74LCX06MTC Equivalent & Substitute Parts

Part Overview

The 74LCX06MTC is a 6-channel inverter logic IC with open-drain outputs manufactured by onsemi in a 14-TSSOP surface mount package. This part is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The 74LCX06 base product series remains actively produced by multiple manufacturers, enabling direct functional replacement through equivalent models with identical electrical characteristics and pin configurations.

Key Parameters

Parameter	Value
Logic Type	Inverter
Number of Circuits	6
Number of Inputs	1
Features	Open Drain
Voltage - Supply	2V ~ 3.6V
Current - Quiescent (Max)	10 µA
Current - Output High, Low	-, 24mA
Input Logic Level - Low	0.7V ~ 0.8V
Input Logic Level - High	1.7V ~ 2V
Max Propagation Delay @ V, Max CL	3.7ns @ 3.3V, 50pF
Operating Temperature	-40°C ~ 85°C
Package / Case	14-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the 74LCX06MTC is determined by strict equivalence across the following critical parameters: logic type (inverter), circuit count (6 channels), input count (1), open-drain output feature, supply voltage range (2V ~ 3.6V minimum), output current capability (24mA), input logic thresholds, and surface mount package compatibility. The 74LCX series (onsemi) and 74LVC series (NXP Semiconductors, Texas Instruments) share identical functional specifications and pin configurations, enabling direct substitution. Package variants (14-TSSOP, 14-SSOP, 14-TVSOP) maintain compatible footprints for the same base product number. All substitute parts listed maintain ROHS3 compliance and MSL 1 rating, ensuring environmental and handling compatibility.

Parameter Comparison

Part Number	Manufacturer	Product Status	Supply Voltage	Quiescent Current (Max)	Output Current	Propagation Delay	Operating Temp	Package	Packaging Type
74LCX06MTC	onsemi	Obsolete	2V ~ 3.6V	10 µA	24mA	3.7ns @ 3.3V, 50pF	-40°C ~ 85°C	14-TSSOP	-
MC74LCX06DTR2G	onsemi	Active	2V ~ 3.6V	10 µA	24mA	3.7ns @ 3.3V, 50pF	-40°C ~ 85°C	14-TSSOP	Tape & Reel (TR)
SN74LVC06APWR	Texas Instruments	Active	1.65V ~ 3.6V	1 µA	24mA	4.6ns @ 3.3V, 50pF	-40°C ~ 125°C	14-TSSOP	Tape & Reel (TR)
SN74LVC06APW	Texas Instruments	Active	1.65V ~ 3.6V	1 µA	24mA	4.6ns @ 3.3V, 50pF	-40°C ~ 125°C	14-TSSOP	Tube
SN74LVC06APWT	Texas Instruments	Active	1.65V ~ 3.6V	1 µA	24mA	4.6ns @ 3.3V, 50pF	-40°C ~ 125°C	14-TSSOP	Tape & Reel (TR)
SN74LVC06ADBR	Texas Instruments	Active	1.65V ~ 3.6V	1 µA	24mA	4.6ns @ 3.3V, 50pF	-40°C ~ 125°C	14-SSOP	Tape & Reel (TR)
SN74LVC06ADGVR	Texas Instruments	Active	1.65V ~ 3.6V	1 µA	24mA	4.6ns @ 3.3V, 50pF	-40°C ~ 125°C	14-TVSOP	Tape & Reel (TR)
SN74LVC06AQPWRG4Q1	Texas Instruments	Active	1.65V ~ 3.6V	10 µA	24mA	3.7ns @ 3.3V, 50pF	-40°C ~ 125°C	14-TSSOP	Tape & Reel (TR)
74LVC06APW,112	NXP Semiconductors	Active	-	-	-	-	-	-	Bulk
74LVC06APW,118	NXP Semiconductors	Active	-	-	-	-	-	-	-

Engineering Selection Recommendations

For direct replacement of the obsolete 74LCX06MTC, the MC74LCX06DTR2G from onsemi provides identical electrical specifications and maintains the same 14-TSSOP package footprint. This part is actively produced and maintains full compatibility with the original design.

For applications requiring extended operating temperature range (-40°C ~ 125°C versus -40°C ~ 85°C), the Texas Instruments 74LVC series variants (SN74LVC06APWR, SN74LVC06APW, SN74LVC06APWT) offer superior performance with lower quiescent current (1 µA versus 10 µA) and faster propagation delay (4.6ns versus 3.7ns). These parts are available in multiple package options and packaging formats.

The SN74LVC06AQPWRG4Q1 variant includes automotive-grade qualification (AEC-Q100) and is suitable for automotive applications requiring enhanced reliability specifications.

All substitute parts maintain ROHS3 compliance and MSL 1 rating, ensuring compatibility with standard manufacturing and handling procedures. Selection between packaging formats (Tape & Reel, Tube, Bulk) depends on procurement volume and assembly requirements.

Frequently Asked Questions (FAQ)

Q: Can the 74LVC06 series directly replace the 74LCX06MTC?

A: Yes. Both series share identical logic functionality, pin configuration, and electrical characteristics within the specified supply voltage range (2V ~ 3.6V). The 74LVC series offers extended operating temperature range and lower quiescent current as additional benefits.

Q: What is the difference between 14-TSSOP, 14-SSOP, and 14-TVSOP packages?

A: These are surface mount package variants with different physical dimensions. 14-TSSOP and 14-TVSOP maintain the same 0.173" width and are mechanically compatible. 14-SSOP has a larger 0.209" width. Package selection depends on PCB layout constraints and assembly equipment capabilities. Pin configuration remains identical across all variants.

Q: Does the extended temperature range of the 74LVC series affect compatibility?

A: No. The extended range (-40°C ~ 125°C) is a superset of the original specification (-40°C ~ 85°C). Parts with extended temperature ratings are fully compatible with designs specified for the narrower range.

Q: What is the significance of the quiescent current difference between 74LCX06 and 74LVC06?

A: The 74LVC06 series exhibits lower quiescent current (1 µA versus 10 µA), resulting in reduced power consumption during idle states. This is beneficial for battery-powered or low-power applications but does not affect functional compatibility.

Q: Are NXP 74LVC06APW variants suitable replacements?

A: Yes. The 74LVC06APW,112 and 74LVC06APW,118 variants from NXP Semiconductors are functionally equivalent. Limited parameter data is provided for these parts; verification of specific electrical characteristics with the manufacturer datasheet is recommended for critical applications.

Q: What packaging format should be selected for production?

A: Tape & Reel (TR) packaging is standard for automated assembly. Tube packaging is suitable for lower-volume manual assembly. Bulk packaging is used for high-volume procurement. Selection depends on production volume and assembly process requirements.

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