74LVC2G32GS,115 Equivalent & Substitute Parts

Part Overview

The 74LVC2G32GS,115 is a dual 2-input OR gate logic IC manufactured by Nexperia USA Inc. in an 8-XSON (1.35x1) surface mount package. This component operates across a wide supply voltage range of 1.65V to 5.5V and is designed for low-power logic applications requiring fast propagation delays. The part is currently in Active product status with 2236 units in stock. Substitute parts are necessary when the primary packaging format (Tape & Reel) is unavailable, when alternative manufacturers are preferred for supply chain optimization, or when different package dimensions are required for specific PCB layouts.

Substiute Parts

74LVC2G32GS,115

Nexperia USA Inc.In Stock: 233874LVC2G32GS,115 Datasheet

Current PartRFQ

74LVC2G32GD,125

Nexperia USA Inc.In Stock: 116874LVC2G32GD,125 Datasheet

Parametric EquivalentRFQ

74LVC2G32GF,115

NXP USA Inc.In Stock: 11906274LVC2G32GF,115 Datasheet

Parametric EquivalentRFQ

74LVC2G32GT,115

NXP SemiconductorsIn Stock: 45261474LVC2G32GT,115 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the 74LVC2G32GS,115 is determined by strict equivalence across the following critical parameters:

• Logic function: Dual 2-input OR gate
• Number of circuits and inputs: 2 circuits, 2 inputs per circuit
• Electrical specifications: Supply voltage range (1.65V ~ 5.5V), quiescent current (4 µA max), output current (32mA), input logic levels, and propagation delay (3.2ns @ 5V, 50pF)
• Operating temperature range: -40°C ~ 125°C
• Package type: 8-XFDFN (surface mount)
• Compliance: ROHS3 Compliant, REACH Unaffected, MSL Level 1

Substitute parts must maintain identical electrical performance and functional specifications. Variations in packaging format (Tape & Reel vs. Cut Tape vs. Bulk) and supplier device package dimensions (1.35x1 vs. 2x3) are permitted substitution variables, as these do not affect circuit-level performance.

Parameter Comparison

Engineering Selection Recommendations

74LVC2G32GF,115 is the primary recommended substitute. It maintains full electrical and functional equivalence to the 74LVC2G32GS,115 with identical package dimensions (8-XSON 1.35x1), operating specifications, and Active product status. The difference is packaging format (Bulk vs. Tape & Reel), which does not affect circuit performance. Inventory availability is significantly higher (119027 units), making this option suitable for high-volume applications.

74LVC2G32GT,115 is an alternative substitute with Active product status and the highest inventory level (452603 units). However, complete electrical parameter specifications are not provided in the available data. This part should be selected only when supply chain constraints require maximum inventory availability and when the design has been validated against the primary part.

74LVC2G32GD,125 is not recommended for new designs. Although it maintains electrical equivalence, this part has Obsolete product status and uses a different supplier device package dimension (8-XSON 2x3 vs. 1.35x1). The larger package footprint may require PCB layout modifications. Selection of this part should be limited to legacy system maintenance or when specific design constraints mandate the 2x3 package format.

Frequently Asked Questions (FAQ)

Q: Can 74LVC2G32GF,115 be used as a direct replacement for 74LVC2G32GS,115?

A: Yes. Both parts are electrically and functionally identical dual 2-input OR gates with matching supply voltage ranges (1.65V ~ 5.5V), quiescent current (4 µA), output current (32mA), input logic levels, propagation delay (3.2ns @ 5V, 50pF), and operating temperature range (-40°C ~ 125°C). The only difference is packaging format (Bulk vs. Tape & Reel), which does not affect circuit performance. PCB layout and schematic integration remain unchanged.

Q: What is the difference between the 8-XSON (1.35x1) and 8-XSON (2x3) package dimensions?

A: The supplier device package dimension refers to the physical footprint of the component on the PCB. The 1.35x1 package is smaller and more compact, while the 2x3 package is larger. If your PCB layout was designed for the 1.35x1 footprint, substituting a part with the 2x3 package will require PCB redesign. The 74LVC2G32GD,125 uses the 2x3 format and should only be selected if your design specifically accommodates this larger footprint.

Q: Why is 74LVC2G32GD,125 marked as Obsolete?

A: Obsolete product status indicates that the manufacturer has discontinued active production and support for this part. While existing inventory may still be available, long-term supply cannot be guaranteed. For new designs, Active status parts (74LVC2G32GF,115 or 74LVC2G32GT,115) are preferred to ensure sustained availability and manufacturer support throughout the product lifecycle.

Q: Are all substitute parts ROHS3 compliant?

A: The 74LVC2G32GS,115 and 74LVC2G32GD,125 are explicitly listed as ROHS3 Compliant. Complete compliance information is not provided for 74LVC2G32GF,115 and 74LVC2G32GT,115 in the available data. If ROHS3 compliance is a design requirement, confirm compliance status with the supplier before final part selection.

Q: What is the Moisture Sensitivity Level (MSL) for these parts?

A: The 74LVC2G32GS,115 and 74LVC2G32GD,125 are rated MSL Level 1 (Unlimited), indicating no moisture sensitivity restrictions. These parts can be stored and handled under standard conditions without special moisture control measures. MSL information is not provided for 74LVC2G32GF,115 and 74LVC2G32GT,115; contact the supplier for complete handling specifications if moisture sensitivity is a concern for your manufacturing process.