89HP0504PZBABGI Equivalent & Substitute Parts

Part Overview

The 89HP0504PZBABGI is a specialized interface IC manufactured by Renesas Electronics Corporation, designed for switch interfacing applications. This component operates as an active product with full ROHS3 compliance and is currently in stock with 947 units available. The device is packaged in a 100-CABGA (9x9) surface mount configuration and serves PCI Express interface requirements in switch interfacing applications. Alternative components may be required due to supply constraints, design optimization, or application-specific performance requirements.

Substiute Parts

89HP0504PZBABGI

Renesas Electronics CorporationIn Stock: 95789HP0504PZBABGI Datasheet

Current PartRFQ

PM8566B-FEI

Microchip TechnologyIn Stock: 1069PM8566B-FEI Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 89HP0504PZBABGI is determined by the following critical parameters:

• Interface Type: PCI Express compatibility
• Category: Specialized interface IC functionality
• Mounting Type: Surface mount capability
• Product Status: Active manufacturing status
• Compliance: ROHS3 and REACH compliance alignment
• Package Configuration: BGA package format with compatible pin count and pitch

The PM8566B-FEI qualifies as a manufacturer-recommended substitute based on matching interface protocol (PCI Express), active product status, surface mount configuration, and equivalent compliance certifications. Both components serve fanout and switch interfacing applications within PCI Express architectures.

Parameter Comparison

Engineering Selection Recommendations

Both the 89HP0504PZBABGI and PM8566B-FEI maintain active product status with equivalent ROHS3 and REACH compliance certifications, qualifying them for use in regulated applications. The primary distinction lies in moisture sensitivity level specifications: the 89HP0504PZBABGI operates at MSL 3 (168 hours), while the PM8566B-FEI operates at MSL 4 (72 hours). Selection between these components should be based on application environment conditions and PCB assembly process requirements. Both components support PCI Express interface protocols and surface mount assembly processes.

Frequently Asked Questions (FAQ)

Q: What determines compatibility between the 89HP0504PZBABGI and PM8566B-FEI?

A: Compatibility is established through matching interface protocol (PCI Express), equivalent product status (both active), identical mounting type (surface mount), and aligned compliance certifications (ROHS3 and REACH). Both components function as specialized interface ICs for switch interfacing applications.

Q: How does the moisture sensitivity level difference affect component selection?

A: The 89HP0504PZBABGI specifies MSL 3 with 168-hour floor life, while the PM8566B-FEI specifies MSL 4 with 72-hour floor life. MSL rating indicates the maximum time a component can remain outside controlled humidity conditions before assembly. Applications requiring extended handling times or storage in non-controlled environments may favor the higher MSL rating of the 89HP0504PZBABGI.

Q: Are package configurations interchangeable between these components?

A: Both components utilize BGA package formats suitable for surface mount assembly. The 89HP0504PZBABGI uses a 100-CABGA (9x9) configuration, while the PM8566B-FEI uses a module package format. PCB layout and footprint compatibility must be verified during design integration.

Q: What compliance certifications apply to both components?

A: Both the 89HP0504PZBABGI and PM8566B-FEI maintain ROHS3 compliance and REACH unaffected status, qualifying them for use in applications subject to European Union environmental regulations and equivalent international standards.