74LVC2G53GD,125 Equivalent & Substitute Parts

Part Overview

The 74LVC2G53GD,125 is a single-circuit SPDT (Single Pole Double Throw) analog switch manufactured by Nexperia USA Inc. in the 74LVC logic family. This interface component operates as a 2:1 multiplexer/demultiplexer with 10Ohm on-state resistance and is housed in an 8-XSON (2x3) surface mount package. The part is currently listed as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement.

Key Parameters

Parameter	Value
Manufacturer Part Number	74LVC2G53GD,125
Manufacturer	Nexperia USA Inc.
Series	74LVC
Product Status	Obsolete
Switch Circuit Type	SPDT
Multiplexer/Demultiplexer Configuration	2:1
Number of Circuits	1
On-State Resistance (Max)	10Ohm
Supply Voltage Range (V+)	1.65V ~ 5.5V
Switch Time (Ton, Toff) Max	3.8ns, 3.8ns
-3dB Bandwidth	300MHz
Charge Injection	7.5pC
Channel Capacitance (CS(off), CD(off))	6pF
Leakage Current (IS(off)) Max	5µA
Operating Temperature Range	-40°C ~ 125°C (TA)
Package / Case	8-XFDFN
Supplier Device Package	8-XSON (2x3)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution for the 74LVC2G53GD,125 is determined by strict equivalence across the following critical parameters:

Switch circuit type: SPDT
Multiplexer/demultiplexer configuration: 2:1
Number of circuits: 1
On-state resistance: 10Ohm maximum
Supply voltage range: 1.65V ~ 5.5V
Switch timing: 3.8ns maximum (Ton, Toff)
Bandwidth: 300MHz
Charge injection: 7.5pC
Channel capacitance: 6pF
Leakage current: 5µA maximum
Operating temperature: -40°C ~ 125°C
Series family: 74LVC
Mounting type: Surface mount

Substitute parts are grouped into two categories:

Direct Package Equivalents: Parts with identical or functionally equivalent 8-XSON package dimensions that maintain the same PCB footprint and assembly compatibility.

Parametric Equivalents: Parts with identical electrical specifications but different package variants (8-XSON with varying dimensions: 1.2x1, 1.35x1, 1.95x1). These require PCB layout adjustment but provide identical functional performance.

Parameter Comparison

Parameter	74LVC2G53GD,125	74LVC2G53DC,125	74LVC1G53GN,115	74LVC1G53GS,115	74LVC1G53GT,115	74LVC2G53GN,115	74LVC2G53GS,115	74LVC2G53GT,115
Manufacturer	Nexperia USA Inc.	NXP Semiconductors	Nexperia USA Inc.	NXP USA Inc.	Nexperia USA Inc.	Nexperia USA Inc.	NXP Semiconductors	NXP USA Inc.
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Active
Switch Circuit	SPDT	SPDT	SPDT	SPDT	SPDT	SPDT	SPDT	SPDT
Multiplexer Configuration	2:1	2:1	2:1	2:1	2:1	2:1	2:1	2:1
Number of Circuits	1	1	1	1	1	1	1	1
On-State Resistance (Max)	10Ohm	10Ohm	10Ohm	10Ohm	10Ohm	10Ohm	10Ohm	10Ohm
Supply Voltage (V+)	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V	1.65V ~ 5.5V
Switch Time (Ton, Toff) Max	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns	3.8ns, 3.8ns
-3dB Bandwidth	300MHz	300MHz	300MHz	300MHz	300MHz	300MHz	300MHz	300MHz
Charge Injection	7.5pC	7.5pC	7.5pC	7.5pC	7.5pC	7.5pC	7.5pC	7.5pC
Channel Capacitance (CS(off), CD(off))	6pF	6pF	6pF	6pF	6pF	6pF	6pF	6pF
Leakage Current (IS(off)) Max	5µA	5µA	5µA	5µA	5µA	5µA	5µA	5µA
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C
Package / Case	8-XFDFN	8-XFDFN	8-XFDFN	8-XFDFN	8-XFDFN	8-XFDFN	8-XFDFN	8-XFDFN
Supplier Device Package	8-XSON (2x3)	Bulk	8-XSON (1.2x1)	8-XSON (1.35x1)	8-XSON, SOT833-1 (1.95x1)	8-XSON (1.2x1)	8-XSON (1.35x1)	8-XSON (1.95x1)
Packaging Type	-	Bulk	Tape & Reel (TR)	Bulk	Tape & Reel (TR)	Tape & Reel (TR)	Bulk	Bulk
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	Not specified	ROHS3 Compliant	ROHS3 Compliant	Not specified	Not specified
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	Not specified	1 (Unlimited)	1 (Unlimited)	Not specified	Not specified
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected	Not specified	REACH Unaffected	REACH Unaffected	Not specified	Not specified

Engineering Selection Recommendations

Primary Substitute (Direct Replacement): 74LVC2G53DC,125 is the recommended primary substitute. Manufactured by NXP Semiconductors with active product status, this part maintains identical electrical specifications and package classification (8-XFDFN). It carries ROHS3 compliance and REACH unaffected status, matching the regulatory profile of the original part.

