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74LVC2G08GD,125 Equivalent & Substitute Parts
Part Overview
The 74LVC2G08GD,125 is a dual 2-input AND gate logic IC manufactured by Nexperia USA Inc. in the 8-XSON (2x3) package. This part is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The 74LVC series provides low-voltage CMOS logic functionality suitable for applications requiring dual AND gate configurations with supply voltages ranging from 1.65V to 5.5V.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Logic Type | AND Gate |
| Number of Circuits | 2 |
| Number of Inputs | 2 |
| Voltage - Supply | 1.65V ~ 5.5V |
| Current - Quiescent (Max) | 4 µA |
| Current - Output High, Low | 32mA, 32mA |
| Input Logic Level - Low | 0.7V ~ 0.8V |
| Input Logic Level - High | 0.95V ~ 3.4V |
| Max Propagation Delay @ 5V, 50pF | 3.8ns |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFDFN |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution for the 74LVC2G08GD,125 is determined by strict equivalence across the following critical parameters:
- Logic Type: AND Gate (2 channels, 2 inputs per channel)
- Voltage Supply Range: 1.65V ~ 5.5V
- Output Drive Capability: 32mA high and low
- Operating Temperature Range: -40°C ~ 125°C
- Base Product Number: 74LVC2G08
- RoHS3 Compliance and MSL Level 1
Substitute parts are grouped into two categories:
Direct Package Substitutes: Parts with identical or compatible package footprints (8-XFDFN variants) that maintain full electrical and mechanical compatibility.
Packaging Variants: Parts with different supplier device packages (8-VSSOP, alternative 8-XSON dimensions) that provide electrical equivalence but require PCB layout evaluation due to package geometry differences.
Parameter Comparison
| Part Number | Manufacturer | Package | Product Status | Voltage Supply | Quiescent Current | Output Current | Propagation Delay @ 5V | Packaging Type | Inventory |
|---|---|---|---|---|---|---|---|---|---|
| 74LVC2G08GD,125 | Nexperia USA Inc. | 8-XFDFN (2x3) | Obsolete | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 3.8ns | Bulk | 1071 Pcs |
| 74LVC2G08DC,125 | Nexperia USA Inc. | 8-VFSOP (0.091", 2.30mm) | Active | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 3.8ns | Tape & Reel | 3828 Pcs |
| 74LVC2G08GF,115 | NXP USA Inc. | 8-XFDFN (1.35x1) | Active | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 3.8ns | Bulk | 124037 Pcs |
| 74LVC2G08GN,115 | NXP Semiconductors | 8-XFDFN (1.2x1) | Active | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 4.8ns | Bulk | 30124 Pcs |
| 74LVC2G08GS,115 | Nexperia USA Inc. | 8-XFDFN (1.35x1) | Active | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 3.8ns | Tape & Reel | 4920 Pcs |
| 74LVC2G08GT,115 | Nexperia USA Inc. | 8-XFDFN (1.95x1) | Active | 1.65V ~ 5.5V | 4 µA | 32mA, 32mA | 3.8ns | Tape & Reel | 97853 Pcs |
Engineering Selection Recommendations
For Active Production: The 74LVC2G08GF,115 and 74LVC2G08GT,115 are recommended as primary substitutes. Both are active products with ROHS3 compliance, MSL Level 1 rating, and identical electrical performance to the obsolete 74LVC2G08GD,125. The 74LVC2G08GF,115 offers the highest inventory availability (124037 Pcs) in bulk packaging, while 74LVC2G08GT,115 provides tape & reel packaging with substantial stock (97853 Pcs).
For Package-Constrained Designs: The 74LVC2G08GS,115 maintains the same electrical specifications and propagation delay as the original part with active product status and tape & reel availability.
For Alternative Packaging: The 74LVC2G08DC,125 provides electrical equivalence in an 8-VSSOP package variant. This part is active and available in tape & reel format but requires PCB layout modification due to different package geometry.
Timing-Sensitive Applications: The 74LVC2G08GN,115 exhibits 4.8ns propagation delay compared to 3.8ns in other variants. This part is suitable only for applications where the additional 1.0ns delay is acceptable.
All substitute parts maintain compliance with ROHS3 standards and REACH regulations, with MSL Level 1 moisture sensitivity ratings.
Frequently Asked Questions (FAQ)
Q: Can I directly replace 74LVC2G08GD,125 with 74LVC2G08GF,115 on my PCB?
A: Yes, if your PCB footprint accommodates the 8-XFDFN (1.35x1) package. Both parts share identical electrical specifications, supply voltage range, output drive capability, and propagation delay. Verify footprint compatibility before assembly.
Q: What is the difference between the various 8-XSON package dimensions listed?
A: The 8-XSON packages differ in physical dimensions: 2x3mm (original), 1.35x1mm, 1.2x1mm, and 1.95x1mm. These variations affect PCB layout and land pattern design. Consult the manufacturer datasheet for specific footprint requirements.
Q: Why does 74LVC2G08GN,115 have a different propagation delay?
A: The 74LVC2G08GN,115 exhibits 4.8ns propagation delay at 5V with 50pF load, compared to 3.8ns for other variants. This represents a 1.0ns difference and may impact timing-critical applications. Verify timing margins in your design before substitution.
Q: Are all substitute parts RoHS3 compliant?
A: All listed substitute parts are ROHS3 compliant with MSL Level 1 moisture sensitivity rating, matching the compliance profile of the original 74LVC2G08GD,125.
Q: What packaging options are available for production quantities?
A: Bulk packaging is available for 74LVC2G08GF,115 and 74LVC2G08GN,115. Tape & Reel packaging is available for 74LVC2G08DC,125, 74LVC2G08GS,115, and 74LVC2G08GT,115. Select based on your assembly process requirements.
Q: Is the 74LVC2G08DC,125 a suitable substitute despite the different package type?
A: The 74LVC2G08DC,125 provides full electrical equivalence and is an active product. However, the 8-VSSOP package differs from the original 8-XFDFN package, requiring PCB redesign. Use this part only if your design can accommodate the alternative package geometry.
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