74F373SC D-Type Transparent Latch Equivalent & Substitute Parts

Part Overview

The 74F373SC is a D-Type Transparent Latch logic IC manufactured by onsemi, featuring an 8:8 circuit configuration with tri-state output capability. This component is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing design support and procurement continuity. The part operates within the 4.5V to 5.5V supply voltage range and is housed in a 20-SOIC surface mount package.

Substiute Parts

74F373SC

onsemiIn Stock: 69174F373SC Datasheet

Current PartRFQ

SN74F373DW

Texas InstrumentsIn Stock: 2464SN74F373DW Datasheet

DirectRFQ

SN74F373DWR

Texas InstrumentsIn Stock: 5326SN74F373DWR Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 74F373SC are qualified based on the following criteria:

• Identical base product number (74F373)
• Matching logic type (D-Type Transparent Latch)
• Identical circuit configuration (8:8)
• Identical output type (Tri-State)
• Matching supply voltage range (4.5V ~ 5.5V)
• Identical independent circuit count (1)
• Matching operating temperature range (0°C ~ 70°C)
• Identical package and case specification (20-SOIC)
• Identical mounting type (Surface Mount)

The substitute parts identified are manufactured by Texas Instruments and maintain full electrical and mechanical compatibility with the original onsemi part.

Parameter Comparison

Engineering Selection Recommendations

For applications currently using the 74F373SC, the SN74F373DWR manufactured by Texas Instruments is the primary substitute. This part maintains active product status, ensuring long-term availability and supply chain stability. The SN74F373DWR is ROHS3 compliant, meeting modern environmental and regulatory requirements that the original onsemi part does not satisfy.

The SN74F373DW is available as a secondary option with Last Time Buy status, suitable for applications where tape and reel packaging is not required. Both Texas Instruments alternatives are REACH unaffected and carry identical EAR99 export classification.

The propagation delay differential (5.3ns for 74F373SC versus 8.6ns for both TI substitutes) must be evaluated within the context of specific application timing requirements, as this represents the only electrical parameter variance among the three parts.

Frequently Asked Questions (FAQ)

Q: Are the Texas Instruments SN74F373DW and SN74F373DWR electrically identical?

A: Yes. Both parts share identical electrical specifications including supply voltage, output current ratings, propagation delay, and operating temperature range. The difference lies in packaging format (Tube versus Tape & Reel) and product lifecycle status.

Q: What is the significance of the propagation delay difference between the onsemi and Texas Instruments parts?

A: The onsemi 74F373SC specifies 5.3ns propagation delay, while both TI substitutes specify 8.6ns. This 3.3ns difference must be evaluated against application timing margins. If the original design operated within tight timing constraints dependent on the 5.3ns specification, system-level timing analysis is required before substitution.

Q: Can the SN74F373DWR be used as a direct drop-in replacement?

A: Yes, from a mechanical and electrical standpoint. The 20-SOIC package dimensions, pin configuration, supply voltage, output current ratings, and operating temperature range are identical. PCB layout and footprint compatibility are maintained.

Q: Why is RoHS compliance relevant for this substitution?

A: The original 74F373SC is RoHS non-compliant, while both TI substitutes are ROHS3 compliant. For new designs or applications subject to RoHS regulations, the TI alternatives satisfy compliance requirements that the onsemi part does not.

Q: Which packaging format should be selected for production?

A: The SN74F373DWR in Tape & Reel format is recommended for high-volume production due to automated handling compatibility. The SN74F373DW in Tube format is suitable for lower-volume applications or manual assembly processes.