74HCT257N,652 Equivalent & Substitute Parts

Part Overview

The 74HCT257N,652 is a 4 x 2:1 multiplexer logic integrated circuit manufactured by NXP USA Inc. in a 16-DIP through-hole package. This part is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement. The 74HCT257 series provides single-supply operation with standard TTL-compatible logic levels, suitable for signal routing and data selection applications in digital systems.

Substiute Parts

74HCT257N,652
NXP USA Inc.In Stock: 76074HCT257N,652 Datasheet
74HCT257N,652
Current Part
74HCT257D,652
Nexperia USA Inc.In Stock: 97774HCT257D,652 Datasheet
74HCT257D,652
MFR Recommended
CD74HCT257E
Harris CorporationIn Stock: 1450CD74HCT257E Datasheet
CD74HCT257E
MFR Recommended
SN74HCT257N
Texas InstrumentsIn Stock: 2034SN74HCT257N Datasheet
SN74HCT257N
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 74HCT257N,652
Manufacturer NXP USA Inc.
Category Logic
Type Multiplexer
Circuit Configuration 4 x 2:1
Independent Circuits 1
Current - Output High, Low 6mA, 6mA
Voltage Supply Source Single Supply
Voltage - Supply 4.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C
Mounting Type Through Hole
Package / Case 16-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the 74HCT257N,652 is determined by the following critical parameters:

  • Circuit configuration: 4 x 2:1 multiplexer topology
  • Output current capability: 6mA high and low
  • Supply voltage range: 4.5V ~ 5.5V
  • Single supply operation
  • Logic family: 74HCT series

Substitute parts are grouped into two categories based on package type:

Through-Hole Package Substitutes: Parts maintaining the 16-DIP package format for direct socket compatibility.

Surface-Mount Package Substitutes: Parts with equivalent electrical specifications but in 16-SOIC surface-mount packaging, requiring PCB layout modification.

All substitute parts listed share the same base product number (74HCT257) and maintain electrical equivalence within the specified parameters.

Parameter Comparison

Parameter 74HCT257N,652 (Main) 74HCT257D,652 CD74HCT257E SN74HCT257N
Manufacturer NXP USA Inc. Nexperia USA Inc. Harris Corporation Texas Instruments
Circuit Configuration 4 x 2:1 4 x 2:1 4 x 2:1 4 x 2:1
Current - Output High, Low 6mA, 6mA 6mA, 6mA 6mA, 6mA 6mA, 6mA
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -55°C ~ 125°C -40°C ~ 85°C
Mounting Type Through Hole Surface Mount Through Hole Through Hole
Package / Case 16-DIP (0.300", 7.62mm) 16-SOIC (0.154", 3.90mm Width) 16-DIP (0.300", 7.62mm) 16-DIP (0.300", 7.62mm)
Product Status Obsolete Obsolete Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

For Direct Socket Replacement (Through-Hole DIP Package):

SN74HCT257N (Texas Instruments) is the preferred substitute. This part maintains identical package geometry, electrical specifications, and supply voltage range. The part is currently in active production status, ensuring long-term availability. It is ROHS3 compliant and carries REACH unaffected status. Operating temperature range is -40°C to 85°C, which covers the majority of industrial applications. This part is suitable for designs requiring no PCB modification.

CD74HCT257E (Harris Corporation) provides an alternative through-hole substitute with identical package and electrical specifications. Operating temperature range extends to -55°C, providing wider low-temperature capability. However, this part is RoHS non-compliant, which may restrict use in regulated applications.

For Surface-Mount Applications:

74HCT257D,652 (Nexperia USA Inc.) offers equivalent electrical performance in a 16-SOIC surface-mount package. This substitution requires PCB layout redesign. The part is ROHS3 compliant and maintains the same supply voltage and output current specifications. This option is suitable for new designs or PCB revisions where surface-mount technology is preferred.

Compliance Considerations:

For applications requiring RoHS3 compliance, select SN74HCT257N or 74HCT257D,652. CD74HCT257E does not meet RoHS requirements and should be avoided in regulated environments.

Frequently Asked Questions (FAQ)

Q: Can SN74HCT257N directly replace 74HCT257N,652 without any modifications?

A: Yes. Both parts share identical 16-DIP package geometry, electrical specifications, supply voltage range (4.5V ~ 5.5V), and output current ratings (6mA). No PCB modifications are required for socket replacement.

Q: What is the difference between the through-hole and surface-mount substitutes?

A: Through-hole substitutes (SN74HCT257N, CD74HCT257E) use 16-DIP packaging and mount vertically through PCB holes. The surface-mount substitute (74HCT257D,652) uses 16-SOIC packaging and solders flat to the PCB surface. Surface-mount substitution requires PCB redesign.

Q: Why is SN74HCT257N recommended over CD74HCT257E?

A: SN74HCT257N is in active production status, ensuring continued availability. It is ROHS3 compliant, meeting modern regulatory requirements. CD74HCT257E is obsolete and RoHS non-compliant, limiting its use in new designs and regulated applications.

Q: Are there temperature range differences between substitutes?

A: Yes. SN74HCT257N operates from -40°C to 85°C. CD74HCT257E extends to -55°C for enhanced low-temperature performance. 74HCT257D,652 operates from -40°C to 125°C. Select based on your application's temperature requirements.

Q: Is the 74HCT257D,652 electrically equivalent to the main part?

A: Yes. The 74HCT257D,652 maintains identical circuit configuration, output current, and supply voltage specifications. The only difference is the package type (16-SOIC surface-mount versus 16-DIP through-hole).

Q: Which substitute should I use for new designs?

A: For through-hole applications, use SN74HCT257N. For surface-mount designs, use 74HCT257D,652. Both are ROHS3 compliant and ensure long-term component availability.

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