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TE Connectivity AMP Connectors 86147-8 Equivalent & Substitute Parts
Part Overview
The TE Connectivity AMP Connectors 86147-8 is a rectangular connector pin contact designed for PCB solder termination applications. This component is classified as a Pin Contact Gold Solder, PCB type within the AMPMODU Mod I series. The part maintains Active product status and is RoHS Compliant with MSL 1 (Unlimited) moisture sensitivity rating.
Substitute parts are identified when equivalent electrical and mechanical parameters align with the main part specifications, enabling direct functional replacement in applications requiring pin contact connectors with solder termination and gold finish specifications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 86147-8 |
| Manufacturer | TE Connectivity AMP Connectors |
| Category | Rectangular Connectors |
| Series | AMPMODU Mod I |
| Pin or Socket | Pin |
| Contact Termination | Solder, PCB |
| Contact Finish | Gold |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Packaging | Tape & Reel (TR) |
| Product Status | Active |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8536.90.4000 |
Substitute Part Grouping Explanation
Substitution eligibility for the TE Connectivity 86147-8 is determined by alignment of the following critical parameters:
Primary Substitution Criteria:
- Contact Termination Type: Solder termination capability
- Contact Finish: Gold plating
- Contact Finish Thickness: 30.0µin (0.76µm)
- Mounting Configuration: PCB-compatible through-hole or solder mounting
- Compliance Status: RoHS Compliant
- Moisture Sensitivity Level: MSL 1 (Unlimited)
- Packaging Format: Tape & Reel (TR)
The substitute part 75481-023LF (Amphenol ICC/FCI Bergpin® series) satisfies these criteria through equivalent solder termination, gold contact finish at 30.0µin thickness, RoHS compliance, MSL 1 rating, and TR packaging. Both parts function as pin contacts for PCB applications with matching electrical and environmental specifications.
Parameter Comparison
| Parameter | TE Connectivity 86147-8 | Amphenol ICC 75481-023LF | Match Status |
|---|---|---|---|
| Contact Termination | Solder, PCB | Solder | Equivalent |
| Contact Finish | Gold | Gold | Equivalent |
| Contact Finish Thickness | 30.0µin (0.76µm) | 30.0µin (0.76µm) | Equivalent |
| Mounting Type | PCB Solder | Through Hole Solder | Compatible |
| Packaging | Tape & Reel (TR) | Tape & Reel (TR) | Equivalent |
| Product Status | Active | Active | Equivalent |
| RoHS Status | RoHS Compliant | RoHS Compliant | Equivalent |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Equivalent |
| ECCN | EAR99 | EAR99 | Equivalent |
| HTSUS | 8536.90.4000 | 8536.90.4000 | Equivalent |
Engineering Selection Recommendations
TE Connectivity 86147-8 (Primary Part)
Selection of the original TE Connectivity 86147-8 is appropriate for applications requiring AMPMODU Mod I series rectangular connectors. The part maintains Active product status with established supply chain availability (855 Pcs in stock). RoHS Compliance and MSL 1 rating support deployment in standard industrial and commercial PCB applications without moisture sensitivity constraints.
Amphenol ICC 75481-023LF (Substitute Part)
The Amphenol ICC 75481-023LF Bergpin® terminal serves as a functional equivalent for applications where rectangular pin contact connectors with solder termination are required. This substitute maintains identical contact finish specifications (30.0µin gold thickness), RoHS Compliance, and MSL 1 rating. Active product status and TR packaging ensure supply continuity and manufacturing compatibility. The substitute is suitable for direct replacement in PCB solder applications where pin contact geometry and termination method are the primary functional requirements.
Both parts satisfy identical compliance and environmental specifications (RoHS, MSL 1, ECCN EAR99, HTSUS 8536.90.4000), enabling selection based on availability, series compatibility requirements, and specific mechanical envelope constraints of the application.
Frequently Asked Questions (FAQ)
Q: What determines whether the Amphenol ICC 75481-023LF can substitute for the TE Connectivity 86147-8?
A: Substitution is based on matching contact termination type (solder), contact finish material (gold), contact finish thickness (30.0µin), mounting compatibility (PCB through-hole solder), packaging format (Tape & Reel), and compliance certifications (RoHS Compliant, MSL 1). Both parts satisfy these criteria.
Q: Are there differences in mechanical dimensions between these parts?
A: The TE Connectivity 86147-8 mechanical specifications are not detailed in the provided parameters. The Amphenol ICC 75481-023LF specifies 0.025" (0.64mm) square pin size, 0.345" (8.76mm) overall length, and 0.034" ~ 0.036" (0.86mm ~ 0.91mm) mounting hole diameter. Mechanical compatibility must be verified against application-specific PCB layout requirements.
Q: Do both parts have identical moisture sensitivity ratings?
A: Yes. Both the TE Connectivity 86147-8 and Amphenol ICC 75481-023LF carry MSL 1 (Unlimited) ratings, indicating no moisture sensitivity constraints for storage, handling, or deployment.
Q: Are both parts RoHS Compliant?
A: Yes. Both parts are RoHS Compliant and carry identical ECCN (EAR99) and HTSUS (8536.90.4000) classifications.
Q: What is the contact finish thickness specification for both parts?
A: Both parts specify 30.0µin (0.76µm) gold contact finish thickness, ensuring equivalent electrical contact properties and corrosion resistance.
Q: Can these parts be used interchangeably in production?
A: Interchangeability depends on application-specific requirements including series compatibility (AMPMODU Mod I vs. Bergpin®), mechanical envelope constraints, and connector housing specifications. Electrical and environmental specifications are equivalent; mechanical fit must be confirmed for the specific application.
Q: What is the packaging format for both parts?
A: Both parts are supplied in Tape & Reel (TR) packaging format, supporting automated assembly processes and standard component handling procedures.
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