74HC540N,652 Equivalent & Substitute Parts

Part Overview

The 74HC540N,652 is an inverting buffer logic integrated circuit manufactured by NXP USA Inc. in a 20-DIP through-hole package. This part functions as a Buffer, Inverting with 1 element, 8 bits per element, and 3-state output capability. The device operates across a 2V to 6V supply voltage range with output currents of 7.8mA for both high and low states.

The 74HC540N,652 is classified as obsolete. Equivalent and substitute parts are necessary to maintain design continuity and ensure component availability for new production runs, repairs, and system upgrades.

Substiute Parts

74HC540N,652
NXP USA Inc.In Stock: 99674HC540N,652 Datasheet
74HC540N,652
Current Part
74HC540D,653
Nexperia USA Inc.In Stock: 1108774HC540D,653 Datasheet
74HC540D,653
MFR Recommended
CD74HC540E
Texas InstrumentsIn Stock: 1458CD74HC540E Datasheet
CD74HC540E
MFR Recommended
SN74HC540N
Texas InstrumentsIn Stock: 50256SN74HC540N Datasheet
SN74HC540N
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 74HC540N,652
Manufacturer NXP USA Inc.
Logic Type Buffer, Inverting
Number of Elements 1
Number of Bits per Element 8
Output Type 3-State
Current - Output High, Low 7.8mA, 7.8mA
Voltage - Supply 2V ~ 6V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Through Hole
Package / Case 20-DIP (0.300", 7.62mm)
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the 74HC540N,652 are qualified based on the following electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Logic Type: Buffer, Inverting (identical function)
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Output Type: 3-State
  • Current - Output High, Low: 7.8mA, 7.8mA
  • Voltage - Supply: 2V ~ 6V
  • Series: 74HC

Mechanical Compatibility Criteria:

  • Package / Case: 20-DIP or 20-SO (surface mount variant)
  • Mounting Type: Through Hole or Surface Mount

Compliance Criteria:

  • RoHS Status: ROHS3 Compliant
  • REACH Status: REACH Unaffected

The substitute parts listed below meet all electrical requirements and maintain functional equivalence. Packaging variants (DIP vs. SOIC) are included to provide options for different PCB assembly methods.

Parameter Comparison

Parameter 74HC540N,652 (Main) 74HC540D,653 CD74HC540E SN74HC540N
Manufacturer NXP USA Inc. Nexperia USA Inc. Texas Instruments Texas Instruments
Logic Type Buffer, Inverting Buffer, Inverting Buffer, Inverting Buffer, Inverting
Number of Elements 1 1 1 1
Number of Bits per Element 8 8 8 8
Output Type 3-State 3-State 3-State 3-State
Current - Output High, Low 7.8mA, 7.8mA 7.8mA, 7.8mA 7.8mA, 7.8mA 7.8mA, 7.8mA
Voltage - Supply 2V ~ 6V 2V ~ 6V 2V ~ 6V 2V ~ 6V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -55°C ~ 125°C -40°C ~ 85°C
Mounting Type Through Hole Surface Mount Through Hole Through Hole
Package / Case 20-DIP (0.300", 7.62mm) 20-SOIC (0.295", 7.50mm) 20-DIP (0.300", 7.62mm) 20-DIP (0.300", 7.62mm)
Product Status Obsolete Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

For Through-Hole PCB Assembly:

The CD74HC540E (Texas Instruments) and SN74HC540N (Texas Instruments) are direct through-hole substitutes with identical 20-DIP packaging. Both parts are in active production status, ensuring long-term availability. The CD74HC540E offers an extended operating temperature range of -55°C to 125°C, suitable for industrial and harsh environment applications. The SN74HC540N operates within -40°C to 85°C, appropriate for standard commercial and consumer applications.

For Surface Mount PCB Assembly:

The 74HC540D,653 (Nexperia USA Inc.) is a surface-mount variant in 20-SOIC packaging. This part is actively produced and provides equivalent electrical performance for designs requiring SMD assembly methods. The SOIC package reduces PCB footprint compared to DIP variants.

All substitute parts maintain ROHS3 compliance and REACH unaffected status, meeting modern environmental and regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can the 74HC540D,653 (SOIC package) be used as a direct replacement for the 74HC540N,652 (DIP package)?

A: The 74HC540D,653 is electrically equivalent but requires different PCB layout and assembly methods. DIP packages use through-hole mounting, while SOIC packages require surface-mount assembly. PCB redesign is necessary for package conversion.

Q: What is the difference between the CD74HC540E and SN74HC540N?

A: Both are through-hole 20-DIP packages with identical electrical specifications. The CD74HC540E operates from -55°C to 125°C, while the SN74HC540N operates from -40°C to 85°C. Select CD74HC540E for extended temperature range requirements.

Q: Are all substitute parts RoHS and REACH compliant?

A: Yes. All listed substitute parts are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.

Q: Why is the 74HC540N,652 listed as obsolete?

A: The original part is no longer manufactured by NXP USA Inc. Active substitutes from Nexperia USA Inc. and Texas Instruments provide equivalent functionality and are recommended for new designs and production.

Q: Can I use these parts interchangeably in existing designs?

A: Through-hole variants (CD74HC540E and SN74HC540N) are pin-compatible and can be used interchangeably without PCB modification. The surface-mount variant (74HC540D,653) requires PCB redesign.

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