74LVC1G06FW4-7 Equivalent & Substitute Parts

Part Overview

The 74LVC1G06FW4-7 is a single-channel inverter logic IC with open drain output manufactured by Diodes Incorporated. This device operates across a wide supply voltage range of 1.65V to 5.5V and is housed in a 6-XFDFN package (X2-DFN1010-6). The part is Active status and ROHS3 compliant, making it suitable for modern electronic applications requiring low-voltage logic inversion with open drain capability.

Substitute parts are necessary when the primary part number becomes unavailable, when alternative packaging formats are required for PCB layout optimization, or when sourcing from different manufacturers is preferred for supply chain resilience.

Key Parameters

Parameter	Value
Logic Type	Inverter
Number of Circuits	1
Number of Inputs	1
Features	Open Drain
Voltage - Supply	1.65V ~ 5.5V
Current - Quiescent (Max)	200 µA
Current - Output High, Low	-, 32mA
Input Logic Level - Low	0.58V ~ 1.65V
Input Logic Level - High	1.07V ~ 3.85V
Max Propagation Delay @ V, Max CL	4ns @ 5V, 50pF
Operating Temperature	-40°C ~ 125°C
Mounting Type	Surface Mount
Package / Case	6-XFDFN
Base Product Number	74LVC1G06
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the 74LVC1G06FW4-7 is determined by strict adherence to the following electrical and mechanical parameters:

Electrical Compatibility Requirements:

Logic Type: Inverter (1 channel, 1 input)
Open Drain output configuration
Supply voltage range: 1.65V ~ 5.5V
Output current capability: 32mA (low)
Quiescent current: 200 µA maximum
Input logic thresholds: Low 0.58V ~ 1.65V, High 1.07V ~ 3.85V
Propagation delay: 4ns @ 5V, 50pF
Operating temperature: -40°C ~ 125°C

Mechanical Compatibility Requirements:

Surface mount technology
6-pin package format (6-XFDFN)
Base product number: 74LVC1G06

Substitute parts are grouped by manufacturer and specific package variant while maintaining identical electrical specifications. Package variants (X1-DFN1010-6, X2-DFN1409-6, X2-DFN1410-6, 6-XSON) represent different physical footprints but maintain functional equivalence when electrical parameters remain constant.

Parameter Comparison

Part Number	Manufacturer	Package Variant	Voltage Supply	Quiescent Current (Max)	Output Current Low	Propagation Delay	Operating Temp	Inventory
74LVC1G06FW4-7	Diodes Incorporated	X2-DFN1010-6	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	30300 Pcs
74LVC1G06FW5-7	Diodes Incorporated	X1-DFN1010-6	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	31442 Pcs
74LVC1G06FX4-7	Diodes Incorporated	X2-DFN1409-6	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	851 Pcs
74LVC1G06FZ4-7	Diodes Incorporated	X2-DFN1410-6	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	5400 Pcs
74LVC1G06GF,132	NXP Semiconductors	6-XSON, SOT891 (1x1)	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	756040 Pcs
74LVC1G06GM,115	NXP Semiconductors	6-XSON (1.45x1)	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	391908 Pcs
74LVC1G06GM,132	Nexperia USA Inc.	6-XSON, SOT886 (1.45x1)	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	917 Pcs
74LVC1G06GN,132	NXP USA Inc.	6-XSON (0.9x1)	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	98060 Pcs
74LVC1G06GS,132	NXP Semiconductors	6-XSON, SOT1202 (1x1)	1.65V ~ 5.5V	200 µA	32mA	4ns @ 5V, 50pF	-40°C ~ 125°C	90795 Pcs
SN74LVC1G06DSFR	Texas Instruments	6-SON (1x1)	1.65V ~ 5.5V	10 µA	32mA	4.6ns @ 5V, 50pF	-40°C ~ 125°C	1018 Pcs

Engineering Selection Recommendations

All listed substitute parts maintain Active product status and meet the electrical specifications of the 74LVC1G06FW4-7. Selection among substitutes is determined by packaging requirements and PCB layout constraints.

Diodes Incorporated variants (74LVC1G06FW4-7, 74LVC1G06FW5-7, 74LVC1G06FX4-7, 74LVC1G06FZ4-7): These parts differ only in package footprint dimensions. The FW4-7 and FW5-7 use DFN1010-6 packages with different thermal pad configurations (X2 vs X1). The FX4-7 and FZ4-7 use larger DFN packages (DFN1409-6 and DFN1410-6 respectively) for improved thermal performance. All maintain identical electrical performance.

NXP and Nexperia variants (74LVC1G06GF,132, 74LVC1G06GM,115, 74LVC1G06GM,132, 74LVC1G06GN,132, 74LVC1G06GS,132): These parts use 6-XSON package formats with varying footprint dimensions (0.9x1, 1x1, 1.45x1). All maintain ROHS3 compliance and identical electrical specifications. The 74LVC1G06GF,132 and 74LVC1G06GS,132 offer highest inventory availability.

Texas Instruments variant (SN74LVC1G06DSFR): This part exhibits lower quiescent current (10 µA vs 200 µA) and faster propagation delay (4.6ns vs 4ns), representing improved performance characteristics while maintaining full electrical compatibility. ROHS3 compliant.

Frequently Asked Questions (FAQ)

Q: Can I substitute 74LVC1G06FW4-7 with 74LVC1G06FW5-7?

A: Yes. Both parts are manufactured by Diodes Incorporated and share identical electrical specifications. The difference is the thermal pad configuration (X2 vs X1 in the DFN1010-6 package). PCB layout compatibility depends on your design's thermal pad requirements.

Q: What is the difference between Diodes Incorporated and NXP variants?

A: Electrical specifications are identical across all manufacturers. The primary differences are package footprint dimensions and manufacturer-specific part numbering. Selection depends on PCB layout requirements and available inventory.

Q: Is SN74LVC1G06DSFR a direct replacement?

A: SN74LVC1G06DSFR is electrically compatible with improved performance characteristics: lower quiescent current (10 µA vs 200 µA) and faster propagation delay (4.6ns vs 4ns). Package footprint is 6-SON (1x1), which may differ from your current PCB layout. Verify mechanical compatibility before substitution.

Q: Do all substitute parts have the same operating temperature range?

A: Yes. All listed substitutes operate across -40°C to 125°C, matching the 74LVC1G06FW4-7 specification.

Q: What does the package variant designation mean (X1, X2, DFN1010, DFN1409, DFN1410)?

A: These designations specify physical footprint dimensions and thermal pad configurations. X1 and X2 indicate different thermal pad sizes within the same package family. DFN1010, DFN1409, and DFN1410 represent different package body sizes. All maintain 6-pin configuration and identical electrical function. PCB layout compatibility requires matching the specific package variant to your design.

Q: Are all parts ROHS3 compliant?

A: All listed Diodes Incorporated, Nexperia, and Texas Instruments parts are ROHS3 compliant. NXP Semiconductors variants do not specify RoHS status in the provided data.

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