74HCT273N,652 Equivalent & Substitute Parts

Part Overview

The 74HCT273N,652 is an 8-bit D-type flip-flop logic integrated circuit manufactured by NXP USA Inc., housed in a 20-DIP through-hole package. This component functions as a master reset flip-flop with non-inverted outputs, operating at a maximum clock frequency of 36 MHz. The part is currently classified as obsolete, making equivalent and substitute parts necessary for ongoing system maintenance, repairs, and legacy design support.

Substiute Parts

74HCT273N,652
NXP USA Inc.In Stock: 109674HCT273N,652 Datasheet
74HCT273N,652
Current Part
CD74HCT273E
Harris CorporationIn Stock: 3271CD74HCT273E Datasheet
CD74HCT273E
Upgrade
74HCT273D,653
NXP SemiconductorsIn Stock: 30030174HCT273D,653 Datasheet
74HCT273D,653
MFR Recommended
SN74HCT273N
Texas InstrumentsIn Stock: 3899SN74HCT273N Datasheet
SN74HCT273N
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 74HCT273N,652
Manufacturer NXP USA Inc.
Category Logic
Type D-Type Flip-Flop
Number of Bits per Element 8
Clock Frequency 36 MHz
Max Propagation Delay @ 4.5V, 50pF 30 ns
Voltage Supply Range 4.5V ~ 5.5V
Current - Output High, Low 4mA, 5.2mA
Operating Temperature -40°C ~ 125°C
Package / Case 20-DIP (0.300", 7.62mm)
Mounting Type Through Hole
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution for the 74HCT273N,652 is determined by the following critical parameters:

  • Functional equivalence: D-type flip-flop with 8-bit configuration, master reset function, non-inverted output
  • Electrical compatibility: Supply voltage range 4.5V ~ 5.5V, propagation delay specifications, output current ratings
  • Package compatibility: 20-DIP through-hole form factor (0.300", 7.62mm)
  • Trigger type: Positive edge triggering
  • Series alignment: 74HCT logic family

Substitute parts are grouped into two categories:

  1. Direct Package Equivalent (20-DIP Through-Hole): CD74HCT273E and SN74HCT273N maintain identical package form factor and mounting type, enabling direct socket replacement.

  2. Functional Equivalent with Package Variation (20-SOIC Surface Mount): 74HCT273D,653 provides electrical and functional equivalence but requires PCB redesign due to surface-mount packaging.

Parameter Comparison

Parameter 74HCT273N,652 (Main) CD74HCT273E 74HCT273D,653 SN74HCT273N
Manufacturer NXP USA Inc. Harris Corporation NXP Semiconductors Texas Instruments
Type D-Type Flip-Flop D-Type Flip-Flop D-Type Flip-Flop D-Type Flip-Flop
Number of Bits per Element 8 8 8 8
Clock Frequency 36 MHz 50 MHz 36 MHz 37 MHz
Max Propagation Delay @ 4.5V, 50pF 30 ns 30 ns 30 ns 29 ns @ 5.5V
Voltage Supply Range 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Current - Output High, Low 4mA, 5.2mA 4mA, 4mA 4mA, 5.2mA 4mA, 4mA
Operating Temperature -40°C ~ 125°C -55°C ~ 125°C -40°C ~ 125°C -40°C ~ 85°C
Package / Case 20-DIP (0.300", 7.62mm) 20-DIP (0.300", 7.62mm) 20-SOIC (0.295", 7.50mm) 20-DIP (0.300", 7.62mm)
Mounting Type Through Hole Through Hole Surface Mount Through Hole
Product Status Obsolete Obsolete Active Active
RoHS Status ROHS3 Compliant RoHS non-compliant Not specified ROHS3 Compliant

Engineering Selection Recommendations

For direct socket replacement in through-hole applications:

SN74HCT273N (Texas Instruments) is the preferred substitute. It maintains 20-DIP through-hole packaging, is currently in active production status, and carries ROHS3 compliance certification. Operating temperature range is -40°C to 85°C, which covers standard industrial applications. Propagation delay of 29 ns at 5.5V meets or exceeds the original specification.

Alternative through-hole option:

CD74HCT273E (Harris Corporation) provides identical 20-DIP packaging and extended operating temperature range (-55°C to 125°C). However, this part is obsolete and carries RoHS non-compliance status, making it suitable only for legacy system maintenance where compliance requirements are not applicable.

For new designs or PCB redesign scenarios:

74HCT273D,653 (NXP Semiconductors) offers active production status and functional equivalence with identical electrical specifications to the original part. The 20-SOIC surface-mount package requires PCB layout modification but provides modern manufacturing support and compliance certifications.

Frequently Asked Questions (FAQ)

Q: Can SN74HCT273N be used as a direct replacement for 74HCT273N,652 without PCB modification?

A: Yes. Both parts use 20-DIP through-hole packaging with identical pin spacing (0.300", 7.62mm). Electrical specifications are compatible across the 4.5V to 5.5V supply range. No PCB modification is required.

Q: What is the difference between the CD74HCT273E and SN74HCT273N substitutes?

A: Both maintain 20-DIP through-hole compatibility. CD74HCT273E offers extended temperature range (-55°C to 125°C) but is obsolete and RoHS non-compliant. SN74HCT273N is in active production with ROHS3 compliance and standard industrial temperature range (-40°C to 85°C).

Q: Why is 74HCT273D,653 listed as a substitute if it uses a different package?

A: 74HCT273D,653 provides functional and electrical equivalence for applications where PCB redesign is feasible. It offers the advantage of active production status and modern compliance certifications. Surface-mount packaging (20-SOIC) requires PCB layout changes but is suitable for new designs or system upgrades.

Q: Are there any output current differences between the main part and substitutes?

A: Output current specifications vary slightly. The main part and 74HCT273D,653 specify 4mA high and 5.2mA low. CD74HCT273E and SN74HCT273N specify 4mA for both high and low outputs. These differences are within acceptable tolerance for standard 74HCT logic applications.

Q: Which substitute is recommended for new production designs?

A: SN74HCT273N (Texas Instruments) for through-hole applications, or 74HCT273D,653 (NXP Semiconductors) for surface-mount designs. Both are in active production status with current compliance certifications.

Request Quote (Ships tomorrow)