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74LVC574ADB,112 Equivalent & Substitute Parts
Part Overview
The 74LVC574ADB,112 is a D-type flip-flop logic integrated circuit manufactured by Nexperia USA Inc., featuring 1 element with 8-bit positive edge triggering in a 20-SSOP package. This component is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The 74LVC574 series provides standard D-type flip-flop functionality with tri-state, non-inverted outputs suitable for digital logic applications requiring edge-triggered data storage and bus interface capabilities.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 74LVC574ADB,112 |
| Manufacturer | Nexperia USA Inc. |
| Category | Logic |
| Series | 74LVC |
| Type | D-Type Flip-Flop |
| Number of Elements | 1 |
| Number of Bits per Element | 8 |
| Output Type | Tri-State, Non-Inverted |
| Clock Frequency | 200 MHz |
| Max Propagation Delay @ V, Max CL | 7ns @ 3.3V, 50pF |
| Trigger Type | Positive Edge |
| Current - Output High, Low | 24mA, 24mA |
| Voltage - Supply | 1.65V ~ 3.6V |
| Current - Quiescent (Iq) | 10 µA |
| Input Capacitance | 5 pF |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package / Case | 20-SSOP (0.209", 5.30mm Width) |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the 74LVC574ADB,112 is determined by the following critical parameters:
Functional Equivalence Requirements:
- D-Type flip-flop architecture with 1 element, 8-bit configuration
- Positive edge trigger mechanism
- Tri-state, non-inverted output capability
- Supply voltage range compatibility (1.65V ~ 3.6V minimum overlap)
- Output drive capability (24mA minimum for both high and low states)
Performance Compatibility Criteria:
- Clock frequency of 150 MHz or higher
- Maximum propagation delay of 7ns or less @ 3.3V, 50pF load
- Quiescent current of 10 µA or lower
- Operating temperature range of -40°C to 125°C minimum
Package Considerations:
- Primary substitutes use 20-TSSOP (0.173", 4.40mm Width) package, which is mechanically compatible with PCB footprints designed for 20-SSOP through appropriate layout adaptation
- Alternative package options (20-TFSOP, 20-TVSOP) available from specific manufacturers
- All substitute parts maintain surface mount technology
Compliance and Availability:
- ROHS3 compliance required
- Active product status preferred for long-term availability
- Moisture sensitivity level 1 (unlimited) preferred for manufacturing flexibility
Parameter Comparison
| Parameter | 74LVC574ADB,112 (Main) | 74LVC574APW,118 | 74LVC574AT20-13 | 74LCX574FT | CLVC574AQPWRG4Q1 | SN74LVC574ADBR | SN74LVC574APWR | SN74LVC574APWT |
|---|---|---|---|---|---|---|---|---|
| Manufacturer | Nexperia USA Inc. | NXP Semiconductors | Diodes Incorporated | Toshiba Semiconductor | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Series | 74LVC | 74LVC | 74LVC | 74LCX | 74LVC | 74LVC | 74LVC | 74LVC |
| Type | D-Type | D-Type | D-Type | D-Type | D-Type | D-Type | D-Type | D-Type |
| Number of Bits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Output Type | Tri-State, Non-Inverted | Tri-State, Non-Inverted | Non-Inverted | Tri-State, Non-Inverted | Tri-State, Non-Inverted | Tri-State, Non-Inverted | Tri-State, Non-Inverted | Tri-State, Non-Inverted |
| Clock Frequency | 200 MHz | 200 MHz | 125 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| Max Propagation Delay @ 3.3V | 7ns @ 50pF | 7ns @ 50pF | 7.1ns @ 30pF | 8.5ns @ 50pF | 7ns @ 50pF | 6.8ns @ 50pF | 6.8ns @ 50pF | 6.8ns @ 50pF |
| Trigger Type | Positive Edge | Positive Edge | Positive Edge | Positive Edge | Positive Edge | Positive Edge | Positive Edge | Positive Edge |
| Current - Output High, Low | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA | 24mA, 24mA |
| Voltage - Supply | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 2V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V |
| Current - Quiescent (Iq) | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA |
| Input Capacitance | 5 pF | 5 pF | 4 pF | 7 pF | 4 pF | 4 pF | 4 pF | 4 pF |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 85°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Package / Case | 20-SSOP (0.209", 5.30mm) | 20-TSSOP (0.173", 4.40mm) | 20-TSSOP (0.173", 4.40mm) | 20-TSSOP (0.173", 4.40mm) | 20-TSSOP (0.173", 4.40mm) | 20-SSOP (0.209", 5.30mm) | 20-TSSOP (0.173", 4.40mm) | 20-TSSOP (0.173", 4.40mm) |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | Not specified | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 3 (168 Hours) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Tier 1 - Direct Functional Equivalents (Recommended Primary Substitutes):
SN74LVC574APWR and SN74LVC574APWT from Texas Instruments are the primary recommended substitutes. Both parts maintain full functional equivalence with the 74LVC574ADB,112, offering active product status, ROHS3 compliance, MSL 1 rating, and superior propagation delay performance (6.8ns vs. 7ns). The 20-TSSOP package requires PCB footprint adaptation but provides equivalent electrical performance across all critical parameters. SN74LVC574APWR offers the highest inventory availability (237,968 units) in cut tape and digi-reel packaging.
