89HT0808PYBAB8 Equivalent & Substitute Parts

Part Overview

The 89HT0808PYBAB8 is a specialized signal retimer interface IC manufactured by Renesas Electronics Corporation, designed for PCI Express (PCIe) applications. This component features a 100-pin fine-pitch ball grid array (100-CABGA 9x9) package and operates as a signal conditioning interface for high-speed PCIe signal paths. The product is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

89HT0808PYBAB8

Renesas Electronics CorporationIn Stock: 104089HT0808PYBAB8 Datasheet

Current PartRFQ

PM8564B-FEI

Microchip TechnologyIn Stock: 1238PM8564B-FEI Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the 89HT0808PYBAB8 is determined by the following critical parameters:

• Functional Category: Interface IC for PCIe signal conditioning
• Package Type: Surface mount ball grid array with 100-pin configuration
• Interface Protocol: PCIe-based signal retiming capability
• Control Interface: I2C management interface
• Moisture Sensitivity: MSL 4 classification
• Mounting Compatibility: Surface mount technology

The PM8564B-FEI from Microchip Technology qualifies as a substitute based on its classification as a specialized PCIe interface component with surface mount packaging and active product status. Both components serve the PCIe interface category and maintain equivalent moisture sensitivity ratings.

Parameter Comparison

Engineering Selection Recommendations

The PM8564B-FEI presents a viable alternative to the obsolete 89HT0808PYBAB8 based on the following engineering criteria:

• Product Status: The PM8564B-FEI maintains active product status with current manufacturing support, whereas the 89HT0808PYBAB8 is obsolete and subject to end-of-life constraints.
• Regulatory Compliance: The PM8564B-FEI carries ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory requirements for component procurement.
• Interface Compatibility: Both components operate within the PCIe interface category with surface mount deployment, supporting equivalent system-level integration approaches.
• Moisture Sensitivity Parity: Matching MSL 4 ratings ensure equivalent handling and storage requirements during manufacturing and assembly operations.

Selection of the PM8564B-FEI is appropriate for applications requiring PCIe interface functionality with active product lifecycle support and regulatory compliance documentation.

Frequently Asked Questions (FAQ)

Q: What is the primary reason for substituting the 89HT0808PYBAB8?

A: The 89HT0808PYBAB8 is classified as obsolete. The PM8564B-FEI is an active product with ongoing manufacturer support, making it suitable for new designs and systems requiring long-term component availability.

Q: Are the package configurations directly interchangeable?

A: The 89HT0808PYBAB8 uses a 100-CABGA (9x9) fine-pitch ball grid array package, while the PM8564B-FEI is specified as a module package. Physical footprint compatibility requires detailed mechanical and electrical verification against specific system requirements.

Q: Do both components share identical moisture sensitivity requirements?

A: Yes. Both the 89HT0808PYBAB8 and PM8564B-FEI are classified as MSL 4 (72 Hours), requiring equivalent handling, storage, and reflow procedures during assembly operations.

Q: What regulatory compliance advantages does the PM8564B-FEI offer?

A: The PM8564B-FEI carries ROHS3 compliance and REACH unaffected status, meeting current environmental regulations. The 89HT0808PYBAB8 compliance status is not specified in available documentation.

Q: Are control interface protocols compatible between these components?

A: The 89HT0808PYBAB8 specifies I2C interface capability, while the PM8564B-FEI is documented as PCI Express interface. System-level control architecture compatibility requires detailed functional specification review.