74LCX16240MEAX Equivalent & Substitute Parts

Part Overview

The 74LCX16240MEAX is a 4-element, 4-bit inverting buffer IC with 3-state output capability, manufactured by onsemi in a 48-SSOP package. This component is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and procurement. The part operates across a 2V to 3.6V supply voltage range with 24mA output current capability and is rated for -40°C to 85°C operating temperature.

Key Parameters

Parameter	Value
Logic Type	Buffer, Inverting
Number of Elements	4
Number of Bits per Element	4
Output Type	3-State
Current - Output High, Low	24mA, 24mA
Voltage - Supply	2V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	48-BSSOP (0.295", 7.50mm Width)
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the 74LCX16240MEAX is determined by the following critical parameters:

Logic Function: Buffer, Inverting with 4 elements and 4 bits per element
Output Configuration: 3-State output capability
Output Current: 24mA minimum for both high and low states
Supply Voltage Range: Minimum 2V support required; upper limit may extend to 3.6V or higher
Operating Temperature: -40°C minimum and 85°C minimum upper limit
Package Compatibility: 48-SSOP or 48-TSSOP packages acceptable for surface mount applications
Moisture Sensitivity: MSL 1 classification

Substitute parts must satisfy all functional and electrical parameters. Package variants (48-SSOP vs. 48-TSSOP) are interchangeable for PCB layout purposes due to compatible pin configurations and similar footprints.

Parameter Comparison

Parameter	74LCX16240MEAX (onsemi)	74LVC16240ADGG,118 (Nexperia)	SN74LVCH16240ADGG (TI)	SN74LVCH16240ADGGR (TI)	SN74LVCH16240ADL (TI)	SN74LVCH16240ADLR (TI)
Logic Type	Buffer, Inverting	Buffer, Inverting	Buffer, Inverting	Buffer, Inverting	Buffer, Inverting	Buffer, Inverting
Number of Elements	4	4	4	4	4	4
Number of Bits per Element	4	4	4	4	4	4
Output Type	3-State	3-State	3-State	3-State	3-State	3-State
Current - Output High, Low	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA
Voltage - Supply	2V ~ 3.6V	1.2V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 125°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Package / Case	48-BSSOP	48-TFSOP	48-TFSOP	48-TFSOP	48-BSSOP	48-BSSOP
Moisture Sensitivity Level (MSL)	1	1	1	1	1	1
Product Status	Obsolete	Active	Active	Active	Active	Active
RoHS Status	REACH Unaffected	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

All listed substitute parts meet the functional and electrical requirements of the 74LCX16240MEAX. Selection should be based on the following criteria:

Product Status: All substitute parts carry Active product status, ensuring long-term availability and manufacturing support compared to the obsolete 74LCX16240MEAX.

Compliance: All substitute parts are ROHS3 compliant, meeting current environmental and regulatory standards. The original 74LCX16240MEAX is REACH unaffected, while all substitutes maintain REACH unaffected status.

Package Selection:

For direct footprint compatibility with existing 48-SSOP designs, select SN74LVCH16240ADL or SN74LVCH16240ADLR (Texas Instruments).
For 48-TSSOP package designs, select 74LVC16240ADGG,118 (Nexperia), SN74LVCH16240ADGG, or SN74LVCH16240ADGGR (Texas Instruments).

Supply Voltage Consideration: The 74LVC16240ADGG,118 supports a lower minimum supply voltage of 1.2V compared to the original 2V minimum. This provides additional design flexibility for low-voltage applications. Texas Instruments substitutes support 1.65V minimum.

Temperature Range: The 74LVC16240ADGG,118 extends the upper operating temperature to 125°C, compared to 85°C for the original and other Texas Instruments variants. This is beneficial for high-temperature environments.

Packaging Format: Tape & Reel (TR) variants (SN74LVCH16240ADGGR, SN74LVCH16240ADLR, 74LVC16240ADGG,118) are recommended for high-volume production. Tube packaging (SN74LVCH16240ADL) is suitable for lower-volume or prototype applications.

Frequently Asked Questions (FAQ)

Q: Can I use a 48-TSSOP package substitute in place of the original 48-SSOP package?

A: Yes. Both 48-TSSOP and 48-BSSOP packages are compatible for surface mount applications. The 48-TFSOP (0.240", 6.10mm width) and 48-BSSOP (0.295", 7.50mm width) have different physical dimensions but identical pin configurations. PCB layout modifications may be required to accommodate the different package footprints.

Q: What is the minimum supply voltage requirement for substitution?

A: The original 74LCX16240MEAX requires 2V minimum supply voltage. All listed substitutes support this requirement. The 74LVC16240ADGG,118 extends support down to 1.2V, while Texas Instruments variants support 1.65V minimum. Designs operating at 2V or above are compatible with all substitutes.

Q: Are all substitute parts RoHS compliant?

A: Yes. All listed substitute parts are ROHS3 compliant. The original 74LCX16240MEAX is REACH unaffected, and all substitutes maintain this status.

Q: Which substitute offers the best long-term availability?

A: All substitute parts carry Active product status, ensuring ongoing manufacturing and supply. Texas Instruments (SN74LVCH series) and Nexperia (74LVC series) are established manufacturers with strong market presence. Selection should be based on your existing supply chain relationships and inventory management practices.

Q: Can I mix different substitute part numbers in the same design?

A: Yes. All substitute parts are functionally equivalent and electrically compatible. However, maintaining a single part number per design is recommended for manufacturing consistency, inventory management, and traceability.

Q: What is the significance of the Tape & Reel (TR) packaging designation?

A: Tape & Reel packaging is standard for automated assembly processes and high-volume production. Tube packaging is typically used for lower-volume applications or manual assembly. Both formats contain identical components; the difference is in the delivery and handling format.

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