74HCT04N,652 Equivalent & Substitute Parts

Part Overview

The 74HCT04N,652 is a 6-channel inverter logic IC manufactured by NXP USA Inc. in a 14-DIP through-hole package. This part is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement. The 74HCT04 series provides standard CMOS inverter functionality suitable for digital logic applications requiring signal inversion across multiple channels.

Substiute Parts

74HCT04N,652
NXP USA Inc.In Stock: 118174HCT04N,652 Datasheet
74HCT04N,652
Current Part
SN74HCT04N
Texas InstrumentsIn Stock: 5141SN74HCT04N Datasheet
SN74HCT04N
Direct
CD74HCT04E
Texas InstrumentsIn Stock: 2053CD74HCT04E Datasheet
CD74HCT04E
Upgrade
74HCT04D,653
Nexperia USA Inc.In Stock: 617474HCT04D,653 Datasheet
74HCT04D,653
MFR Recommended
SN74HCT04AN
Texas InstrumentsIn Stock: 925SN74HCT04AN Datasheet
SN74HCT04AN
MFR Recommended

Key Parameters

Parameter Value
Logic Type Inverter
Number of Circuits 6
Number of Inputs 1
Voltage - Supply 4.5V ~ 5.5V
Current - Quiescent (Max) 2 µA
Current - Output High, Low 4mA, 4mA
Input Logic Level - Low 0.8V
Input Logic Level - High 2V
Operating Temperature -40°C ~ 125°C
Mounting Type Through Hole
Package / Case 14-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the 74HCT04N,652 is determined by the following critical parameters: logic type (inverter), circuit count (6 channels), input count (1), supply voltage range (4.5V ~ 5.5V), input/output logic levels, and package compatibility. The 74HCT04 base product number defines the functional equivalence across all substitute parts.

Substitute parts are grouped into three categories based on packaging and manufacturer:

Direct Equivalent (DIP Package): SN74HCT04N maintains identical through-hole DIP packaging and electrical specifications, enabling direct socket replacement.

Upgrade Option (Extended Temperature Range): CD74HCT04E provides extended operating temperature range (-55°C ~ 125°C) while maintaining DIP package compatibility, suitable for applications requiring broader temperature performance.

Surface Mount Alternative: 74HCT04D,653 offers the same functional and electrical specifications in a 14-SO surface-mount package, requiring PCB layout modification but providing space efficiency for modern designs.

Parameter Comparison

Parameter 74HCT04N,652 (NXP) SN74HCT04N (TI) CD74HCT04E (TI) 74HCT04D,653 (Nexperia)
Manufacturer NXP USA Inc. Texas Instruments Texas Instruments Nexperia USA Inc.
Product Status Obsolete Active Active Active
Logic Type Inverter Inverter Inverter Inverter
Number of Circuits 6 6 6 6
Number of Inputs 1 1 1 1
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Current - Quiescent (Max) 2 µA 2 µA 2 µA 2 µA
Current - Output High, Low 4mA, 4mA 4mA, 4mA 4mA, 4mA 4mA, 4mA
Input Logic Level - Low 0.8V 0.8V 0.8V 0.8V
Input Logic Level - High 2V 2V 2V 2V
Max Propagation Delay @ V, Max CL 19ns @ 4.5V, 50pF 18ns @ 5.5V, 50pF 19ns @ 4.5V, 50pF 19ns @ 4.5V, 50pF
Operating Temperature -40°C ~ 125°C -40°C ~ 85°C -55°C ~ 125°C -40°C ~ 125°C
Mounting Type Through Hole Through Hole Through Hole Surface Mount
Package / Case 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-SOIC (0.154", 3.90mm Width)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

For Direct Replacement: Select SN74HCT04N when maintaining existing through-hole DIP designs. This part is manufactured by Texas Instruments with active product status and full ROHS3 compliance, ensuring long-term availability and supply chain stability.

For Extended Temperature Applications: Select CD74HCT04E when designs require operation across the full -55°C to 125°C temperature range. This part maintains DIP package compatibility while providing enhanced thermal performance, suitable for industrial and automotive environments.

For Surface Mount Designs: Select 74HCT04D,653 when implementing new designs or redesigns requiring surface-mount technology. This Nexperia part maintains all electrical specifications while reducing PCB footprint and enabling automated assembly processes.

All substitute parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory compliance across applications.

Frequently Asked Questions (FAQ)

Q: Can SN74HCT04N be used as a direct replacement for 74HCT04N,652?

A: Yes. Both parts share identical logic type (6-channel inverter), electrical specifications (4.5V ~ 5.5V supply, 4mA output current, matching input logic levels), and 14-DIP through-hole packaging. Socket compatibility is direct.

Q: What is the difference between CD74HCT04E and the original 74HCT04N,652?

A: CD74HCT04E extends the operating temperature range to -55°C ~ 125°C compared to the original -40°C ~ 125°C. All other electrical parameters and DIP packaging remain identical. This upgrade is suitable for applications requiring broader thermal performance.

Q: Why would I select 74HCT04D,653 over the DIP alternatives?

A: The 74HCT04D,653 is a surface-mount 14-SO package variant. Selection depends on PCB design requirements. Surface-mount packages reduce board space, enable automated assembly, and are standard in modern manufacturing. DIP packages remain necessary for through-hole designs and prototyping applications.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts—SN74HCT04N, CD74HCT04E, and 74HCT04D,653—are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the propagation delay difference between substitute parts?

A: SN74HCT04N specifies 18ns @ 5.5V, while 74HCT04N,652, CD74HCT04E, and 74HCT04D,653 specify 19ns @ 4.5V. These differences are within typical manufacturing tolerance and do not affect functional compatibility in standard logic applications.

Q: Can I use these parts interchangeably in existing designs?

A: DIP package parts (74HCT04N,652, SN74HCT04N, CD74HCT04E) are directly interchangeable. The 14-SO surface-mount variant (74HCT04D,653) requires PCB layout modification and cannot be used in through-hole sockets.

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