphenol) and post length (0.235" for Samtec vs. 0.120" for Amphenol), are compatible with the mating connector and PCB layout. The electrical and mechanical pitch specifications are identical.
Q: What is the significance of the RoHS compliance difference?
A: The Samtec part is ROHS3 compliant, meeting current European Union Restriction of Hazardous Substances regulations. The Amphenol ICC part is RoHS non-compliant and is suitable only for applications where RoHS exemptions are applicable or where legacy designs specifically require this part.
Q: Are the gold plating thicknesses functionally equivalent?
A: Both gold plating thicknesses (15.0µin for Amphenol ICC and 10.0µin for Samtec) meet industry standards for contact durability and electrical performance in standard mating cycles. Selection should be based on application-specific contact life requirements.
Q: What are the key parameters that must match for substitution?
A: Critical matching parameters are: 30 positions, 2 rows, 0.100" (2.54mm) pitch and row spacing, through-hole solder termination, male pin contact type, and gold-plated mating surfaces. Physical dimensions such as stack height and post length must be evaluated for specific board designs.
Q: Are both parts suitable for the same moisture sensitivity applications?
A: Yes. Both parts carry MSL 1 (Unlimited) classification, indicating unlimited shelf life without moisture bake-out requirements prior to soldering.
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