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Amphenol ICC 76314-115 Equivalent & Substitute Parts
Part Overview
The Amphenol ICC 76314-115 is a 30-position receptacle connector with 0.100" (2.54mm) pitch, designed for through-hole PCB mounting with gold-plated mating contacts. This BergCon® series connector features a push-pull fastening mechanism and is rated for UL94 V-0 flammability. The part is currently obsolete, making equivalent substitutes necessary for ongoing production and maintenance applications requiring compatible 30-position, 0.100" pitch receptacle connectors with board-to-board or cable interface capability.
Substiute Parts
Key Parameters
| Parameter | 76314-115 Specification |
|---|---|
| Connector Type | Receptacle |
| Contact Type | Female Socket |
| Number of Positions | 30 |
| Pitch - Mating | 0.100" (2.54mm) |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Material Flammability Rating | UL94 V-0 |
| Style | Board to Board or Cable |
Substitute Part Grouping Explanation
Substitution eligibility for the 76314-115 is determined by the following critical parameters: 30-position configuration, 0.100" (2.54mm) mating pitch, 2-row layout with 0.100" row spacing, through-hole solder termination, female socket contact type, push-pull fastening, and gold mating contact finish. All substitute parts must maintain these core electrical and mechanical specifications to ensure direct compatibility with existing PCB layouts and mating header connectors.
The substitute parts are grouped into two categories:
Category 1: Direct Receptacle Substitutes — Parts maintaining identical connector type (receptacle), contact configuration, and form factor. These include the Molex 0015445830 (C-Grid 71850 series) and TE Connectivity 6-147424-5 (AMPMODU Mod IV series).
Category 2: Elevated Socket Substitutes — Samtec ESD series parts (ESD-115-G-03, ESD-115-G-06, ESD-115-G-08, ESD-115-G-23, ESD-115-G-26, ESD-115-G-28, ESD-115-T-03) that maintain the 30-position, 0.100" pitch configuration but feature elevated socket design with varying contact post lengths. These accommodate different PCB stack-up requirements while preserving the core 30-position, 2.54mm pitch interface.
Parameter Comparison
| Parameter | 76314-115 | 0015445830 | 6-147424-5 | ESD-115-G-03 | ESD-115-G-06 | ESD-115-G-08 | ESD-115-G-23 | ESD-115-G-26 | ESD-115-G-28 | ESD-115-T-03 |
|---|---|---|---|---|---|---|---|---|---|---|
| Connector Type | Receptacle | Receptacle | Receptacle | Elevated Socket | Elevated Socket | Elevated Socket | Elevated Socket | Elevated Socket | Elevated Socket | Elevated Socket |
| Contact Type | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket | Female Socket |
| Number of Positions | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Number of Rows | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole |
| Termination | Solder | Solder | Solder | Solder | Solder | Solder | Solder | Solder | Solder | Solder |
| Fastening Type | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull |
| Contact Finish - Mating | Gold | Gold | Gold | Gold | Gold | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | 15.0µin (0.38µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) | 10.0µin (0.25µm) |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| Operating Temperature | Not specified | -40°C ~ 125°C | -65°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | RoHS Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Active | Active | Active | Active |
Engineering Selection Recommendations
Direct Receptacle Substitutes (Molex 0015445830, TE Connectivity 6-147424-5): These parts maintain the standard receptacle form factor identical to the 76314-115. Both are active products with RoHS compliance and UL94 V-0 flammability rating. The Molex 0015445830 operates at -40°C to 125°C with 2.5A current rating and 500VAC voltage rating. The TE Connectivity 6-147424-5 operates at -65°C to 125°C with 2A current rating. Selection between these two depends on temperature range and current requirements of the application.
Elevated Socket Substitutes (Samtec ESD-115 Series): The Samtec ESD series provides elevated socket designs with varying contact post lengths (0.153", 0.215", 0.365") to accommodate different PCB stack-up configurations. All ESD variants operate at -55°C to 125°C with ROHS3 compliance and UL94 V-0 rating. The ESD-115-G variants feature gold post finish, while ESD-115-T-03 features tin post finish. Selection among ESD variants is determined by required contact post length for specific PCB assembly geometry.
For applications requiring direct form-factor compatibility with existing headers, use Molex 0015445830 or TE Connectivity 6-147424-5. For applications requiring elevated socket design with specific stack-up heights, select the appropriate Samtec ESD-115 variant based on contact post length specification.
Frequently Asked Questions (FAQ)
Q: Can the Samtec ESD-115 series directly replace the 76314-115 in existing assemblies?
A: The Samtec ESD-115 series maintains the 30-position, 0.100" pitch mating interface and is electrically compatible. However, the elevated socket design alters the physical form factor and PCB mounting profile. Compatibility depends on PCB layout and available stack-up space. Direct mechanical interchangeability is not guaranteed without PCB redesign.
Q: What is the difference between ESD-115-G and ESD-115-T variants?
A: The primary difference is contact post finish. ESD-115-G variants feature gold post finish, while ESD-115-T-03 features tin post finish. Both maintain identical mating contact gold finish and electrical performance.
Q: How do I select the correct Samtec ESD-115 variant by contact post length?
A: Samtec ESD-115 variants are designated by contact post length: ESD-115-G-03 (0.153"), ESD-115-G-06 (0.215"), ESD-115-G-08 (0.365"), ESD-115-G-23 (0.115"), ESD-115-G-26 (0.215"), ESD-115-G-28 (0.365"), and ESD-115-T-03 (0.153"). Select the variant matching your PCB assembly stack-up requirement.
Q: Are all substitute parts RoHS compliant?
A: Yes. All substitute parts listed (Molex 0015445830, TE Connectivity 6-147424-5, and all Samtec ESD-115 variants) are RoHS compliant. The original 76314-115 is RoHS non-compliant.
Q: What is the temperature operating range difference between substitutes?
A: The 76314-115 does not specify operating temperature. Substitute parts operate within: Molex 0015445830 (-40°C to 125°C), TE Connectivity 6-147424-5 (-65°C to 125°C), and all Samtec ESD-115 variants (-55°C to 125°C). Select based on application temperature requirements.
Q: Can I use the Molex 0015445830 or TE Connectivity 6-147424-5 as a direct drop-in replacement?
A: Both the Molex 0015445830 and TE Connectivity 6-147424-5 maintain the standard receptacle form factor and are mechanically compatible with existing 0.100" pitch headers. They are suitable for direct PCB layout compatibility without modification.
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