74AC273SC Equivalent & Substitute Parts

Part Overview

The 74AC273SC is a D-Type flip-flop logic integrated circuit manufactured by onsemi, featuring 1 element with 8-bit configuration and positive edge triggering. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity. The 20-SOIC surface mount package provides standard form factor compatibility across multiple manufacturers.

Substiute Parts

74AC273SC

onsemiIn Stock: 98674AC273SC Datasheet

Current PartRFQ

MC74AC273DWG

onsemiIn Stock: 1195MC74AC273DWG Datasheet

DirectRFQ

MC74AC273DWR2G

onsemiIn Stock: 2843MC74AC273DWR2G Datasheet

SimilarRFQ

CD74AC273M96

Texas InstrumentsIn Stock: 50290CD74AC273M96 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 74AC273SC is determined by the following critical parameters: identical package type (20-SOIC), matching functional configuration (D-Type flip-flop, 1 element, 8-bit, positive edge trigger, non-inverted output, master reset function), and compatible electrical specifications (supply voltage range, output current capability, and propagation delay performance).

The substitute parts are grouped into two categories:

Direct Manufacturer Substitutes (onsemi): Parts maintaining identical or superior electrical performance with the same base product number (74AC273) and package specification.

Cross-Manufacturer Substitutes (Texas Instruments): Parts from alternative manufacturers meeting the same functional and package requirements, with electrical parameters within acceptable operating ranges for the 74AC series logic family.

Parameter Comparison

Engineering Selection Recommendations

MC74AC273DWG (onsemi, Tube Packaging): This direct onsemi substitute is active in production status and provides improved propagation delay performance (9 ns versus 10 ns). It maintains identical supply voltage range and output current specifications. The component is ROHS3 compliant. Moisture sensitivity level increases to MSL 3, requiring controlled storage conditions. Suitable for applications where onsemi sourcing is preferred and tube packaging meets procurement requirements.

MC74AC273DWR2G (onsemi, Tape & Reel Packaging): This direct onsemi substitute offers identical electrical performance to MC74AC273DWG with improved propagation delay (9 ns). Tape & Reel packaging supports automated assembly processes. Active production status ensures long-term availability. ROHS3 compliant with MSL 3 moisture sensitivity. Recommended for high-volume manufacturing environments requiring reel packaging.

CD74AC273M96 (Texas Instruments, Tape & Reel Packaging): This cross-manufacturer substitute from Texas Instruments provides extended operating temperature range (-55°C ~ 125°C) and MSL 1 moisture sensitivity (unlimited storage). Clock frequency is reduced to 100 MHz with propagation delay of 14.6 ns. Supply voltage range extends to 1.5V minimum. Input capacitance increases to 10 pF. Active production status with ROHS3 compliance. Suitable for applications requiring extended temperature operation or unlimited moisture sensitivity conditions.

Frequently Asked Questions (FAQ)

Q: Can MC74AC273DWG replace 74AC273SC directly? A: Yes. Both components share identical functional configuration (D-Type flip-flop, 1 element, 8-bit, positive edge trigger, master reset), package type (20-SOIC), and electrical specifications (supply voltage 2V ~ 6V, output current 24 mA). MC74AC273DWG provides improved propagation delay performance (9 ns versus 10 ns). The primary difference is packaging type (tube versus unspecified) and moisture sensitivity level (MSL 3 versus MSL 1).

Q: What is the difference between MC74AC273DWG and MC74AC273DWR2G? A: Both parts are manufactured by onsemi with identical electrical specifications and active production status. The difference is packaging format: MC74AC273DWG uses tube packaging, while MC74AC273DWR2G uses Tape & Reel (TR) packaging. Tape & Reel format is standard for automated assembly processes. Electrical performance and compliance specifications are identical.

Q: Can CD74AC273M96 from Texas Instruments be used as a substitute? A: CD74AC273M96 is functionally compatible as a D-Type flip-flop with matching 8-bit configuration and 20-SOIC package. However, electrical parameters differ: clock frequency is 100 MHz (versus 175 MHz), propagation delay is 14.6 ns (versus 10 ns), and operating temperature range extends to -55°C ~ 125°C. Supply voltage minimum is 1.5V (versus 2V). These differences are acceptable for applications not requiring maximum clock frequency performance. Input capacitance increases to 10 pF.

Q: What does MSL (Moisture Sensitivity Level) mean for component selection? A: MSL indicates moisture absorption limits and storage conditions. MSL 1 (unlimited) allows indefinite storage at any humidity. MSL 3 (168 hours) requires controlled storage below 30% relative humidity or use within 168 hours of package opening. MC74AC273DWG and MC74AC273DWR2G require moisture-controlled storage, while CD74AC273M96 and the original 74AC273SC do not.

Q: Are all substitute parts ROHS3 compliant? A: MC74AC273DWG, MC74AC273DWR2G, and CD74AC273M96 are all ROHS3 compliant. The original 74AC273SC does not specify RoHS status. All substitute parts meet current environmental compliance requirements.

Q: Which substitute part has the best performance? A: MC74AC273DWG and MC74AC273DWR2G provide the best propagation delay performance (9 ns) and highest clock frequency (175 MHz), matching or exceeding the original 74AC273SC specifications. Both are onsemi products with active production status.

Q: What packaging format should I select for my application? A: Tube packaging (MC74AC273DWG) is suitable for manual assembly or small-volume applications. Tape & Reel packaging (MC74AC273DWR2G and CD74AC273M96) is standard for automated pick-and-place assembly and high-volume manufacturing. Select based on your assembly process requirements.