89HT0816PYBBCI Signal Retimer Interface Equivalent & Substitute Parts

Part Overview

The 89HT0816PYBBCI is a specialized signal retimer interface IC manufactured by Renesas Electronics Corporation in a 196-CABGA (15x15) package. This component is classified as an obsolete product, indicating it is no longer in active production. The part operates as a signal retimer with I2C interface capability and is designed for applications requiring signal conditioning and retiming functionality. Due to its obsolete status, identifying functionally equivalent substitute components is essential for ongoing system support, redesigns, and new product development where signal retiming functionality is required.

Substiute Parts

89HT0816PYBBCI

Renesas Electronics CorporationIn Stock: 89289HT0816PYBBCI Datasheet

Current PartRFQ

DP83822HFRHBR

Texas InstrumentsIn Stock: 100454DP83822HFRHBR Datasheet

MFR RecommendedRFQ

MAX7349ATG+T

Analog Devices Inc./Maxim IntegratedIn Stock: 3578MAX7349ATG+T Datasheet

MFR RecommendedRFQ

MAX7365EWA70+T

Analog Devices Inc./Maxim IntegratedIn Stock: 827MAX7365EWA70+T Datasheet

MFR RecommendedRFQ

PI3HDX1204EZLEX

Diodes IncorporatedIn Stock: 2851PI3HDX1204EZLEX Datasheet

MFR RecommendedRFQ

PI4MSD5V9544ALEX

Diodes IncorporatedIn Stock: 2279PI4MSD5V9544ALEX Datasheet

MFR RecommendedRFQ

PTN3361BBS,518

NXP USA Inc.In Stock: 4869PTN3361BBS,518 Datasheet

MFR RecommendedRFQ

PTN3392BS/F2,518

NXP USA Inc.In Stock: 1092PTN3392BS/F2,518 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the 89HT0816PYBBCI is determined by the following critical parameters: functional application category (Interface), control interface type (I2C), mounting type (Surface Mount), and product status (Active vs. Obsolete). The substitute parts listed have been identified based on their capability to perform signal interface and retiming functions with I2C control compatibility. Substitutes are grouped by their primary application focus and package technology, which affects PCB layout and thermal management considerations.

The key substitution criteria are:

• Functional category: Interface or specialized signal conditioning
• Control interface: I2C compatibility
• Mounting type: Surface Mount
• Product status: Active (preferred for new designs)
• RoHS and REACH compliance status

Parameter Comparison

Engineering Selection Recommendations

Selection of substitute parts for the 89HT0816PYBBCI should prioritize components with Active product status to ensure long-term availability and manufacturing support. Among the listed substitutes, MAX7349ATG+T, MAX7365EWA70+T, PI3HDX1204EZLEX, PTN3361BBS,518, and DP83822HFRHBR maintain Active status and full RoHS3 compliance with REACH Unaffected designation, making them suitable for new designs and long-term production environments.

For applications requiring I2C control interface compatibility, MAX7349ATG+T, MAX7365EWA70+T, PTN3361BBS,518, and PTN3392BS/F2,518 are directly compatible. The MAX7365EWA70+T offers the widest voltage supply range (1.62V ~ 3.6V) and unlimited MSL rating, providing flexibility for diverse operating conditions. PTN3361BBS,518 combines I2C interface with active product status and specialized video shifter functionality for DVI v1.0 and HDMI v1.4b applications.

PI3HDX1204EZLEX provides HDMI redriver and level shifter functionality with active status, though it operates at fixed 3.3V supply. DP83822HFRHBR offers Ethernet interface capability with MII and RMII support for network-oriented applications. PI4MSD5V9544ALEX, while in Last Time Buy status, provides multiplexer functionality with the widest voltage range (1.65V ~ 5.5V) for flexible system integration.

PTN3392BS/F2,518 shares obsolete status with the original part and should be avoided for new designs despite its I2C interface compatibility.

Frequently Asked Questions (FAQ)

Q: Why is the 89HT0816PYBBCI listed as obsolete? A: The 89HT0816PYBBCI has reached end-of-life status with Renesas Electronics Corporation and is no longer manufactured. Existing inventory may be available through authorized distributors, but long-term supply cannot be guaranteed.

Q: What are the primary differences between the substitute parts? A: Substitute parts differ in package size, voltage supply range, specific interface protocols, and application focus. DP83822HFRHBR targets Ethernet applications with MII/RMII interfaces. MAX7349ATG+T and MAX7365EWA70+T are optimized for audio and mobile device applications with I2C control. PI3HDX1204EZLEX specializes in HDMI redriver functionality. PTN3361BBS,518 and PTN3392BS/F2,518 are video level shifters for DVI and HDMI standards.

Q: Can I directly replace the 89HT0816PYBBCI with any of these substitutes? A: Direct replacement depends on your specific application requirements. All listed substitutes are Surface Mount interface components with I2C control capability, but they differ in package footprint, pin configuration, voltage requirements, and functional specialization. PCB layout modifications and firmware adjustments may be necessary.

Q: Which substitute offers the best long-term availability? A: MAX7349ATG+T, MAX7365EWA70+T, and PTN3361BBS,518 maintain Active product status with full RoHS3 compliance and REACH Unaffected designation, ensuring continued manufacturing support and supply chain stability.

Q: What is the significance of MSL (Moisture Sensitivity Level) ratings? A: MSL ratings indicate how long a component can be exposed to ambient moisture before soldering. The 89HT0816PYBBCI has MSL 4 (72 hours), requiring careful handling. Most substitutes have MSL 1 or 2, providing more relaxed storage and handling requirements, which reduces manufacturing risk.

Q: Are all substitutes RoHS3 compliant? A: Yes, all listed substitute parts are RoHS3 compliant and REACH Unaffected, meeting current environmental and regulatory requirements for electronics manufacturing.

Q: What package considerations should I evaluate? A: The original part uses 196-BGA (15x15), a large ball grid array package. Substitutes range from compact 20-TSSOP to 48-VFQFN packages. Smaller packages reduce PCB footprint but may require different thermal management strategies. Larger BGA packages like 25-WLCSP in MAX7365EWA70+T offer improved thermal performance in compact form factors.