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74LVC374ADB,118 Equivalent & Substitute Parts
Part Overview
The 74LVC374ADB,118 is a D-Type flip-flop logic integrated circuit manufactured by Nexperia USA Inc., featuring 1 element with 8-bit parallel data storage capability. This component operates as a positive edge-triggered latch with tri-state, non-inverted outputs, designed for low-voltage CMOS applications. The part is currently listed as obsolete, making equivalent substitute parts necessary for ongoing production and maintenance applications. Substitute parts must maintain functional compatibility across clock frequency, propagation delay, voltage supply range, and output drive characteristics.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 74LVC374ADB,118 |
| Manufacturer | Nexperia USA Inc. |
| Base Product Number | 74LVC374 |
| Type | D-Type Flip Flop |
| Number of Elements | 1 |
| Number of Bits per Element | 8 |
| Output Type | Tri-State, Non-Inverted |
| Clock Frequency | 150 MHz |
| Max Propagation Delay @ 3.3V, 50pF | 7 ns |
| Trigger Type | Positive Edge |
| Voltage Supply Range | 1.65V ~ 3.6V |
| Current Output High/Low | 24 mA / 24 mA |
| Quiescent Current (Iq) | 10 µA |
| Input Capacitance | 4 pF |
| Operating Temperature Range | -40°C ~ 125°C |
| Package Type | 20-SSOP (0.209", 5.30mm Width) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitute parts for the 74LVC374ADB,118 are classified based on the following substitution criteria:
Primary Substitution Parameters:
- Base product number (74LVC374 or functionally equivalent 74LVC574)
- D-Type flip-flop architecture with 8-bit configuration
- Positive edge trigger operation
- Tri-state output capability
- Voltage supply range: 1.65V ~ 3.6V
- Output drive current: 24 mA minimum
- Operating temperature range compatibility
Package Compatibility Levels:
- Direct package match: 20-SSOP (0.209", 5.30mm Width)
- Alternate package: 20-TSSOP (0.173", 4.40mm Width) — physically smaller footprint, electrically equivalent
Functional Equivalence: Parts sharing the 74LVC374 base number maintain identical logic function and pin configuration. The 74LVC574 variant represents a parametric equivalent with functionally compatible output characteristics and timing specifications suitable for direct substitution in most applications.
Parameter Comparison
| Parameter | 74LVC374ADB,118 (Main) | 74LVC374APW,118 | 74LVC374AT20-13 | SN74LVC374ADBR | SN74LVC574ADBR |
|---|---|---|---|---|---|
| Manufacturer | Nexperia USA Inc. | Nexperia USA Inc. | Diodes Incorporated | Texas Instruments | Texas Instruments |
| Type | D-Type Flip Flop | D-Type Flip Flop | D-Type Flip Flop | D-Type Flip Flop | D-Type Flip Flop |
| Number of Bits | 8 | 8 | 8 | 8 | 8 |
| Output Type | Tri-State, Non-Inverted | Tri-State, Non-Inverted | Non-Inverted | Tri-State, Non-Inverted | Tri-State, Non-Inverted |
| Clock Frequency | 150 MHz | 150 MHz | 125 MHz | 100 MHz | 150 MHz |
| Max Propagation Delay @ 3.3V, 50pF | 7 ns | 7 ns | 6.8 ns | 7 ns | 6.8 ns |
| Voltage Supply Range | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V | 1.65V ~ 3.6V |
| Current Output High/Low | 24 mA / 24 mA | 24 mA / 24 mA | 24 mA / 24 mA | 24 mA / 24 mA | 24 mA / 24 mA |
| Quiescent Current (Iq) | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA |
| Input Capacitance | 4 pF | 4 pF | 4 pF | 4 pF | 4 pF |
| Operating Temperature Range | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 85°C | -40°C ~ 125°C |
| Package Type | 20-SSOP | 20-TSSOP | 20-TSSOP | 20-SSOP | 20-SSOP |
| Product Status | Obsolete | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 3 (168 Hours) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Tier 1 — Direct Package Substitutes (20-SSOP):
SN74LVC374ADBR (Texas Instruments) and 74LVC374ADB,118 share identical 20-SSOP packaging. SN74LVC374ADBR maintains active product status with full ROHS3 compliance and MSL-1 rating. Operating temperature range is limited to -40°C ~ 85°C compared to the main part's -40°C ~ 125°C specification. Clock frequency specification is 100 MHz versus 150 MHz for the main part. This substitute is suitable for applications where the reduced temperature range and clock frequency do not exceed system requirements.
