93AA76C-I/ST EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 93AA76C-I/ST is an 8Kbit EEPROM memory integrated circuit manufactured by Microchip Technology. This non-volatile memory device operates via the Microwire serial interface protocol at 3 MHz clock frequency and supports supply voltages from 1.8V to 5.5V. The component is housed in an 8-TSSOP surface mount package and maintains an active product status with full RoHS3 compliance.

Substitute parts are identified when equivalent electrical specifications, memory capacity, interface protocol, and physical packaging dimensions are maintained across alternative manufacturers. This ensures functional interchangeability in circuit designs without requiring layout or firmware modifications.

Substiute Parts

93AA76C-I/ST

Microchip TechnologyIn Stock: 75093AA76C-I/ST Datasheet

Current PartRFQ

BR93G76FVT-3GE2

Rohm SemiconductorIn Stock: 910BR93G76FVT-3GE2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 93AA76C-I/ST is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide 8Kbit total capacity with 1K x 8 or 512 x 16 organization to maintain data structure compatibility.

Serial Interface Protocol: The Microwire interface specification is mandatory. The substitute must support identical signal timing and protocol sequencing.

Clock Frequency: Operation at 3 MHz ensures timing compatibility with existing circuit designs and firmware implementations.

Write Cycle Performance: The 5ms write cycle time must be maintained to preserve system performance characteristics.

Supply Voltage Range: The substitute must operate within the 1.8V to 5.5V range to ensure compatibility with existing power supply designs. Voltage ranges that do not fully encompass this specification are not acceptable.

Temperature Operating Range: The -40°C to 85°C specification must be met or exceeded to maintain reliability across the intended application environment.

Physical Package: The 8-TSSOP package with 0.173" (4.40mm) width is required for PCB footprint compatibility. Package variants designated as 8-TSSOP-B maintain dimensional equivalence.

Compliance Standards: RoHS3 compliance and MSL 1 rating are required to meet regulatory and manufacturing requirements.

Parameter Comparison

Engineering Selection Recommendations

The BR93G76FVT-3GE2 manufactured by Rohm Semiconductor qualifies as a functional substitute for the 93AA76C-I/ST based on equivalence across all critical electrical and mechanical parameters.

Voltage Supply Consideration: The BR93G76FVT-3GE2 specifies a minimum supply voltage of 1.7V compared to the 93AA76C-I/ST minimum of 1.8V. In applications operating at or below 1.75V, the Microchip part remains the required selection. For applications operating at 1.8V and above, both parts are functionally equivalent.

Packaging: Both components utilize 8-TSSOP surface mount packages with identical 0.173" (4.40mm) width dimensions. The 8-TSSOP-B designation for the Rohm part indicates a package variant that maintains PCB footprint compatibility.

Compliance & Reliability: Both parts maintain ROHS3 compliance, MSL 1 moisture sensitivity rating, and identical operating temperature specifications. No compliance or reliability trade-offs exist between the two options.

Product Status: Both components carry active product status, ensuring continued availability and manufacturing support.

Frequently Asked Questions (FAQ)

Q: Can the BR93G76FVT-3GE2 be used as a direct replacement in all applications using the 93AA76C-I/ST?

A: The BR93G76FVT-3GE2 is functionally equivalent for applications where the supply voltage remains at 1.8V or higher. Applications operating below 1.8V require the original 93AA76C-I/ST due to the lower minimum voltage specification of the Rohm part.

Q: Are there any firmware or software modifications required when substituting the BR93G76FVT-3GE2?

A: No firmware modifications are required. Both parts implement identical Microwire protocol timing, clock frequency, and write cycle characteristics. The serial interface and data structure are fully compatible.

Q: Do the 8-TSSOP and 8-TSSOP-B packages have the same PCB footprint?

A: Yes. The 8-TSSOP-B variant maintains the same 0.173" (4.40mm) width and pin spacing as the standard 8-TSSOP package. PCB layouts designed for either package type are interchangeable.

Q: What is the significance of the MSL 1 rating for both parts?

A: MSL 1 (Moisture Sensitivity Level 1) indicates unlimited shelf life without moisture bake-out requirements. Both parts can be stored and handled using standard manufacturing practices without special moisture control procedures.

Q: Are both parts RoHS3 compliant?

A: Yes. Both the 93AA76C-I/ST and BR93G76FVT-3GE2 meet ROHS3 compliance requirements, ensuring compatibility with modern manufacturing and environmental regulations.

Q: What is the difference between Microwire and SPI interfaces mentioned in the part descriptions?

A: The BR93G76FVT-3GE2 description references SPI, but the detailed specifications confirm Microwire protocol operation. Both parts use the Microwire serial interface standard at 3 MHz. The terminology difference reflects manufacturer documentation conventions and does not indicate functional differences.