74ACT11286N Equivalent & Substitute Parts

Part Overview

The 74ACT11286N is a 9-bit parity generator/checker logic integrated circuit manufactured by Texas Instruments in a 14-pin DIP (Dual In-line Package) configuration. This component is classified as obsolete, indicating it has been discontinued and is no longer in active production. The part operates within the 74ACT logic family, which provides advanced CMOS technology with TTL-compatible inputs and outputs.

Due to its obsolete status, sourcing new units of the 74ACT11286N presents supply chain challenges. Identifying functionally equivalent substitute parts with compatible electrical and mechanical specifications is essential for system redesign, board revision, or production continuation.

Substiute Parts

74ACT11286N

Texas InstrumentsIn Stock: 84074ACT11286N Datasheet

Current PartRFQ

74ACT11286DR

Texas InstrumentsIn Stock: 376774ACT11286DR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 74ACT11286N must maintain functional equivalence based on the following critical parameters:

• Logic Function: Parity Generator/Checker with 9-bit configuration
• Electrical Performance: Output current capability (24mA high/low), supply voltage range (4.5 V ~ 5.5 V), and operating temperature range (-40°C ~ 85°C)
• Series Compatibility: 74ACT logic family designation
• Base Product Number: 74ACT11286 (common across package variants)

The primary substitute identified is the 74ACT11286DR, which maintains identical electrical specifications and logic functionality. The key difference is the package type: the substitute uses Surface Mount (14-SOIC) instead of Through Hole (14-DIP) mounting. This substitution is valid when the target application can accommodate surface mount technology.

Parameter Comparison

Engineering Selection Recommendations

The 74ACT11286DR serves as the direct functional equivalent to the 74ACT11286N. Both parts share identical electrical specifications, logic functionality, and operating parameters. The substitution decision depends on board-level design constraints:

Through Hole Requirement: If the application mandates through-hole mounting technology, the 74ACT11286N remains the specified part. However, given its obsolete status, long-term availability is not guaranteed.

Surface Mount Capability: If the target board design supports surface mount technology, the 74ACT11286DR is the preferred substitute. This part offers improved compliance status (ROHS3 Compliant versus RoHS non-compliant) and better current availability (3700 units in stock versus 830 units).

Compliance Considerations: The 74ACT11286DR meets ROHS3 compliance requirements, making it suitable for applications with environmental or regulatory compliance mandates. The original 74ACT11286N does not meet these standards.

Frequently Asked Questions (FAQ)

Q: Can the 74ACT11286DR directly replace the 74ACT11286N in an existing design?

A: Electrical and functional compatibility is complete. The substitute requires board redesign to accommodate the 14-SOIC surface mount package instead of the 14-DIP through-hole package. Pin-to-pin functionality is identical.

Q: What are the key differences between these parts?

A: The parts are electrically and functionally identical. Differences are limited to packaging format (DIP versus SOIC), mounting technology (through-hole versus surface mount), and compliance status (RoHS non-compliant versus ROHS3 compliant).

Q: Why is the 74ACT11286N classified as obsolete?

A: The part has been discontinued by the manufacturer and is no longer in active production. Existing inventory may be available through authorized distributors, but long-term supply cannot be assured.

Q: Are there alternative 74ACT parity generator parts available?

A: Substitution options are limited to variants of the 74ACT11286 base product number. The 74ACT11286DR is the primary alternative within the same logic family and functional specification.

Q: What is the impact of switching from DIP to SOIC packaging?

A: SOIC packaging requires surface mount assembly capabilities and board layout modifications. SOIC packages occupy less board space and are compatible with automated assembly processes. Through-hole DIP packages require manual or selective wave soldering.

Q: Does the ROHS3 compliance of the 74ACT11286DR affect electrical performance?

A: No. ROHS3 compliance relates to material composition and environmental standards, not electrical performance. Both parts maintain identical electrical specifications and operating characteristics.