Tier 2 — Alternate Package Substitutes (20-TSSOP):
74LVC374APW,118 (Nexperia USA Inc.) provides active product status with identical electrical specifications to the main part, including 150 MHz clock frequency and -40°C ~ 125°C operating range. The 20-TSSOP package is physically smaller (0.173" versus 0.209" width) and requires PCB layout modification. This substitute is recommended when space constraints permit package transition and board redesign is feasible.
74LVC374AT20-13 (Diodes Incorporated) offers active product status in 20-TSSOP packaging with 125 MHz clock frequency and 6.8 ns propagation delay. MSL rating is 3 (168 Hours) versus MSL-1 for the main part, requiring controlled moisture exposure during storage and assembly. This substitute is suitable for applications with relaxed clock frequency requirements and standard moisture handling procedures.
Tier 3 — Parametric Equivalent (20-SSOP):
SN74LVC574ADBR (Texas Instruments) represents a parametric equivalent with 74LVC574 base number, maintaining 20-SSOP package compatibility with the main part. This part offers 150 MHz clock frequency, 6.8 ns propagation delay, and -40°C ~ 125°C operating range. The 74LVC574 function is logically compatible with 74LVC374 in most applications. This substitute is suitable when functional equivalence is acceptable and active product availability is prioritized.
Compliance and Certification:
All substitute parts maintain ROHS3 compliance and REACH unaffected status. MSL-1 rated parts (74LVC374APW,118, SN74LVC374ADBR, SN74LVC574ADBR) require unlimited moisture protection. MSL-3 rated part (74LVC374AT20-13) requires controlled moisture exposure with 168-hour maximum floor life after bag opening.
Frequently Asked Questions (FAQ)
Q: Can 74LVC374APW,118 replace 74LVC374ADB,118 directly on the PCB?
A: Electrical substitution is direct. Physical substitution requires PCB layout modification due to package change from 20-SSOP to 20-TSSOP. Pin configuration remains identical; footprint dimensions differ (width 0.209" to 0.173").
Q: What is the impact of using SN74LVC374ADBR with -40°C ~ 85°C temperature range instead of -40°C ~ 125°C?
A: SN74LVC374ADBR is suitable only for applications where the maximum operating temperature does not exceed 85°C. Systems requiring operation above 85°C must use alternative substitutes with extended temperature range (74LVC374APW,118 or SN74LVC574ADBR).
Q: Is 74LVC374AT20-13 with MSL-3 rating acceptable for production assembly?
A: MSL-3 rating requires controlled moisture handling with maximum 168-hour floor life after bag opening. This part is acceptable if assembly processes comply with MSL-3 moisture control procedures. MSL-1 rated alternatives (74LVC374APW,118, SN74LVC374ADBR, SN74LVC574ADBR) eliminate moisture sensitivity constraints.
Q: What is the functional difference between 74LVC374 and 74LVC574?
A: Both are 8-bit D-Type flip-flops with identical pin counts and electrical characteristics. The 74LVC574 represents a parametric variant with equivalent tri-state output capability and timing performance. Substitution is functionally compatible in standard latch applications.
Q: Can I use 74LVC374AT20-13 with 125 MHz clock frequency in a 150 MHz system?
A: No. Clock frequency specification defines maximum operating speed. Using 74LVC374AT20-13 (125 MHz rated) in a 150 MHz system exceeds component specifications and may cause timing violations or functional failure.
Q: Which substitute offers the best availability and compliance profile?
A: 74LVC374APW,118 (Nexperia USA Inc.) offers active product status, full electrical equivalence to the main part, MSL-1 rating, and 7,718 units in stock. This part requires only package footprint redesign for implementation.
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