93LC56B-E/ST EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93LC56B-E/ST is a 2Kbit non-volatile EEPROM memory integrated circuit manufactured by Microchip Technology. This device operates via the Microwire serial interface protocol and is housed in an 8-TSSOP surface mount package. The part is classified as Active status with full RoHS3 compliance and REACH unaffected designation. Substitute parts are identified when equivalent electrical and mechanical specifications are required for design flexibility, supply chain alternatives, or packaging format preferences while maintaining functional compatibility within the specified parameter constraints.

Substiute Parts

93LC56B-E/ST

Microchip TechnologyIn Stock: 323493LC56B-E/ST Datasheet

Current PartRFQ

93LC56BT-E/ST

Microchip TechnologyIn Stock: 140393LC56BT-E/ST Datasheet

DirectRFQ

BR93L56RFVT-WE2

Rohm SemiconductorIn Stock: 1660BR93L56RFVT-WE2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 93LC56B-E/ST is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

• Memory Size: 2Kbit
• Memory Organization: 128 x 16
• Memory Interface: Microwire
• Clock Frequency: 2 MHz
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Mounting Type: Surface Mount
• Memory Format: EEPROM
• Memory Type: Non-Volatile

Allowable Variation Parameters:

• Supply Voltage Range: Substitute must support the minimum 2.5V requirement of the main part
• Operating Temperature Range: Substitute must support the minimum -40°C lower bound of the main part
• Write Cycle Time: Substitute may be equal to or faster than the main part specification
• Packaging Format: Tube, Cut Tape (CT) & Digi-Reel®, or Tape & Reel (TR) formats are interchangeable for the same device

Identified substitutes maintain full electrical and mechanical compatibility within these constraints.

Parameter Comparison

Engineering Selection Recommendations

93LC56BT-E/ST (Microchip Technology)

This substitute maintains identical electrical specifications and operating parameters to the main part 93LC56B-E/ST. The primary distinction is packaging format: 93LC56BT-E/ST is supplied in Cut Tape (CT) & Digi-Reel® format versus Tube format for the main part. Both devices are manufactured by Microchip Technology, carry Active product status, and hold ROHS3 compliance with MSL 1 rating. Selection of this substitute is appropriate when Cut Tape or Digi-Reel® packaging is required for automated assembly processes.

BR93L56RFVT-WE2 (Rohm Semiconductor)

This substitute is manufactured by Rohm Semiconductor and meets the core functional requirements of 2Kbit EEPROM with Microwire interface in 8-TSSOP package. The device exhibits the following parameter variations: write cycle time of 5ms (faster than the 6ms main part specification), extended lower supply voltage limit of 1.8V (versus 2.5V for the main part), and reduced upper operating temperature limit of 85°C (versus 125°C for the main part). This substitute is suitable for applications where the reduced operating temperature range and lower minimum supply voltage do not present constraints. All three devices maintain Active status, ROHS3 compliance, and MSL 1 rating.

Frequently Asked Questions (FAQ)

Q: Can 93LC56BT-E/ST be used as a direct replacement for 93LC56B-E/ST?

A: Yes. Both devices are manufactured by Microchip Technology and share identical electrical and mechanical specifications. The difference is packaging format: 93LC56BT-E/ST uses Cut Tape (CT) & Digi-Reel® format while 93LC56B-E/ST uses Tube format. Functional performance and pin configuration are equivalent.

Q: What are the limitations of BR93L56RFVT-WE2 as a substitute?

A: The BR93L56RFVT-WE2 has two parameter constraints: maximum operating temperature of 85°C (compared to 125°C for the main part) and minimum supply voltage of 1.8V (compared to 2.5V for the main part). Applications requiring operation above 85°C or with supply voltages below 2.5V cannot use this substitute. The write cycle time is 5ms, which is faster than the 6ms specification of the main part and presents no compatibility issue.

Q: Are all three parts pin-compatible?

A: Yes. All three devices use the 8-TSSOP package with 0.173" width and 4.40mm dimensions. Pin configuration and signal assignments are compatible across 93LC56B-E/ST, 93LC56BT-E/ST, and BR93L56RFVT-WE2.

Q: What is the difference between 8-TSSOP and 8-TSSOP-B packages?

A: Both designations refer to the same physical 8-pin thin shrink small outline package with identical dimensions (0.173", 4.40mm width). The "-B" suffix used by Rohm Semiconductor indicates their specific package variant designation but maintains full mechanical and electrical compatibility with the standard 8-TSSOP specification.

Q: Which substitute should be selected for high-temperature applications?

A: For applications requiring operation above 85°C, only 93LC56BT-E/ST maintains the full -40°C to 125°C operating range of the main part 93LC56B-E/ST. BR93L56RFVT-WE2 is limited to -40°C to 85°C and is not suitable for high-temperature environments.

Q: Are all three parts RoHS3 compliant?

A: Yes. All three devices carry ROHS3 compliance certification and REACH unaffected status, meeting current environmental and regulatory requirements for electronic components.