TE Connectivity 8080-1G1 Transistor Socket Equivalent & Substitute Parts

Part Overview

The TE Connectivity 8080-1G1 is a 4-position transistor socket for TO-3 packages, featuring tin-lead contact finish and through-hole mounting. This component is classified as obsolete, making identification of equivalent and substitute parts essential for ongoing system support and procurement planning. The 8080-1G1 utilizes beryllium copper contacts with fluoropolymer housing and operates across the industrial temperature range of -55°C to 125°C. Due to its obsolete status and non-compliance with current RoHS regulations, alternative components from the same manufacturer series are available to support legacy system maintenance and new design implementations.

Substiute Parts

8080-1G1

TE Connectivity AMP ConnectorsIn Stock: 13178080-1G1 Datasheet

Current PartRFQ

8080-1G1-LF

TE Connectivity AMP ConnectorsIn Stock: 14168080-1G1-LF Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution within the TE Connectivity 8080 series is determined by compatibility across the following critical parameters:

Mandatory Compatibility Parameters:

• Manufacturer series (8080)
• Package type (TO-3 transistor socket)
• Contact material (beryllium copper)
• Operating temperature range (-55°C to 125°C)
• Termination method (solder)
• Housing material classification (fluoropolymer-based)

Variable Parameters Allowing Substitution:

• Number of positions (4-position to 3-position)
• Contact position geometry (round to oval)
• Contact finish composition (tin-lead to tin)
• Mounting configuration (through-hole to chassis mount)
• Product status (obsolete to active)
• Regulatory compliance (RoHS non-compliant to RoHS3 compliant)

The 8080-1G1-LF substitute part maintains core electrical and thermal characteristics while offering improved regulatory compliance and active product status. Position count and geometry differences are accommodated within the TO-3 package standard, and contact finish variations remain compatible with standard solder assembly processes.

Parameter Comparison

Engineering Selection Recommendations

For Legacy System Maintenance: The 8080-1G1 remains available in inventory (1283 pieces) for direct replacement in existing applications. This part maintains the original design specifications and is suitable for repair and maintenance of systems already deployed with this component.

For New Designs and Compliance-Driven Applications: The 8080-1G1-LF is the recommended selection for new implementations and systems requiring regulatory compliance. This substitute offers active product status, RoHS3 compliance, and REACH unaffected designation, ensuring long-term availability and regulatory alignment. The substitute is currently manufactured and maintains 1388 pieces in inventory.

Substitution Feasibility: Direct substitution requires evaluation of the following design-specific factors:

• Position count requirement (4-position versus 3-position)
• Contact position geometry (round versus oval)
• Mounting configuration (through-hole versus chassis mount)
• Lead-free solder process compatibility (tin-lead versus tin finish)

Both parts share identical operating temperature ranges, contact materials, and termination methods, establishing a common foundation for substitution analysis. The choice between these parts depends on specific application requirements regarding position count, mounting method, and regulatory compliance status.

Frequently Asked Questions (FAQ)

Q: Can the 8080-1G1-LF directly replace the 8080-1G1 in all applications?

A: Direct replacement requires verification of three design parameters: the application must accommodate 3 positions instead of 4, accept oval contact geometry instead of round, and support chassis mount configuration instead of through-hole mounting. The electrical and thermal characteristics are compatible across both parts.

Q: What is the significance of the contact finish change from tin-lead to tin?

A: The tin finish on the 8080-1G1-LF eliminates lead content, enabling compliance with RoHS3 and REACH regulations. Both finishes are compatible with standard solder assembly processes. The 8080-1G1-LF specifies a contact finish thickness of 200.0µin (5.08µm), providing defined performance parameters.

Q: Why does the 8080-1G1-LF have fewer positions than the main part?

A: The 8080-1G1-LF is a 3-position variant within the same TO-3 package family. Position count is determined by the specific application requirements. Both parts maintain the same package interface standard and operating characteristics.

Q: Is the 8080-1G1 still available for procurement?

A: The 8080-1G1 is classified as obsolete but remains available in inventory (1283 pieces). For new designs and long-term supply assurance, the active 8080-1G1-LF is the recommended selection.

Q: What is the difference between through-hole and chassis mount configurations?

A: Through-hole mounting inserts termination posts directly into PCB holes for vertical board integration. Chassis mount configuration attaches to external mounting surfaces. Application PCB design and mechanical layout determine which configuration is appropriate.

Q: Are both parts suitable for the full -55°C to 125°C operating range?

A: Yes. Both the 8080-1G1 and 8080-1G1-LF are rated for identical operating temperature ranges of -55°C to 125°C, ensuring thermal compatibility across industrial and extended temperature applications.

Q: What does RoHS3 compliance mean for the 8080-1G1-LF?

A: RoHS3 compliance indicates the 8080-1G1-LF meets current European Union Restriction of Hazardous Substances regulations, restricting lead, cadmium, mercury, and other specified substances. This designation is required for many commercial and industrial applications sold in regulated markets.

Q: Can the 8080-1G1-LF be used in applications originally designed for the 8080-1G1?

A: Substitution is possible only when the application design accommodates the differences in position count (3 versus 4), contact geometry (oval versus round), and mounting type (chassis mount versus through-hole). Electrical and thermal performance remain equivalent.