74HC73DB,118 Equivalent & Substitute Parts

Part Overview

The 74HC73DB,118 is a dual JK-type flip-flop logic integrated circuit manufactured by Nexperia USA Inc. in a 14-SSOP surface mount package. This component functions as a reset-capable, negative edge-triggered flip-flop with complementary outputs, operating across a 2V to 6V supply voltage range. The part is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and production continuity.

Substiute Parts

74HC73DB,118

Nexperia USA Inc.In Stock: 112174HC73DB,118 Datasheet

Current PartRFQ

74HC73PW,118

Nexperia USA Inc.In Stock: 537574HC73PW,118 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the 74HC73DB,118 is determined by strict equivalence across the following critical parameters:

• Base Product Number: Both parts must share the 74HC73 base designation, ensuring identical logic function and pin configuration
• Flip-Flop Type: JK Type with negative edge triggering and complementary outputs
• Element Count and Bit Width: 2 elements, 1 bit per element
• Electrical Performance: Clock frequency (83 MHz), propagation delay (27 ns @ 6V, 50pF), supply voltage range (2V ~ 6V), output current (5.2 mA), and quiescent current (4 µA)
• Operating Temperature Range: -40°C ~ 125°C
• Compliance: ROHS3 compliance and MSL Level 1

The 74HC73PW,118 meets all these criteria. The primary difference is the package variant: the substitute uses 14-TSSOP (0.173", 4.40mm Width) instead of 14-SSOP (0.209", 5.30mm Width). Both are surface mount packages with identical pin counts and electrical characteristics. The substitute part is currently in active production status, providing supply continuity.

Parameter Comparison

Engineering Selection Recommendations

The 74HC73PW,118 is the direct functional equivalent for the obsolete 74HC73DB,118. Both parts are manufactured by Nexperia USA Inc. and share identical electrical specifications, logic function, and pin configuration. The substitute part carries active product status, ensuring long-term availability and supply chain reliability.

Selection of the 74HC73PW,118 requires PCB layout modification to accommodate the 14-TSSOP package footprint (0.173" width) in place of the original 14-SSOP footprint (0.209" width). The TSSOP variant offers a more compact form factor while maintaining all electrical and functional characteristics. Both parts meet ROHS3 compliance and carry MSL Level 1 moisture sensitivity ratings, suitable for standard handling and storage conditions.

Frequently Asked Questions (FAQ)

Q: Can the 74HC73PW,118 directly replace the 74HC73DB,118 without design changes?

A: The parts are electrically and functionally identical. However, the package footprint differs: 14-TSSOP versus 14-SSOP. PCB layout modification is required to accommodate the different package dimensions. Pin configuration and electrical performance remain unchanged.

Q: What is the primary difference between these two parts?

A: The main difference is the package type and form factor. The 74HC73DB,118 uses a 14-SSOP package (0.209" width), while the 74HC73PW,118 uses a 14-TSSOP package (0.173" width). The TSSOP variant is more compact. Electrical specifications and logic function are identical.

Q: Why is the 74HC73DB,118 listed as obsolete?

A: The 74HC73DB,118 has been discontinued by the manufacturer. The 74HC73PW,118 remains in active production, providing a viable path for design continuity and future production support.

Q: Are both parts ROHS3 compliant?

A: Yes, both the 74HC73DB,118 and 74HC73PW,118 are ROHS3 compliant and carry MSL Level 1 moisture sensitivity ratings.

Q: What packaging formats are available for each part?

A: The 74HC73DB,118 is supplied in tube packaging. The 74HC73PW,118 is supplied in Tape & Reel (TR) format, which is standard for high-volume production environments.

Q: Do these parts have identical pin counts and configurations?

A: Yes, both parts are 14-pin surface mount devices with identical pin assignments and logic function. The difference is only in the physical package footprint dimensions.