Secondary Substitutes (Parametric Equivalents with Package Variants): The 74LVC2G53GN,115, 74LVC2G53GS,115, and 74LVC2G53GT,115 are parametric equivalents with identical electrical performance but different 8-XSON package dimensions. These parts are suitable for new designs or redesigns where PCB layout can accommodate the alternative package footprints. All three maintain active product status and are available in higher inventory quantities.

Single-Circuit Alternatives: The 74LVC1G53GN,115, 74LVC1G53GS,115, and 74LVC1G53GT,115 are single-circuit variants within the same 74LVC family. These parts share identical electrical specifications and are suitable for applications requiring only one SPDT switch circuit. All three maintain active product status.

Compliance Considerations: Parts with specified ROHS3 compliance and REACH unaffected status (74LVC2G53DC,125, 74LVC2G53GN,115, 74LVC1G53GN,115, 74LVC1G53GT,115, 74LVC2G53GN,115) are preferred for regulated applications. Parts without specified compliance documentation should be evaluated against specific regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can I use 74LVC1G53 variants as direct replacements for 74LVC2G53GD,125?

A: The 74LVC1G53 variants (74LVC1G53GN,115, 74LVC1G53GS,115, 74LVC1G53GT,115) are parametric equivalents with identical electrical specifications. However, they are single-circuit devices, while the 74LVC2G53GD,125 is also a single-circuit device. Electrical compatibility is confirmed. PCB footprint compatibility depends on the specific 8-XSON package dimensions: 74LVC1G53GN,115 uses 1.2x1, 74LVC1G53GS,115 uses 1.35x1, and 74LVC1G53GT,115 uses 1.95x1 dimensions.

Q: What is the difference between 74LVC2G53GD,125 and 74LVC2G53DC,125?

A: Both parts are SPDT 2:1 multiplexer switches with identical electrical specifications (10Ohm on-state resistance, 3.8ns switching time, 300MHz bandwidth, 7.5pC charge injection, 6pF channel capacitance, 5µA leakage current). The primary difference is manufacturer designation and packaging format. 74LVC2G53DC,125 is manufactured by NXP Semiconductors with active product status, while 74LVC2G53GD,125 is obsolete. Both use 8-XFDFN package classification.

Q: Are there inventory or packaging differences I should consider?

A: Yes. The original 74LVC2G53GD,125 is obsolete with 1086 pieces in stock. Active substitutes have significantly higher inventory: 74LVC2G53DC,125 (6288 pcs), 74LVC2G53GS,115 (77347 pcs), and 74LVC2G53GT,115 (19665 pcs). Packaging formats vary: some are supplied in Tape & Reel (TR), others in Bulk. Confirm packaging requirements with your procurement process.

Q: Do all substitute parts meet the same regulatory standards?

A: Not all substitute parts have identical compliance documentation. 74LVC2G53DC,125, 74LVC2G53GN,115, 74LVC1G53GN,115, 74LVC1G53GT,115, and 74LVC2G53GN,115 specify ROHS3 compliance and REACH unaffected status. Other variants do not include this documentation in the provided specifications. For regulated applications, select parts with explicit compliance statements.

Q: What are the package dimension differences among the 74LVC2G53 variants?

A: All 74LVC2G53 variants use the 8-XFDFN package classification but with different 8-XSON dimensions: 74LVC2G53GD,125 uses 2x3, 74LVC2G53GN,115 uses 1.2x1, 74LVC2G53GS,115 uses 1.35x1, and 74LVC2G53GT,115 uses 1.95x1. These dimensional differences require PCB layout adjustment but do not affect electrical performance.

Q: Can I mix different substitute parts in the same design?

A: All substitute parts share identical electrical specifications and are functionally interchangeable. However, mixing parts with different 8-XSON package dimensions (1.2x1, 1.35x1, 1.95x1, 2x3) requires corresponding PCB layout variations. For manufacturing consistency, use a single part number across the design.

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