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Equivalent & Substitute Parts for 8302AMILF
Part Overview
The 8302AMILF is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas, designed for 1:2 clock distribution at frequencies up to 200 MHz. This device operates with LVCMOS and LVTTL input/output logic levels and is housed in an 8-SOIC package. The part is classified as obsolete, necessitating identification of active substitute components that maintain functional and electrical compatibility for new designs and production continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 8302AMILF |
| Manufacturer | Renesas |
| Category | Clock/Timing |
| Type | Fanout Buffer (Distribution) |
| Number of Circuits | 1 |
| Ratio - Input:Output | 1:2 |
| Frequency - Max | 200 MHz |
| Input Logic | LVCMOS, LVTTL |
| Output Logic | LVCMOS, LVTTL |
| Voltage - Supply | 3.135V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitute parts for the 8302AMILF are identified based on the following critical parameters that determine functional compatibility:
Core Electrical Parameters:
- Fanout Buffer (Distribution) type with 1:2 input-to-output ratio
- Maximum frequency of 200 MHz
- Single circuit configuration
- Operating temperature range of -40°C to 85°C
Logic Level Compatibility:
- Input and output logic levels must support LVCMOS and/or LVTTL standards
Supply Voltage Consideration:
- The 8302AMILF operates at 3.135V ~ 3.465V. Substitute parts with wider supply voltage ranges (such as 1.71V ~ 3.465V) remain compatible when operated within the original part's specified voltage window.
Package and Mounting:
- Surface mount technology is required. Package form factors may differ (8-SOIC versus 8-UFDFN) based on design requirements and PCB layout constraints.
Two substitute parts meet these criteria: the NB3M8302CDG (parametric equivalent in the same 8-SOIC package) and the 5PB1102CMGI8 (functional equivalent in a smaller 8-UFDFN package).
Parameter Comparison
| Parameter | 8302AMILF (Main) | NB3M8302CDG (Substitute) | 5PB1102CMGI8 (Substitute) |
|---|---|---|---|
| Manufacturer | Renesas | onsemi | Renesas Electronics Corporation |
| Type | Fanout Buffer (Distribution) | Fanout Buffer (Distribution) | Fanout Buffer (Distribution) |
| Number of Circuits | 1 | 1 | 1 |
| Ratio - Input:Output | 1:2 | 1:2 | 1:2 |
| Frequency - Max | 200 MHz | 200 MHz | 200 MHz |
| Input Logic | LVCMOS, LVTTL | LVCMOS, LVTTL | LVCMOS |
| Output Logic | LVCMOS, LVTTL | LVCMOS, LVTTL | LVCMOS |
| Voltage - Supply | 3.135V ~ 3.465V | 3.135V ~ 3.465V | 1.71V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-UFDFN (2x2) |
| Product Status | Obsolete | Active | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
NB3M8302CDG (onsemi): This part is a parametric equivalent to the 8302AMILF, offering identical electrical specifications and the same 8-SOIC package footprint. The NB3M8302CDG is in active production status with ROHS3 compliance and unlimited moisture sensitivity level (MSL 1). This substitute is suitable for designs requiring direct package compatibility and no PCB layout modifications. The part is available in tube packaging with 1129 units in stock.
5PB1102CMGI8 (Renesas Electronics Corporation): This part is a functional equivalent that maintains all critical electrical parameters (1:2 fanout, 200 MHz maximum frequency, -40°C to 85°C operating range) while offering a smaller 8-UFDFN (2x2) package footprint. The 5PB1102CMGI8 supports LVCMOS logic levels and operates across a wider supply voltage range (1.71V ~ 3.465V). This substitute is in active production with ROHS3 compliance and MSL 1 rating. The part is available in cut tape and digi-reel packaging with 18900 units in stock. Selection of this part requires PCB layout redesign to accommodate the different package form factor.
Both substitutes provide compliance improvements over the obsolete 8302AMILF through ROHS3 certification and active product status, ensuring long-term availability and supply chain stability.
Frequently Asked Questions (FAQ)
Q: Can the NB3M8302CDG be used as a direct replacement for the 8302AMILF without PCB modifications?
A: Yes. The NB3M8302CDG maintains identical electrical specifications and uses the same 8-SOIC package footprint as the 8302AMILF. No PCB layout changes are required for this substitution.
Q: What is the primary advantage of the 5PB1102CMGI8 over the NB3M8302CDG?
A: The 5PB1102CMGI8 uses a smaller 8-UFDFN (2x2) package, reducing board space requirements. It also operates across a wider supply voltage range (1.71V ~ 3.465V) compared to the fixed 3.135V ~ 3.465V range of the other parts. However, this substitution requires PCB redesign.
Q: Are both substitute parts RoHS compliant?
A: Yes. Both the NB3M8302CDG and 5PB1102CMGI8 are ROHS3 compliant, whereas the original 8302AMILF is RoHS non-compliant. This represents a compliance improvement for new designs.
Q: Do the substitute parts support LVTTL logic levels?
A: The NB3M8302CDG supports both LVCMOS and LVTTL logic levels, matching the original 8302AMILF. The 5PB1102CMGI8 supports LVCMOS logic levels only. If LVTTL compatibility is required, the NB3M8302CDG is the appropriate selection.
Q: What is the maximum frequency specification for all three parts?
A: All three parts (8302AMILF, NB3M8302CDG, and 5PB1102CMGI8) support a maximum frequency of 200 MHz for clock distribution applications.
Q: Are there any differences in operating temperature ranges between the parts?
A: No. All three parts operate across the identical temperature range of -40°C to 85°C.
Q: What packaging formats are available for the substitute parts?
A: The NB3M8302CDG is supplied in tube packaging. The 5PB1102CMGI8 is available in cut tape (CT) and digi-reel packaging formats.
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