74ALVC244D,118 Equivalent & Substitute Parts

Part Overview

The 74ALVC244D,118 is a non-inverting buffer logic IC manufactured by Nexperia USA Inc., designed for 3-state output applications in 20-SO surface mount packaging. This device functions as a 2-element, 4-bit buffer with active product status and full RoHS3 compliance. Equivalent and substitute parts are identified to support procurement flexibility, inventory management, and design continuity across manufacturing environments.

Key Parameters

Parameter	Value
Manufacturer Part Number	74ALVC244D,118
Manufacturer	Nexperia USA Inc.
Logic Type	Buffer, Non-Inverting
Number of Elements	2
Number of Bits per Element	4
Output Type	3-State
Current - Output High, Low	24mA, 24mA
Voltage - Supply	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	20-SOIC (0.295", 7.50mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Product Status	Active

Substitute Part Grouping Explanation

Substitute parts for the 74ALVC244D,118 are qualified based on the following critical parameters that determine functional and mechanical compatibility:

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 4
Output Type: 3-State
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)

All identified substitute parts maintain identical electrical specifications and mechanical compatibility. Variations in packaging format (Tube vs. Tape & Reel) and manufacturer series designation (74ALVC, 74ALVCH, 74LVCH) do not affect functional substitution within the specified parameter constraints.

Parameter Comparison

Parameter	74ALVC244D,118 (Nexperia)	SN74ALVC244DW (TI)	SN74ALVCH244DW (TI)	SN74ALVC244DWR (TI)	SN74ALVCH244DWR (TI)	SN74LVCH244ADWR (TI)
Manufacturer	Nexperia USA Inc.	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Logic Type	Buffer, Non-Inverting	Buffer, Non-Inverting	Buffer, Non-Inverting	Buffer, Non-Inverting	Buffer, Non-Inverting	Buffer, Non-Inverting
Number of Elements	2	2	2	2	2	2
Number of Bits per Element	4	4	4	4	4	4
Output Type	3-State	3-State	3-State	3-State	3-State	3-State
Current - Output High, Low	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA	24mA, 24mA
Voltage - Supply	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Package / Case	20-SOIC (0.295", 7.50mm Width)	20-SOIC (0.295", 7.50mm Width)	20-SOIC (0.295", 7.50mm Width)	20-SOIC (0.295", 7.50mm Width)	20-SOIC (0.295", 7.50mm Width)	20-SOIC (0.295", 7.50mm Width)
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
Product Status	Active	Active	Active	Active	Active	Active
Packaging Format	Tape & Reel (TR)	Tube	Tube	Tape & Reel (TR)	Tape & Reel (TR)	Tape & Reel (TR)

Engineering Selection Recommendations

All identified substitute parts maintain full electrical and mechanical compatibility with the 74ALVC244D,118. Selection criteria are based on product status, compliance certifications, and packaging availability:

All substitute parts carry Active product status, ensuring long-term availability and manufacturing support. ROHS3 compliance and MSL Level 1 (Unlimited) moisture sensitivity ratings are consistent across all options, supporting deployment in standard industrial and commercial environments.

Packaging format differences between Tube and Tape & Reel do not affect functional performance. Selection between these formats depends on procurement volume requirements and assembly line automation compatibility. Texas Instruments parts (SN74ALVC244DW, SN74ALVCH244DW, SN74ALVC244DWR, SN74ALVCH244DWR, SN74LVCH244ADWR) provide equivalent functionality to the Nexperia 74ALVC244D,118 across all specified electrical and mechanical parameters.

Frequently Asked Questions (FAQ)

Q: Can SN74ALVC244DW be used as a direct replacement for 74ALVC244D,118?

A: Yes. Both parts share identical electrical specifications (1.65V ~ 3.6V supply, 24mA output current, -40°C ~ 85°C operating range) and mechanical compatibility (20-SOIC package, surface mount). The primary difference is packaging format: SN74ALVC244DW is supplied in Tube format, while 74ALVC244D,118 is supplied in Tape & Reel. Functional performance is equivalent.

Q: What is the difference between 74ALVC, 74ALVCH, and 74LVCH series designations?

A: Series designations reflect manufacturer product lines and internal design variations. All three series maintain identical electrical parameters specified for this application: 2-element, 4-bit non-inverting buffers with 3-state output, 1.65V ~ 3.6V supply voltage, and 24mA output current. Substitution between series is supported within the specified parameter constraints.

Q: Does packaging format (Tube vs. Tape & Reel) affect electrical performance?

A: No. Packaging format affects only procurement and assembly logistics. Electrical and mechanical specifications remain identical. Tube packaging is suitable for lower-volume applications and manual assembly. Tape & Reel packaging is optimized for high-volume automated assembly processes.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All identified substitute parts carry ROHS3 Compliant certification and MSL Level 1 (Unlimited) moisture sensitivity rating, matching the compliance profile of the 74ALVC244D,118.

Q: Can these parts be used interchangeably in existing PCB designs?

A: Yes. All substitute parts use identical 20-SOIC (0.295", 7.50mm Width) package dimensions and pin configurations. PCB footprints and assembly processes require no modification for substitution.

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