74LVTH574DB,112 Equivalent & Substitute Parts

Part Overview

The 74LVTH574DB,112 is a D-type flip-flop logic integrated circuit manufactured by NXP USA Inc., designed for 8-bit positive edge-triggered applications. This component features tri-state, non-inverted outputs and operates across a 2.7V to 3.6V supply voltage range with a maximum clock frequency of 150 MHz. The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements.

Substiute Parts

74LVTH574DB,112
NXP USA Inc.In Stock: 90374LVTH574DB,112 Datasheet
74LVTH574DB,112
Current Part
74LVT574MTCX
onsemiIn Stock: 214174LVT574MTCX Datasheet
74LVT574MTCX
MFR Recommended
74LVTH574MTCX
onsemiIn Stock: 421274LVTH574MTCX Datasheet
74LVTH574MTCX
MFR Recommended
SN74LVTH574DB
Texas InstrumentsIn Stock: 1677SN74LVTH574DB Datasheet
SN74LVTH574DB
MFR Recommended
SN74LVTH574DBR
Texas InstrumentsIn Stock: 3285SN74LVTH574DBR Datasheet
SN74LVTH574DBR
MFR Recommended
SN74LVTH574IPWREP
Texas InstrumentsIn Stock: 691SN74LVTH574IPWREP Datasheet
SN74LVTH574IPWREP
MFR Recommended
SN74LVTH574PW
Texas InstrumentsIn Stock: 956SN74LVTH574PW Datasheet
SN74LVTH574PW
MFR Recommended
SN74LVTH574PWR
Texas InstrumentsIn Stock: 5447SN74LVTH574PWR Datasheet
SN74LVTH574PWR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 74LVTH574DB,112
Manufacturer NXP USA Inc.
Category Logic
Description IC FF D-TYPE SNGL 8BIT 20SSOP
Type D-Type Flip Flop
Number of Elements 1
Number of Bits per Element 8
Output Type Tri-State, Non-Inverted
Clock Frequency 150 MHz
Trigger Type Positive Edge
Voltage - Supply 2.7V ~ 3.6V
Current - Output High, Low 32mA, 64mA
Current - Quiescent (Iq) 190 µA
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 20-SSOP (0.209", 5.30mm Width)
Mounting Type Surface Mount
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the 74LVTH574DB,112 is determined by strict equivalence across the following critical parameters:

Functional Requirements:

  • D-Type flip-flop architecture with 1 element and 8 bits per element
  • Tri-state, non-inverted output configuration
  • Positive edge trigger mechanism
  • 150 MHz clock frequency capability

Electrical Requirements:

  • 2.7V to 3.6V supply voltage range
  • 32mA output high current and 64mA output low current
  • 190 µA quiescent current
  • Operating temperature range of -40°C to 85°C

Physical & Compliance Requirements:

  • Surface mount technology
  • ROHS3 compliance
  • MSL 1 (Unlimited) moisture sensitivity level

Substitute parts are grouped into two package categories: 20-SSOP (0.209", 5.30mm Width) and 20-TSSOP (0.173", 4.40mm Width). Both package types maintain electrical equivalence while offering different physical footprints for PCB layout optimization.

Parameter Comparison

Parameter 74LVTH574DB,112 (NXP) 74LVT574MTCX (onsemi) 74LVTH574MTCX (onsemi) SN74LVTH574DB (TI) SN74LVTH574DBR (TI) SN74LVTH574IPWREP (TI) SN74LVTH574PW (TI) SN74LVTH574PWR (TI)
Type D-Type D-Type D-Type D-Type D-Type D-Type D-Type D-Type
Number of Elements 1 1 1 1 1 1 1 1
Number of Bits per Element 8 8 8 8 8 8 8 8
Output Type Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted
Clock Frequency 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz
Trigger Type Positive Edge Positive Edge Positive Edge Positive Edge Positive Edge Positive Edge Positive Edge Positive Edge
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Current - Output High, Low 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA
Current - Quiescent (Iq) 190 µA 190 µA 190 µA 190 µA 190 µA 190 µA 190 µA 190 µA
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 20-SSOP (0.209", 5.30mm) 20-TSSOP (0.173", 4.40mm) 20-TSSOP (0.173", 4.40mm) 20-SSOP (0.209", 5.30mm) 20-SSOP (0.209", 5.30mm) 20-TSSOP (0.173", 4.40mm) 20-TSSOP (0.173", 4.40mm) 20-TSSOP (0.173", 4.40mm)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Obsolete Last Time Buy Last Time Buy Active Active Active Active Active