Tier 2 - Package-Compatible Alternatives:
SN74LVC574ADBR from Texas Instruments maintains the original 20-SSOP package format, eliminating PCB layout modifications. This part delivers active status, ROHS3 compliance, MSL 1 rating, and improved propagation delay (6.8ns). With 2,200 units in stock, this option is suitable for designs where package footprint compatibility is critical.
Tier 3 - Functional Equivalents with Parameter Variations:
74LVC574APW,118 from NXP Semiconductors provides active status and maintains the 74LVC series designation with 200 MHz clock frequency matching the original part. The 20-TSSOP package and 195,695-unit inventory support high-volume applications. CLVC574AQPWRG4Q1 from Texas Instruments offers automotive-grade qualification (AEC-Q100) with active status and ROHS3 compliance, suitable for automotive applications requiring enhanced reliability.
Tier 4 - Performance-Reduced Alternatives:
74LVC574AT20-13 from Diodes Incorporated and 74LCX574FT from Toshiba Semiconductor provide functional D-type flip-flop operation with reduced clock frequency specifications (125 MHz and 150 MHz respectively). These parts are suitable only for applications where the lower frequency performance is acceptable. 74LCX574FT operates to -40°C to 85°C, limiting use in extended temperature range applications.
Compliance Considerations:
All recommended substitutes maintain ROHS3 compliance and MSL 1 rating, ensuring compatibility with standard manufacturing processes. The automotive-qualified CLVC574AQPWRG4Q1 is restricted to applications requiring AEC-Q100 certification.
Frequently Asked Questions (FAQ)
Q: Can I use a 20-TSSOP package substitute in a design originally specified for 20-SSOP?
A: The 20-TSSOP and 20-SSOP packages have different physical dimensions (0.173" vs. 0.209" width). PCB footprint modification is required. However, both are 20-pin surface mount packages with identical pin configurations and electrical characteristics. Consult your PCB layout guidelines to confirm footprint compatibility before implementation.
Q: What is the difference between 74LVC574 and 74LCX574 series parts?
A: Both are D-type flip-flop logic circuits with 8-bit configuration. The 74LCX574FT operates at a lower maximum clock frequency (150 MHz vs. 200 MHz for 74LVC574) and has a reduced operating temperature range (-40°C to 85°C vs. -40°C to 125°C). Select 74LVC574 variants for applications requiring higher speed or extended temperature operation.
Q: Why is the 74LVC574ADB,112 marked as obsolete?
A: The original part is obsolete, meaning the manufacturer has discontinued production. Active substitute parts from multiple manufacturers (Texas Instruments, NXP Semiconductors, Diodes Incorporated, Toshiba Semiconductor) provide equivalent or superior functionality and are recommended for new designs and production continuity.
Q: Are all substitute parts ROHS3 compliant?
A: All recommended substitute parts listed are ROHS3 compliant. The 74LVC574APW,118 from NXP does not specify RoHS status in the provided data; confirm compliance with the manufacturer before use in RoHS-restricted applications.
Q: What does MSL 1 (Unlimited) mean for moisture sensitivity?
A: MSL 1 (Unlimited) indicates the component has unlimited shelf life under standard storage conditions without requiring special moisture control measures. Parts with MSL 3 (168 Hours) require more stringent moisture control and have a limited floor life of 168 hours after bag opening. MSL 1 parts are preferred for manufacturing flexibility and reduced storage complexity.
Q: Which substitute offers the best propagation delay performance?
A: SN74LVC574ADBR, SN74LVC574APWR, and SN74LVC574APWT all deliver 6.8ns maximum propagation delay @ 3.3V, 50pF load, which is superior to the original 7ns specification. These parts are suitable for timing-critical applications requiring faster data transfer.
Q: Can I use CLVC574AQPWRG4Q1 in non-automotive applications?
A: CLVC574AQPWRG4Q1 is automotive-qualified (AEC-Q100) and can be used in non-automotive applications. However, automotive-grade parts typically command a price premium. Use standard-grade alternatives (SN74LVC574APWR, SN74LVC574APWT) for cost-optimized non-automotive designs.
Q: What is the difference between cut tape, tube, and tape & reel packaging?
A: Cut tape (CT) and digi-reel packaging provide individual component strips for manual or semi-automated assembly. Tube packaging contains loose components for manual handling. Tape & reel (TR) packaging provides continuous component strips on reels for automated pick-and-place assembly. Select packaging based on your assembly process requirements and volume.
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