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Equivalent & Substitute Parts for 89HT0816PYBBCG8
Part Overview
The 89HT0816PYBBCG8 is a Signal Retimer Interface IC manufactured by Renesas Electronics Corporation in a 196-CABGA (15x15) package. This specialized interface component is designed for signal retiming applications utilizing I2C communication protocol. The product is currently classified as obsolete, making equivalent and substitute parts necessary for ongoing system support, redesigns, and new production requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 89HT0816PYBBCG8 |
| Manufacturer | Renesas Electronics Corporation |
| Category | Interface |
| Package / Case | 196-BGA |
| Supplier Device Package | 196-CABGA (15x15) |
| Mounting Type | Surface Mount |
| Interface Type | I2C |
| Applications | Signal Retimer |
| Product Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS Code | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution for the 89HT0816PYBBCG8 is determined by the following critical parameters:
Primary Substitution Criteria:
- Interface Type: I2C communication protocol
- Category: Interface specialized IC
- Mounting Type: Surface Mount
- REACH and ECCN compliance alignment
- Product Status: Active (preferred for new designs)
Secondary Compatibility Factors:
- Package form factor and pin count compatibility
- Voltage supply range requirements
- Moisture Sensitivity Level (MSL) rating
- RoHS compliance status
The substitute parts listed below are grouped by their functional capability to replace the signal retimer interface function while maintaining I2C protocol compatibility. Due to the obsolete status of the main part and the specialized 196-CABGA package, direct pin-for-pin replacements are limited. The substitute parts represent active, commercially available alternatives that fulfill the interface and I2C communication requirements.
Parameter Comparison
| Part Number | Manufacturer | Package / Case | Interface | Product Status | MSL Rating | RoHS Status | REACH Status | ECCN |
|---|---|---|---|---|---|---|---|---|
| 89HT0816PYBBCG8 | Renesas Electronics | 196-BGA | I2C | Obsolete | 3 (168 Hours) | Not specified | REACH Unaffected | EAR99 |
| ADP5585ACBZ-01-R7 | Analog Devices Inc. | 16-UFBGA, WLCSP | I2C | Active | 1 (Unlimited) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| ADP5585ACPZ-00-R7 | Analog Devices Inc. | 16-WFQFN Exposed Pad, CSP | I2C | Active | 3 (168 Hours) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| ADP5585ACPZ-03-R7 | Analog Devices Inc. | 16-WFQFN Exposed Pad, CSP | I2C | Active | 3 (168 Hours) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| LM8325DGR8-1/NOPB | Texas Instruments | 25-TFBGA, CSPBGA | I2C | Active | 1 (Unlimited) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| LM8327JGR8X/NOPB | Texas Instruments | 36-TFBGA | I2C | Active | 1 (Unlimited) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| LTC4306CGN#TRPBF | Analog Devices Inc. | 24-SSOP (0.154", 3.90mm Width) | SMBus (2-Wire/I2C) | Active | 1 (Unlimited) | ROHS3 Compliant | REACH Unaffected | EAR99 |
| LTC4317CDHC#PBF | Analog Devices Inc. | 16-WFDFN Exposed Pad | I2C | Active | 1 (Unlimited) | ROHS3 Compliant | REACH Unaffected | EAR99 |
Engineering Selection Recommendations
All substitute parts listed maintain compliance with REACH regulations and EAR99 export classification, matching the regulatory profile of the original 89HT0816PYBBCG8. The following selection criteria apply:
For Active Production and New Designs: Prioritize parts with Active product status and MSL 1 (Unlimited) rating: ADP5585ACBZ-01-R7, LM8325DGR8-1/NOPB, LM8327JGR8X/NOPB, LTC4306CGN#TRPBF, and LTC4317CDHC#PBF. These parts offer superior moisture handling characteristics and long-term availability assurance.
For Moisture-Sensitive Applications: ADP5585ACPZ-00-R7 and ADP5585ACPZ-03-R7 maintain MSL 3 (168 Hours) rating equivalent to the original part, suitable for applications with established moisture control protocols.
For I2C Protocol Compatibility: All listed substitutes support I2C or SMBus (2-Wire/I2C) communication, ensuring protocol-level compatibility with the original signal retimer interface function.
RoHS Compliance: All substitute parts are ROHS3 compliant, exceeding the compliance posture of the obsolete original part.
Frequently Asked Questions (FAQ)
Q: Can the 89HT0816PYBBCG8 be directly replaced with any of these substitute parts?
A: Direct pin-for-pin replacement is not possible due to significant package differences. The original part uses a 196-CABGA (15x15) package, while substitutes employ smaller BGA, WLCSP, LFCSP, SSOP, and DFN packages. System redesign and PCB layout modification are required for substitution.
Q: What is the primary reason for seeking substitutes for the 89HT0816PYBBCG8?
A: The original part is classified as obsolete, making it unavailable for new production and long-term supply. Substitute parts with Active product status ensure ongoing availability and manufacturing support.
Q: Are all substitute parts I2C compatible?
A: Yes. All listed substitutes support I2C protocol or SMBus (2-Wire/I2C), maintaining communication protocol compatibility with the original signal retimer interface application.
Q: What is the difference between MSL 1 and MSL 3 ratings?
A: MSL 1 (Unlimited) allows indefinite storage without moisture control requirements. MSL 3 (168 Hours) requires moisture control and limits storage to 168 hours after packaging opening. For new designs, MSL 1 parts are preferred for manufacturing flexibility.
Q: Do all substitute parts meet REACH and export compliance requirements?
A: Yes. All substitute parts maintain REACH Unaffected status and EAR99 export classification, matching the regulatory compliance of the original part.
Q: Which substitute part offers the closest functional match to the 89HT0816PYBBCG8?
A: LM8327JGR8X/NOPB and LM8325DGR8-1/NOPB from Texas Instruments are mobile communications interface parts with I2C protocol support and active product status. ADP5585 series parts from Analog Devices provide keypad and I/O expansion interface functionality with I2C support and multiple package options.
Q: Can package selection affect substitution feasibility?
A: Yes. Package selection is critical. Smaller packages (16-pin to 36-pin BGA/WLCSP/DFN) require significant PCB redesign compared to the original 196-pin BGA. Evaluate your PCB layout constraints and thermal requirements before selecting a substitute package.
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