74HC157N,652 Equivalent & Substitute Parts

Part Overview

The 74HC157N,652 is a 4 x 2:1 multiplexer logic integrated circuit manufactured by NXP USA Inc. in a 16-DIP through-hole package. This part is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement. The 74HC157 series provides four independent 2-to-1 multiplexer circuits in a single package, suitable for signal routing and data selection applications in digital systems.

Key Parameters

Parameter	Value
Manufacturer Part Number	74HC157N,652
Manufacturer	NXP USA Inc.
Category	Logic
Type	Multiplexer 4 x 2:1
Circuit Configuration	4 x 2:1
Current - Output High, Low	5.2mA, 5.2mA
Voltage Supply	2V ~ 6V
Operating Temperature	-40°C ~ 125°C
Mounting Type	Through Hole
Package / Case	16-DIP (0.300", 7.62mm)
Product Status	Obsolete
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution for the 74HC157N,652 is determined by the following critical parameters:

Functional Equivalence: All substitute parts must maintain the 4 x 2:1 multiplexer circuit configuration with identical logic functionality.

Electrical Compatibility: Supply voltage range (2V ~ 6V) and output current specifications must be met or exceeded by substitute parts.

Package Compatibility: Through-hole mounting in 16-DIP package format is the primary constraint for direct mechanical substitution. Surface-mount alternatives (16-SOIC) are listed as functional equivalents but require board redesign.

Operating Temperature Range: Substitute parts must support the application's temperature requirements within the specified range.

Compliance Requirements: RoHS and REACH compliance status are documented for regulatory adherence.

The substitute parts identified below satisfy these criteria within their respective product statuses and packaging configurations.

Parameter Comparison

Parameter	74HC157N,652 (NXP)	CD74HC157E (Harris)	74HC157D,652 (NXP)	SN74HC157N (TI)
Type	Multiplexer 4 x 2:1	Multiplexer 4 x 2:1	Multiplexer 4 x 2:1	Multiplexer 4 x 2:1
Circuit Configuration	4 x 2:1	4 x 2:1	4 x 2:1	4 x 2:1
Current - Output High, Low	5.2mA, 5.2mA	5.2mA, 5.2mA	5.2mA, 5.2mA	7.8mA, 7.8mA
Voltage Supply	2V ~ 6V	2V ~ 6V	2V ~ 6V	2V ~ 6V
Operating Temperature	-40°C ~ 125°C	-55°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 85°C
Mounting Type	Through Hole	Through Hole	Surface Mount	Through Hole
Package / Case	16-DIP (0.300", 7.62mm)	16-DIP (0.300", 7.62mm)	16-SOIC (0.154", 3.90mm)	16-DIP (0.300", 7.62mm)
Product Status	Obsolete	Obsolete	Active	Active
RoHS Status	ROHS3 Compliant	RoHS non-compliant	Not specified	ROHS3 Compliant

Engineering Selection Recommendations

For Direct Through-Hole Package Replacement:

SN74HC157N (Texas Instruments) is the recommended substitute for the 74HC157N,652. Both parts maintain 16-DIP through-hole packaging, identical voltage supply range, and ROHS3 compliance. The SN74HC157N is currently active in production, ensuring long-term availability. Output current specification (7.8mA) exceeds the original part's 5.2mA, providing improved drive capability. Operating temperature range (-40°C ~ 85°C) is narrower than the original but suitable for most industrial applications.

For Functional Equivalence with Obsolete Status Acceptance:

CD74HC157E (Harris Corporation) provides identical through-hole 16-DIP packaging and electrical specifications. However, this part is obsolete and RoHS non-compliant, making it suitable only for legacy system maintenance where compliance exemptions apply.

For Surface-Mount Alternative:

74HC157D,652 (NXP Semiconductors) is an active production part offering identical electrical specifications in 16-SOIC surface-mount packaging. This option requires PCB redesign but provides the advantage of current manufacturer support and unlimited moisture sensitivity rating.

Frequently Asked Questions (FAQ)

Q: Can SN74HC157N directly replace 74HC157N,652 without circuit modification?

A: Yes. Both parts share identical 16-DIP through-hole packaging, voltage supply range (2V ~ 6V), and circuit configuration (4 x 2:1 multiplexer). Pin-to-pin compatibility is maintained. The higher output current specification of SN74HC157N (7.8mA vs. 5.2mA) is a performance improvement with no negative impact on existing designs.

Q: What is the difference between the DIP and SOIC package options?

A: 16-DIP (dual in-line package) is through-hole mounting with 0.300" lead spacing, suitable for breadboards and traditional PCB designs. 16-SOIC (small-outline integrated circuit) is surface-mount with 0.154" width, requiring SMT assembly equipment. Functional performance is identical; package selection depends on manufacturing capability and board design.

Q: Is CD74HC157E a viable substitute despite RoHS non-compliance?

A: CD74HC157E is functionally equivalent but obsolete and RoHS non-compliant. Use is restricted to legacy system repairs where regulatory exemptions apply or where RoHS compliance is not required. For new designs or systems requiring compliance documentation, SN74HC157N or 74HC157D,652 are preferred.

Q: Does the narrower operating temperature range of SN74HC157N (-40°C ~ 85°C) limit its use?

A: The SN74HC157N temperature range is suitable for commercial and industrial applications. If your design requires operation above 85°C, verify the specific temperature requirement against the original 74HC157N,652 specification (-40°C ~ 125°C). For extended temperature applications, 74HC157D,652 maintains the full -40°C ~ 125°C range.

Q: Are all substitute parts electrically interchangeable?

A: Yes, all listed substitutes maintain the 4 x 2:1 multiplexer function and 2V ~ 6V supply voltage compatibility. Output current differences (5.2mA vs. 7.8mA) do not affect interchangeability; higher current capability is beneficial. Package differences (DIP vs. SOIC) require mechanical and assembly considerations but do not affect electrical function.

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