74LVC240AQ20-13 Equivalent & Substitute Parts

Part Overview

The 74LVC240AQ20-13 is an inverting buffer logic integrated circuit manufactured by Diodes Incorporated. This component functions as a 2-element, 4-bit per element buffer with 3-state output capability, designed for low-voltage CMOS applications. The device operates across a supply voltage range of 1.65V to 3.6V and is housed in a 20-pin VFQFN package with exposed pad. The part maintains Active product status and is RoHS3 compliant, making it suitable for modern electronic applications requiring inverting buffer functionality in space-constrained surface mount designs.

Substiute Parts

74LVC240AQ20-13

Diodes IncorporatedIn Stock: 107874LVC240AQ20-13 Datasheet

Current PartRFQ

74LVC240AQ20-13

Diodes IncorporatedIn Stock: 107874LVC240AQ20-13 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 74LVC240AQ20-13 is determined by strict equivalence across the following critical parameters:

Logic function classification (Buffer, Inverting configuration), element count (2 elements), bit density per element (4 bits), and output architecture (3-state capability). Electrical performance criteria include output current specifications (24mA for both high and low states), supply voltage operating range (1.65V to 3.6V minimum and maximum), and thermal operating window (-40°C to 125°C). Physical form factor requirements mandate the 20-pin VFQFN package with exposed pad in surface mount configuration. Regulatory compliance must maintain RoHS3 certification status and MSL rating of 1 or better.

The 74LVC240AQ20-13 represents the parametric equivalent within the provided dataset, meeting all specified electrical, mechanical, and compliance criteria without deviation.

Parameter Comparison

Engineering Selection Recommendations

The 74LVC240AQ20-13 maintains Active product status, ensuring continued availability and manufacturing support. The component carries ROHS3 compliance certification, meeting environmental and regulatory requirements for modern electronics manufacturing. MSL rating of 1 indicates unlimited shelf life without moisture sensitivity constraints, reducing storage and handling complexity in production environments. The part is currently in stock with 1066 units available, supporting immediate procurement requirements.

Selection of this component is appropriate for applications requiring inverting buffer functionality within the specified electrical and thermal parameters. The 20-VFQFN surface mount package provides space efficiency for compact circuit designs while maintaining adequate thermal management through the exposed pad feature.

Frequently Asked Questions (FAQ)

Q: What defines a valid substitute for the 74LVC240AQ20-13?

A: A valid substitute must match all critical parameters: 2-element, 4-bit inverting buffer configuration with 3-state output, 24mA output current capability, 1.65V to 3.6V supply voltage range, -40°C to 125°C operating temperature, 20-pin VFQFN package with exposed pad, surface mount mounting type, and ROHS3 compliance status.

Q: Can different package variants substitute for the 20-VFQFN?

A: No. The 20-VFQFN Exposed Pad package is a specific physical and thermal form factor. Alternative packages would require PCB layout redesign and thermal analysis validation, placing them outside the scope of direct substitution.

Q: Does the 74LVC240AQ20-13 have cross-manufacturer equivalents?

A: Substitution eligibility is determined strictly by the parameters provided in this reference. Only parts meeting all specified electrical, mechanical, and compliance criteria qualify as equivalents.

Q: What is the significance of the MSL 1 rating?

A: MSL 1 indicates unlimited moisture sensitivity level, meaning the component has no moisture-related storage or handling restrictions. This simplifies inventory management and reduces the risk of moisture-induced failures during standard warehouse conditions.

Q: Is the exposed pad feature critical for substitution?

A: Yes. The exposed pad provides thermal dissipation and electrical grounding. Packages without this feature would alter thermal performance and electrical characteristics, disqualifying them as direct substitutes.