93LC86B-I/P EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93LC86B-I/P is a 16Kbit non-volatile EEPROM memory IC manufactured by Microchip Technology, featuring Microwire serial interface protocol. This component is designed for applications requiring persistent data storage with low power consumption and wide voltage tolerance. The device is currently in active production status with full RoHS3 compliance and REACH unaffected classification.

Substitute parts are identified when equivalent electrical and mechanical parameters are maintained, ensuring functional interchangeability within the same application context while accounting for organizational memory differences and packaging variations.

Substiute Parts

93LC86B-I/P

Microchip TechnologyIn Stock: 100193LC86B-I/P Datasheet

Current PartRFQ

93LC86C-I/P

Microchip TechnologyIn Stock: 648093LC86C-I/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 93LC86B-I/P is determined by strict equivalence across the following critical parameters:

• Memory capacity: 16Kbit total storage
• Interface protocol: Microwire serial communication
• Clock frequency: 3 MHz maximum
• Write cycle time: 5ms per operation
• Supply voltage range: 2.5V to 5.5V operation
• Temperature range: -40°C to 85°C
• Package form factor: 8-DIP through-hole configuration
• Compliance certifications: RoHS3 and REACH status

The 93LC86C-I/P qualifies as a direct substitute based on identical electrical specifications and package compatibility. Memory organization differences (2K x 8 or 1K x 16 configurations) do not affect functional substitution when the total 16Kbit capacity and Microwire interface are preserved.

Parameter Comparison

Engineering Selection Recommendations

Both the 93LC86B-I/P and 93LC86C-I/P maintain active production status with equivalent compliance certifications. Selection between these parts should be based on:

• Availability and lead time requirements
• Packaging format preference (tube packaging available for 93LC86C-I/P)
• Inventory levels and cost considerations
• Memory organization requirements within the 1K x 16 or 2K x 8 configurations

Both parts satisfy identical electrical, thermal, and regulatory requirements for applications requiring 16Kbit Microwire EEPROM functionality in 8-DIP through-hole packages.

Frequently Asked Questions (FAQ)

Q: Can the 93LC86C-I/P directly replace the 93LC86B-I/P in existing designs?

A: Yes. Both parts share identical electrical specifications, clock frequency, write cycle timing, supply voltage range, operating temperature range, and 8-DIP package dimensions. The memory organization difference (1K x 16 versus 2K x 8 or 1K x 16) does not affect functional compatibility when total capacity remains 16Kbit.

Q: What is the significance of the memory organization difference between these parts?

A: Memory organization describes how the 16Kbit capacity is addressed. The 93LC86B-I/P uses 1K x 16 (1024 addresses, 16 bits per address). The 93LC86C-I/P supports both 2K x 8 and 1K x 16 configurations. This difference does not impact substitution when the Microwire interface protocol and total storage capacity are preserved.

Q: Are there packaging differences between these substitute parts?

A: Both parts use identical 8-DIP (0.300", 7.62mm) through-hole packages. The 93LC86C-I/P is available in tube packaging, while the 93LC86B-I/P packaging format is not specified in the provided data. This does not affect electrical or mechanical compatibility.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the 93LC86B-I/P and 93LC86C-I/P are ROHS3 compliant and REACH unaffected, meeting equivalent regulatory requirements for industrial and commercial applications.

Q: What are the critical parameters that determine substitution eligibility?

A: Substitution is determined by equivalence in memory capacity (16Kbit), interface protocol (Microwire), clock frequency (3 MHz), write cycle time (5ms), supply voltage range (2.5V to 5.5V), operating temperature range (-40°C to 85°C), and package form factor (8-DIP through-hole).