93LC56BT-E/ST EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93LC56BT-E/ST is a 2Kbit non-volatile EEPROM memory IC manufactured by Microchip Technology, featuring Microwire serial interface protocol and operating at 2 MHz clock frequency. This component is designed for applications requiring persistent data storage in embedded systems, industrial controls, and consumer electronics. The part is currently in active production status with verified programmability and full RoHS3 compliance. Substitute parts are identified when equivalent memory capacity, interface protocol, package form factor, and operating specifications align with application requirements.

Substiute Parts

93LC56BT-E/ST

Microchip TechnologyIn Stock: 140393LC56BT-E/ST Datasheet

Current PartRFQ

BR93L56RFVT-WE2

Rohm SemiconductorIn Stock: 1660BR93L56RFVT-WE2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 93LC56BT-E/ST is determined by the following critical parameters:

• Memory Capacity: 2Kbit with 128 x 16 organization
• Serial Interface Protocol: Microwire compatibility
• Clock Frequency: 2 MHz operation
• Package Form Factor: 8-TSSOP surface mount configuration
• Supply Voltage Range: Minimum 2.5V operation required
• Temperature Operating Range: Minimum -40°C to 125°C coverage
• Compliance Standards: RoHS3 and REACH compliance

The BR93L56RFVT-WE2 manufactured by Rohm Semiconductor meets these substitution criteria with identical memory capacity, Microwire interface, 2 MHz clock frequency, and 8-TSSOP package configuration. Variations in write cycle time and supply voltage range do not preclude substitution when the application operates within the overlapping parameter window.

Parameter Comparison

Engineering Selection Recommendations

Both the 93LC56BT-E/ST and BR93L56RFVT-WE2 are active production components with verified programmability and full RoHS3 compliance. Selection between these parts depends on application-specific operating conditions:

The 93LC56BT-E/ST is suitable for applications requiring extended temperature operation up to 125°C. The BR93L56RFVT-WE2 supports lower supply voltage operation starting at 1.8V and offers faster write cycle performance at 5ms. Both components maintain identical memory capacity, interface protocol, and clock frequency specifications. The 8-TSSOP and 8-TSSOP-B package variants are mechanically compatible for PCB layout purposes. Component selection should be based on supply voltage requirements, maximum operating temperature constraints, and write cycle timing margins specific to the target application.

Frequently Asked Questions (FAQ)

Q: Can BR93L56RFVT-WE2 replace 93LC56BT-E/ST in all applications?

A: Substitution is valid when the application operates within the overlapping parameter window: supply voltage between 2.5V and 5.5V, and operating temperature between -40°C and 85°C. Applications requiring operation above 85°C or below 2.5V supply voltage must use the original 93LC56BT-E/ST specification.

Q: Are the 8-TSSOP and 8-TSSOP-B packages mechanically interchangeable?

A: Both packages maintain identical 0.173" width and 4.40mm dimensions for the 8-pin TSSOP form factor. PCB footprints designed for 8-TSSOP accommodate 8-TSSOP-B components without modification.

Q: What is the significance of the faster write cycle time in BR93L56RFVT-WE2?

A: The BR93L56RFVT-WE2 write cycle time of 5ms is faster than the 93LC56BT-E/ST specification of 6ms. This parameter does not affect substitution eligibility; applications designed for 6ms write cycles operate correctly with the faster substitute part.

Q: Do both parts support identical Microwire protocol implementation?

A: Both the 93LC56BT-E/ST and BR93L56RFVT-WE2 implement Microwire serial interface protocol at 2 MHz clock frequency with 128 x 16 memory organization. Protocol compatibility is maintained across both components.

Q: What compliance certifications apply to both substitute parts?

A: Both components are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic component manufacturing and distribution.