Engineering Selection Recommendations

For 20-SSOP Package Compatibility:

SN74LVTH574DB and SN74LVTH574DBR from Texas Instruments are direct package-compatible substitutes with active product status. Both maintain identical electrical specifications and ROHS3 compliance. SN74LVTH574DBR offers tape and reel packaging for high-volume production, while SN74LVTH574DB is available in tube packaging for lower-volume applications.

For 20-TSSOP Package Compatibility:

SN74LVTH574PWR, SN74LVTH574PW, and SN74LVTH574IPWREP from Texas Instruments provide equivalent functionality in a smaller 20-TSSOP footprint. All three maintain active product status and full ROHS3 compliance. SN74LVTH574PWR offers the highest inventory availability in tape and reel format.

For onsemi Alternatives:

74LVTH574MTCX and 74LVT574MTCX from onsemi provide functional equivalence with last-time-buy product status. Both are available in 20-TSSOP packaging and maintain ROHS3 compliance. The 74LVTH574MTCX maintains the 74LVTH series designation, while 74LVT574MTCX operates under the 74LVT series with marginally improved propagation delay characteristics.

Recommended Priority:

Texas Instruments SN74LVTH574 series parts are preferred due to active product status, ensuring long-term availability and continued manufacturing support. For new designs requiring the original 20-SSOP footprint, SN74LVTH574DBR is the optimal selection. For designs accommodating the smaller 20-TSSOP package, SN74LVTH574PWR provides superior inventory availability and active lifecycle status.

Frequently Asked Questions (FAQ)

Q: Can I use a 20-TSSOP package substitute in place of the original 20-SSOP package?

A: No. While 20-TSSOP and 20-SSOP packages are electrically equivalent, they have different physical dimensions and PCB footprints. 20-TSSOP (0.173", 4.40mm width) is narrower than 20-SSOP (0.209", 5.30mm width). PCB layout and land pattern modifications are required for package substitution.

Q: What is the difference between 74LVTH574MTCX and 74LVT574MTCX?

A: Both parts are functionally equivalent with identical electrical specifications. The primary difference is the series designation: 74LVTH574MTCX maintains the 74LVTH series, while 74LVT574MTCX operates under the 74LVT series. Both are manufactured by onsemi and are available in 20-TSSOP packaging with last-time-buy product status.

Q: Why is the original 74LVTH574DB,112 marked as obsolete?

A: The NXP USA Inc. 74LVTH574DB,112 has reached end-of-life status. Active alternatives from Texas Instruments and onsemi provide equivalent functionality with ongoing manufacturing support and availability.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity level, matching the original part's environmental and regulatory certifications.

Q: Which substitute offers the best propagation delay performance?

A: Texas Instruments SN74LVTH574 series parts (SN74LVTH574DB, SN74LVTH574DBR, SN74LVTH574IPWREP, SN74LVTH574PW, SN74LVTH574PWR) deliver 4.5ns maximum propagation delay at 3.3V with 50pF load. The onsemi 74LVTH574MTCX achieves 4.6ns under identical conditions. The onsemi 74LVT574MTCX also achieves 4.6ns propagation delay.

Q: What packaging options are available for high-volume production?

A: For 20-SSOP footprint, SN74LVTH574DBR is supplied in tape and reel format. For 20-TSSOP footprint, SN74LVTH574PWR and 74LVTH574MTCX are available in tape and reel or cut tape with digi-reel packaging, suitable for automated assembly processes.

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