89HT0816PZABCI Equivalent & Substitute Parts

Part Overview

The 89HT0816PZABCI is a Signal Retimer Interface IC manufactured by Renesas Electronics Corporation, housed in a 196-CABGA (15x15) package. This specialized interface component is designed for signal retiming applications requiring I2C communication. The part is currently classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations where similar functionality is required.

Key Parameters

Parameter	Value
Manufacturer Part Number	89HT0816PZABCI
Manufacturer	Renesas Electronics Corporation
Category	Interface
Description	IC INTFACE SPECIALIZED 196CABGA
Package / Case	196-BGA
Supplier Device Package	196-CABGA (15x15)
Mounting Type	Surface Mount
Interface	I2C
Product Status	Obsolete
RoHS Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Substitute Part Grouping Explanation

Substitution for the 89HT0816PZABCI is determined by the following critical parameters:

Category: Interface components
Interface Type: I2C communication capability
Mounting Type: Surface Mount
Package Classification: BGA or equivalent high-pin-count packages
Product Status: Active alternatives preferred over obsolete designs
Compliance: RoHS3 compliance status and REACH unaffected designation

The substitute parts listed below are grouped based on their ability to fulfill signal retiming and interface functions within the constraints of modern component availability and regulatory compliance. Each substitute maintains interface compatibility through I2C or equivalent serial communication protocols and surface mount assembly requirements.

Parameter Comparison

Parameter	89HT0816PZABCI	AD7569JPZ	ADP5586ACBZ-01-R7	PI3HDX511DZLEX	TXS02326AMRGER	Z85C3010PSG
Manufacturer	Renesas Electronics	Analog Devices Inc.	Analog Devices Inc.	Diodes Incorporated	Texas Instruments	Zilog
Category	Interface	Data Acquisition	Interface	Interface	Interface	Interface
Package / Case	196-BGA	28-LCC (J-Lead)	16-UFBGA, WLCSP	30-WFQFN Exposed Pad	24-VFQFN Exposed Pad	40-DIP
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Through Hole
Interface	I2C	-	I2C	-	I2C	Bus
Product Status	Obsolete	Active	Active	Active	Active	Active
RoHS Status	RoHS non-compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	1 (Unlimited)	1 (Unlimited)	2 (1 Year)	1 (Unlimited)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected
ECCN	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99

Engineering Selection Recommendations

Primary Substitutes for Active Production:

The ADP5586ACBZ-01-R7, PI3HDX511DZLEX, and TXS02326AMRGER are recommended as primary substitutes due to their active product status and ROHS3 compliance. These parts offer improved moisture sensitivity ratings (MSL 1 or 2) compared to the original part's MSL 3 specification, providing superior reliability in storage and handling.

Secondary Considerations:

The AD7569JPZ maintains MSL 3 rating equivalent to the original part but offers active product status and ROHS3 compliance. The Z85C3010PSG provides through-hole mounting as an alternative assembly option, though this represents a significant package change from the original surface mount BGA configuration.

Compliance Advantage:

All substitute parts listed are ROHS3 compliant, addressing the non-compliance status of the obsolete 89HT0816PZABCI. This compliance improvement is critical for new designs and systems requiring adherence to current environmental and regulatory standards.

Frequently Asked Questions (FAQ)

Q: Why is the 89HT0816PZABCI obsolete?

A: The 89HT0816PZABCI is classified as obsolete by Renesas Electronics Corporation. Substitute parts are necessary for system maintenance, repair, and new design implementations where signal retiming interface functionality is required.

Q: What are the key differences between the main part and substitute options?

A: The primary differences are package size, pin count, and compliance status. The original 196-CABGA package is replaced by smaller packages (16-WLCSP, 24-VQFN, 30-TQFN) in active substitutes. All substitutes offer ROHS3 compliance versus the original's non-compliance status. Interface capability (I2C support) is maintained in ADP5586ACBZ-01-R7 and TXS02326AMRGER.

Q: Can I use a through-hole package substitute instead of surface mount?

A: The Z85C3010PSG offers through-hole mounting (40-DIP), but this represents a significant departure from the original surface mount BGA assembly method. PCB layout and assembly process changes would be required. Surface mount substitutes (ADP5586ACBZ-01-R7, PI3HDX511DZLEX, TXS02326AMRGER) maintain compatibility with the original assembly approach.

Q: What does MSL rating mean for component selection?

A: Moisture Sensitivity Level (MSL) indicates how long a component can be exposed to moisture before soldering. MSL 1 (unlimited) provides the longest shelf life, while MSL 3 (168 hours) requires more careful handling. Substitutes with MSL 1 or 2 offer improved storage flexibility compared to the original MSL 3 specification.

Q: Are all substitute parts RoHS compliant?

A: Yes. All listed substitute parts are ROHS3 compliant, whereas the original 89HT0816PZABCI is RoHS non-compliant. This compliance improvement is mandatory for new designs and systems subject to environmental regulations.

Q: Which substitute maintains I2C interface compatibility?

A: The ADP5586ACBZ-01-R7 and TXS02326AMRGER both support I2C interface, matching the original part's communication protocol. The PI3HDX511DZLEX and Z85C3010PSG provide alternative interface types (HDMI redriver/level shifter and bus interface, respectively) suitable for different application requirements.

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