93LC76B-E/SN EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93LC76B-E/SN is an 8Kbit non-volatile EEPROM memory IC manufactured by Microchip Technology, featuring Microwire serial interface protocol and operating across a wide supply voltage range of 2.5V to 5.5V. This device is actively produced and widely used in embedded systems requiring persistent data storage with low power consumption. Substitute parts are necessary when the primary part experiences supply constraints, when alternative packaging formats are required for manufacturing processes, or when design specifications allow for compatible interface protocols and electrical parameters.

Substiute Parts

93LC76B-E/SN
Microchip TechnologyIn Stock: 76293LC76B-E/SN Datasheet
93LC76B-E/SN
Current Part
BR93L76RF-WE2
Rohm SemiconductorIn Stock: 2327BR93L76RF-WE2 Datasheet
BR93L76RF-WE2
MFR Recommended
BR93L76RFJ-WE2
Rohm SemiconductorIn Stock: 16266BR93L76RFJ-WE2 Datasheet
BR93L76RFJ-WE2
MFR Recommended

Key Parameters

Parameter Value
Memory Size 8Kbit
Memory Organization 512 x 16
Memory Interface Microwire
Clock Frequency 3 MHz
Write Cycle Time 5ms
Supply Voltage Range 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C
Package Type 8-SOIC
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the 93LC76B-E/SN must maintain electrical and functional compatibility based on the following critical parameters:

Memory Capacity & Organization: All substitutes must provide 8Kbit capacity with 512 x 16 organization to ensure software compatibility without firmware modifications.

Serial Interface Protocol: The Microwire interface is the primary selection criterion. Parts using identical Microwire protocol ensure direct pin-level compatibility and require no protocol translation circuitry.

Write Cycle Time: The 5ms write cycle time specification must be met or exceeded by substitute parts to maintain system timing requirements.

Supply Voltage Compatibility: Substitute parts must operate within overlapping voltage ranges. The main part operates 2.5V ~ 5.5V; substitutes operating at 1.8V ~ 5.5V are compatible in systems using 2.5V or higher supply voltages.

Operating Temperature Range: Substitutes must support the required temperature range for the application. The main part supports -40°C ~ 125°C; substitutes with -40°C ~ 85°C range are suitable for applications not requiring the extended upper temperature specification.

Package Compatibility: Surface mount packages (8-SOIC, 8-SOP, 8-SOP-J) are mechanically and electrically interchangeable when pin assignments are identical, though PCB layout modifications may be required for different package dimensions.

Parameter Comparison

Parameter 93LC76B-E/SN (Main) BR93L76RF-WE2 BR93L76RFJ-WE2
Manufacturer Microchip Technology Rohm Semiconductor Rohm Semiconductor
Memory Size 8Kbit 8Kbit 8Kbit
Memory Organization 512 x 16 512 x 16 512 x 16
Memory Interface Microwire Microwire Microwire
Clock Frequency 3 MHz 2 MHz 2 MHz
Write Cycle Time 5ms 5ms 5ms
Supply Voltage Range 2.5V ~ 5.5V 1.8V ~ 5.5V 1.8V ~ 5.5V
Operating Temperature -40°C ~ 125°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 8-SOIC (0.154", 3.90mm) 8-SOIC (0.173", 4.40mm) 8-SOIC (0.154", 3.90mm)
Packaging Format Tube Tape & Reel (TR) Cut Tape (CT)
Product Status Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

BR93L76RFJ-WE2 (Primary Substitute): This part maintains identical package dimensions (8-SOIC 0.154", 3.90mm width) to the main part, eliminating PCB layout modifications. It is ROHS3 compliant and actively produced. The reduced clock frequency (2 MHz versus 3 MHz) and narrower operating temperature range (-40°C ~ 85°C versus -40°C ~ 125°C) are acceptable for applications not requiring extended temperature operation. This part is available in Cut Tape packaging format.

BR93L76RF-WE2 (Secondary Substitute): This part provides identical electrical specifications to BR93L76RFJ-WE2 but features a wider package body (8-SOIC 0.173", 4.40mm width), requiring PCB layout verification before implementation. It is ROHS3 compliant and actively produced, available in Tape & Reel packaging format suitable for high-volume manufacturing processes.

Both Rohm Semiconductor substitutes are verified as programmable through DiGi-Electronics and maintain full ROHS3 and REACH compliance, matching the regulatory status of the main part.

Frequently Asked Questions (FAQ)

Q: Can BR93L76RFJ-WE2 operate at the same clock frequency as 93LC76B-E/SN? A: No. BR93L76RFJ-WE2 operates at 2 MHz maximum clock frequency, while 93LC76B-E/SN operates at 3 MHz. Systems designed for 3 MHz operation must verify that 2 MHz operation is acceptable for their timing requirements.

Q: Are the package dimensions identical between 93LC76B-E/SN and BR93L76RFJ-WE2? A: Yes. Both use 8-SOIC packaging with 0.154" (3.90mm) width, allowing direct PCB footprint compatibility without layout modifications.

Q: What is the difference between BR93L76RF-WE2 and BR93L76RFJ-WE2? A: Both parts are electrically identical with 8Kbit capacity, Microwire interface, and 2 MHz operation. The primary difference is package body width: BR93L76RF-WE2 is 0.173" (4.40mm) while BR93L76RFJ-WE2 is 0.154" (3.90mm). Additionally, BR93L76RF-WE2 is supplied in Tape & Reel format while BR93L76RFJ-WE2 is supplied in Cut Tape format.

Q: Can these substitutes operate in applications requiring -40°C to 125°C temperature range? A: No. Both Rohm substitutes are rated for -40°C to 85°C operation. Applications requiring operation above 85°C must use the main part 93LC76B-E/SN or identify alternative parts with extended temperature specifications.

Q: Are all three parts ROHS3 compliant? A: Yes. The main part 93LC76B-E/SN and both Rohm substitutes (BR93L76RF-WE2 and BR93L76RFJ-WE2) are ROHS3 compliant and REACH unaffected.

Q: What packaging formats are available for these parts? A: 93LC76B-E/SN is supplied in Tube format. BR93L76RF-WE2 is supplied in Tape & Reel (TR) format for automated assembly. BR93L76RFJ-WE2 is supplied in Cut Tape (CT) format for manual or semi-automated assembly.

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