74LVC2G32GD,125 Equivalent & Substitute Parts

Part Overview

The 74LVC2G32GD,125 is a dual 2-input OR gate logic IC manufactured by Nexperia USA Inc. in the 74LVC series. This component features two independent OR gate circuits with 2 inputs each, housed in an 8-XSON (2x3) surface mount package. The part is currently listed as obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and production continuity.

Substiute Parts

74LVC2G32GD,125

Nexperia USA Inc.In Stock: 116874LVC2G32GD,125 Datasheet

Current PartRFQ

74LVC2G32DC,125

Nexperia USA Inc.In Stock: 618374LVC2G32DC,125 Datasheet

SimilarRFQ

74LVC2G32GF,115

NXP USA Inc.In Stock: 11906274LVC2G32GF,115 Datasheet

Parametric EquivalentRFQ

74LVC2G32GN,115

Nexperia USA Inc.In Stock: 78674LVC2G32GN,115 Datasheet

Parametric EquivalentRFQ

74LVC2G32GS,115

Nexperia USA Inc.In Stock: 233874LVC2G32GS,115 Datasheet

Parametric EquivalentRFQ

74LVC2G32GT,115

NXP SemiconductorsIn Stock: 45261474LVC2G32GT,115 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the 74LVC2G32GD,125 is determined by strict equivalence across the following electrical and mechanical parameters:

• Logic function: Dual 2-input OR gate
• Number of circuits and inputs: 2 circuits, 2 inputs per circuit
• Electrical specifications: Supply voltage range (1.65V ~ 5.5V), quiescent current (4 µA max), output current (32mA), input logic levels, and propagation delay (3.2ns @ 5V, 50pF)
• Operating temperature range: -40°C ~ 125°C
• Compliance: ROHS3 compliant, MSL Level 1

Substitute parts are grouped into two categories based on packaging configuration:

Category 1: Direct Package Substitutes (8-XSON variants with different tape/reel configurations)

• 74LVC2G32GN,115 (8-XSON 1.2x1, Tape & Reel)
• 74LVC2G32GS,115 (8-XSON 1.35x1, Tape & Reel)
• 74LVC2G32GF,115 (8-XSON 1.35x1, Bulk)

Category 2: Alternative Package Substitute (different footprint)

• 74LVC2G32DC,125 (8-VSSOP, Tape & Reel)

All substitute parts maintain identical electrical performance and are manufactured by Nexperia USA Inc. or NXP USA Inc. within the 74LVC series.

Parameter Comparison

Engineering Selection Recommendations

Selection of substitute parts for the obsolete 74LVC2G32GD,125 should be based on the following criteria:

For designs requiring identical footprint compatibility: The 74LVC2G32GN,115 and 74LVC2G32GS,115 maintain the 8-XFDFN package family with identical electrical specifications. Both are active products with ROHS3 compliance and MSL Level 1 rating. The 74LVC2G32GN,115 offers the smallest footprint (1.2x1), while 74LVC2G32GS,115 provides a slightly larger variant (1.35x1).

For designs permitting package redesign: The 74LVC2G32DC,125 provides an alternative 8-VFSOP package with identical electrical performance and active product status. This option is suitable when PCB layout can accommodate the different footprint geometry.

For high-volume procurement: The 74LVC2G32GF,115 offers the largest available inventory (119027 Pcs) with active product status and bulk packaging format, suitable for manufacturing environments with established tape-and-reel handling infrastructure.

All recommended substitutes maintain full electrical equivalence, ROHS3 compliance, and MSL Level 1 moisture sensitivity rating. Product status should be verified at time of procurement to ensure continued availability.

Frequently Asked Questions (FAQ)

Q: Can the 74LVC2G32GD,125 be directly replaced with 74LVC2G32GN,115 or 74LVC2G32GS,115?

A: Yes. Both parts maintain identical electrical specifications and operate within the same supply voltage range (1.65V ~ 5.5V), quiescent current (4 µA), output current (32mA), and propagation delay (3.2ns @ 5V, 50pF). The primary difference is the 8-XSON package size variant (1.2x1 for GN,115 and 1.35x1 for GS,115 versus 2x3 for GD,125). PCB layout compatibility must be verified for the specific footprint dimensions.

Q: What is the difference between the 74LVC2G32DC,125 and the 8-XSON variants?

A: The 74LVC2G32DC,125 uses an 8-VSSOP package instead of 8-XSON. Electrical performance is identical across all parameters. The VSSOP package has different physical dimensions and pin spacing, requiring PCB redesign. This option is suitable when package footprint flexibility exists in the design.

Q: Are all substitute parts ROHS3 compliant?

A: All listed substitute parts carry ROHS3 compliance certification. The 74LVC2G32GT,115 does not specify compliance status in the provided data and should be verified with the manufacturer before selection.

Q: What is the significance of the packaging format (Cut Tape vs. Tape & Reel vs. Bulk)?

A: Packaging format affects procurement and assembly logistics. Cut Tape (CT) & Digi-Reel® is suitable for lower-volume applications. Tape & Reel (TR) is standard for automated pick-and-place assembly. Bulk packaging is used for high-volume manufacturing environments. Electrical performance is identical across all packaging formats.

Q: Why is the 74LVC2G32GD,125 listed as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. Active alternatives within the 74LVC2G32 family provide identical functionality and are recommended for new designs and production continuity.

Q: Can I use 74LVC2G32GT,115 as a substitute?

A: The 74LVC2G32GT,115 is listed as active with high inventory availability. However, complete electrical specifications are not provided in the available data. Verification of package type, electrical parameters, and compliance certifications with the manufacturer is required before selection.