93C66CT-I/MS EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93C66CT-I/MS is a 4Kbit non-volatile EEPROM memory IC manufactured by Microchip Technology, featuring Microwire serial interface protocol. This component is designed for applications requiring persistent data storage with low power consumption and reliable long-term retention. The device operates across industrial temperature ranges (-40°C to 85°C) and is actively supported in production. Substitute parts are identified when equivalent electrical specifications and mechanical compatibility allow direct replacement in circuit designs, particularly when addressing supply chain availability, packaging preferences, or operational parameter requirements.

Substiute Parts

93C66CT-I/MS

Microchip TechnologyIn Stock: 113993C66CT-I/MS Datasheet

Current PartRFQ

M93C66-WDW6TP

STMicroelectronicsIn Stock: 105244M93C66-WDW6TP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 93C66CT-I/MS is determined by strict alignment of core electrical and mechanical parameters. The following criteria establish valid substitute relationships:

Primary Substitution Criteria:

• Memory capacity: 4Kbit (non-negotiable)
• Memory organization: 512 x 8 or 256 x 16 configuration
• Serial interface protocol: Microwire standard
• Non-volatile EEPROM technology
• Surface mount packaging category
• Operating temperature range: -40°C to 85°C minimum
• Supply voltage compatibility within specified ranges
• RoHS3 compliance status

The M93C66-WDW6TP qualifies as a direct substitute based on matching memory specifications, Microwire interface protocol, identical memory organization, surface mount technology, and equivalent environmental operating conditions. Both devices maintain ROHS3 compliance and active product status, ensuring long-term availability and regulatory alignment.

Parameter Comparison

Engineering Selection Recommendations

Both the 93C66CT-I/MS and M93C66-WDW6TP maintain active product status with ROHS3 compliance, ensuring regulatory alignment and sustained manufacturing support. The M93C66-WDW6TP offers extended supply voltage compatibility (2.5V to 5.5V versus 4.5V to 5.5V), providing operational flexibility in systems with variable power delivery. The STMicroelectronics device operates at 2 MHz clock frequency with 5ms write cycle time, compared to the Microchip device's 3 MHz and 2ms specifications. Selection between these parts depends on circuit-level timing requirements and PCB layout constraints, as the package footprints differ (8-MSOP at 3.00mm width versus 8-TSSOP at 4.40mm width). Both devices support identical memory organization and Microwire protocol implementation.

Frequently Asked Questions (FAQ)

Q: Can the M93C66-WDW6TP directly replace the 93C66CT-I/MS in existing designs?

A: Direct replacement is possible when circuit timing specifications accommodate the M93C66-WDW6TP's 2 MHz clock frequency and 5ms write cycle time. PCB layout modifications are required due to package footprint differences (8-MSOP versus 8-TSSOP). Verify that the 2.5V to 5.5V supply voltage range of the substitute aligns with your system's power delivery architecture.

Q: What are the key differences between these two parts?

A: The primary differences are clock frequency (3 MHz versus 2 MHz), write cycle time (2ms versus 5ms), supply voltage range (4.5V-5.5V versus 2.5V-5.5V), and package dimensions (8-MSOP 3.00mm versus 8-TSSOP 4.40mm). Memory capacity, organization, interface protocol, and operating temperature range are identical.

Q: Are both parts suitable for industrial temperature applications?

A: Yes. Both the 93C66CT-I/MS and M93C66-WDW6TP operate across the -40°C to 85°C temperature range, meeting industrial application requirements.

Q: What packaging considerations apply when substituting these parts?

A: The 93C66CT-I/MS uses 8-MSOP packaging (0.118" width, 3.00mm), while the M93C66-WDW6TP uses 8-TSSOP packaging (0.173" width, 4.40mm). PCB footprint redesign is necessary for physical compatibility. Both are surface mount technologies suitable for automated assembly.

Q: Do both parts maintain equivalent compliance certifications?

A: Yes. Both devices are ROHS3 compliant and REACH unaffected, with identical ECCN (EAR99) and HTSUS classifications, ensuring regulatory equivalence for procurement and deployment.