93LC46BT-E/ST EEPROM Equivalent & Substitute Parts

Part Overview

The 93LC46BT-E/ST is a 1Kbit non-volatile EEPROM memory IC manufactured by Microchip Technology, featuring Microwire serial interface protocol and operating at 2 MHz clock frequency. This device is housed in an 8-TSSOP surface mount package and is actively supported for new designs. The part is ROHS3 compliant with unlimited moisture sensitivity rating.

Finding equivalent and substitute parts becomes necessary when managing supply chain continuity, addressing component obsolescence, or optimizing inventory across multiple suppliers. This reference provides engineering-validated alternatives based on strict electrical and mechanical compatibility parameters.

Substiute Parts

93LC46BT-E/ST
Microchip TechnologyIn Stock: 85693LC46BT-E/ST Datasheet
93LC46BT-E/ST
Current Part
BR93L46RFV-WE2
Rohm SemiconductorIn Stock: 2895BR93L46RFV-WE2 Datasheet
BR93L46RFV-WE2
MFR Recommended

Key Parameters

Parameter Value
Memory Type Non-Volatile EEPROM
Memory Size 1Kbit
Memory Organization 64 x 16
Memory Interface Microwire
Clock Frequency 2 MHz
Write Cycle Time 6ms
Supply Voltage Range 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C
Package Type 8-TSSOP (0.173", 4.40mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitution validity for the 93LC46BT-E/ST is determined by the following critical parameters:

Memory Capacity & Organization: All substitute parts must maintain 1Kbit capacity with 64 x 16 organization to ensure firmware and application compatibility without code modification.

Serial Interface Protocol: The Microwire interface is mandatory. Parts using alternative protocols (SPI, I2C) are not direct substitutes despite similar memory capacity.

Clock Frequency: 2 MHz operation is required for timing-critical applications. Substitutes must support this frequency specification.

Package & Pinout: The 8-TSSOP package with 0.173" width and 4.40mm dimensions defines the physical footprint. Package variants (8-SSOP-B, 8-LSSOP) with identical pin assignments and spacing are acceptable substitutes.

Voltage Supply Range: The 2.5V ~ 5.5V range establishes system compatibility. Substitutes with equal or wider voltage ranges are acceptable.

Operating Temperature Range: The -40°C ~ 125°C specification defines environmental operating limits. Substitutes with equal or wider temperature ranges are acceptable.

Compliance & Certifications: ROHS3 compliance and unlimited MSL rating ensure regulatory and manufacturing process compatibility.

Parameter Comparison

Parameter 93LC46BT-E/ST (Main) BR93L46RFV-WE2 (Substitute) Compatibility
Manufacturer Microchip Technology Rohm Semiconductor Different manufacturer
Memory Size 1Kbit 1Kbit Match
Memory Organization 64 x 16 64 x 16 Match
Memory Interface Microwire Microwire Match
Clock Frequency 2 MHz 2 MHz Match
Write Cycle Time 6ms 5ms Substitute faster
Supply Voltage Range 2.5V ~ 5.5V 1.8V ~ 5.5V Substitute wider range
Operating Temperature -40°C ~ 125°C -40°C ~ 85°C Main part wider range
Package Type 8-TSSOP 8-LSSOP Different package variant
RoHS Status ROHS3 Compliant ROHS3 Compliant Match
Product Status Active Not For New Designs Main part actively supported

Engineering Selection Recommendations

Primary Selection: The 93LC46BT-E/ST remains the recommended choice for new designs due to its active product status and extended operating temperature range (-40°C ~ 125°C), providing broader environmental compatibility.

Substitute Consideration: The BR93L46RFV-WE2 is electrically compatible for applications within the -40°C ~ 85°C temperature window. This substitute offers faster write cycle time (5ms vs 6ms) and extended low-voltage operation (1.8V minimum vs 2.5V minimum). However, the "Not For New Designs" status indicates Rohm Semiconductor is transitioning this part away from active production support.

Package Compatibility: Both parts use 8-pin TSSOP/LSSOP packages with identical pinout and 4.40mm width. PCB layout modifications are not required for package substitution, though mechanical clearance verification is recommended due to minor package profile differences.

Compliance Alignment: Both parts maintain ROHS3 compliance and unlimited MSL rating, ensuring regulatory and manufacturing process compatibility across supply chain transitions.

Frequently Asked Questions (FAQ)

Q: Can BR93L46RFV-WE2 be used as a direct replacement for 93LC46BT-E/ST in existing designs?

A: Yes, for applications operating within -40°C ~ 85°C temperature range. The parts are electrically and functionally equivalent with identical memory capacity, organization, interface protocol, and clock frequency. Package dimensions are compatible. Verify your application's maximum operating temperature requirement before substitution.

Q: What is the difference between 8-TSSOP and 8-LSSOP packages?

A: Both are 8-pin surface mount packages with 0.173" width and 4.40mm body length. TSSOP (Thin Shrink Small Outline Package) and LSSOP (Leadless Small Outline Package) differ in lead configuration and profile height. Pin spacing and electrical connectivity are identical. Verify PCB footprint compatibility with your design tools before layout finalization.

Q: Why is BR93L46RFV-WE2 marked "Not For New Designs"?

A: This designation indicates Rohm Semiconductor is discontinuing active production and design support for this part. While existing inventory may be available, the manufacturer recommends using 93LC46BT-E/ST for new product development to ensure long-term supply chain stability and continued technical support.

Q: Are there voltage supply differences between these parts?

A: Yes. The 93LC46BT-E/ST operates from 2.5V ~ 5.5V, while BR93L46RFV-WE2 operates from 1.8V ~ 5.5V. The substitute supports lower minimum voltage, making it suitable for battery-powered or low-voltage applications. Both support standard 3.3V and 5V logic levels.

Q: What is the impact of the 1ms write cycle time difference?

A: BR93L46RFV-WE2 completes write operations 1ms faster (5ms vs 6ms). This provides marginal performance improvement in applications performing frequent EEPROM writes. For most applications, this difference is negligible. Verify your application's write timing requirements before selecting based on this parameter.

Q: Can these parts be used interchangeably in production without design changes?

A: Electrical and functional interchangeability is confirmed for applications within the overlapping temperature range (-40°C ~ 85°C). No firmware or software modifications are required. Physical PCB layout remains compatible. Verify component sourcing and supply chain continuity with your supplier before committing to production transitions.

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