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74HC540N,652 Equivalent & Substitute Parts
Part Overview
The 74HC540N,652 is an inverting buffer logic integrated circuit manufactured by NXP USA Inc. in a 20-DIP through-hole package. This part functions as a Buffer, Inverting with 1 element, 8 bits per element, and 3-state output capability. The device operates across a 2V to 6V supply voltage range with output currents of 7.8mA for both high and low states.
The 74HC540N,652 is classified as obsolete. Equivalent and substitute parts are necessary to maintain design continuity and ensure component availability for new production runs, repairs, and system upgrades.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 74HC540N,652 |
| Manufacturer | NXP USA Inc. |
| Logic Type | Buffer, Inverting |
| Number of Elements | 1 |
| Number of Bits per Element | 8 |
| Output Type | 3-State |
| Current - Output High, Low | 7.8mA, 7.8mA |
| Voltage - Supply | 2V ~ 6V |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Through Hole |
| Package / Case | 20-DIP (0.300", 7.62mm) |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitute parts for the 74HC540N,652 are qualified based on the following electrical and mechanical parameters:
Electrical Compatibility Criteria:
- Logic Type: Buffer, Inverting (identical function)
- Number of Elements: 1
- Number of Bits per Element: 8
- Output Type: 3-State
- Current - Output High, Low: 7.8mA, 7.8mA
- Voltage - Supply: 2V ~ 6V
- Series: 74HC
Mechanical Compatibility Criteria:
- Package / Case: 20-DIP or 20-SO (surface mount variant)
- Mounting Type: Through Hole or Surface Mount
Compliance Criteria:
- RoHS Status: ROHS3 Compliant
- REACH Status: REACH Unaffected
The substitute parts listed below meet all electrical requirements and maintain functional equivalence. Packaging variants (DIP vs. SOIC) are included to provide options for different PCB assembly methods.
Parameter Comparison
| Parameter | 74HC540N,652 (Main) | 74HC540D,653 | CD74HC540E | SN74HC540N |
|---|---|---|---|---|
| Manufacturer | NXP USA Inc. | Nexperia USA Inc. | Texas Instruments | Texas Instruments |
| Logic Type | Buffer, Inverting | Buffer, Inverting | Buffer, Inverting | Buffer, Inverting |
| Number of Elements | 1 | 1 | 1 | 1 |
| Number of Bits per Element | 8 | 8 | 8 | 8 |
| Output Type | 3-State | 3-State | 3-State | 3-State |
| Current - Output High, Low | 7.8mA, 7.8mA | 7.8mA, 7.8mA | 7.8mA, 7.8mA | 7.8mA, 7.8mA |
| Voltage - Supply | 2V ~ 6V | 2V ~ 6V | 2V ~ 6V | 2V ~ 6V |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C | -55°C ~ 125°C | -40°C ~ 85°C |
| Mounting Type | Through Hole | Surface Mount | Through Hole | Through Hole |
| Package / Case | 20-DIP (0.300", 7.62mm) | 20-SOIC (0.295", 7.50mm) | 20-DIP (0.300", 7.62mm) | 20-DIP (0.300", 7.62mm) |
| Product Status | Obsolete | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
For Through-Hole PCB Assembly:
The CD74HC540E (Texas Instruments) and SN74HC540N (Texas Instruments) are direct through-hole substitutes with identical 20-DIP packaging. Both parts are in active production status, ensuring long-term availability. The CD74HC540E offers an extended operating temperature range of -55°C to 125°C, suitable for industrial and harsh environment applications. The SN74HC540N operates within -40°C to 85°C, appropriate for standard commercial and consumer applications.
For Surface Mount PCB Assembly:
The 74HC540D,653 (Nexperia USA Inc.) is a surface-mount variant in 20-SOIC packaging. This part is actively produced and provides equivalent electrical performance for designs requiring SMD assembly methods. The SOIC package reduces PCB footprint compared to DIP variants.
All substitute parts maintain ROHS3 compliance and REACH unaffected status, meeting modern environmental and regulatory requirements.
Frequently Asked Questions (FAQ)
Q: Can the 74HC540D,653 (SOIC package) be used as a direct replacement for the 74HC540N,652 (DIP package)?
A: The 74HC540D,653 is electrically equivalent but requires different PCB layout and assembly methods. DIP packages use through-hole mounting, while SOIC packages require surface-mount assembly. PCB redesign is necessary for package conversion.
Q: What is the difference between the CD74HC540E and SN74HC540N?
A: Both are through-hole 20-DIP packages with identical electrical specifications. The CD74HC540E operates from -55°C to 125°C, while the SN74HC540N operates from -40°C to 85°C. Select CD74HC540E for extended temperature range requirements.
Q: Are all substitute parts RoHS and REACH compliant?
A: Yes. All listed substitute parts are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.
Q: Why is the 74HC540N,652 listed as obsolete?
A: The original part is no longer manufactured by NXP USA Inc. Active substitutes from Nexperia USA Inc. and Texas Instruments provide equivalent functionality and are recommended for new designs and production.
Q: Can I use these parts interchangeably in existing designs?
A: Through-hole variants (CD74HC540E and SN74HC540N) are pin-compatible and can be used interchangeably without PCB modification. The surface-mount variant (74HC540D,653) requires PCB redesign.
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