74ABT574CSJX Equivalent & Substitute Parts

Part Overview

The 74ABT574CSJX is a D-type flip-flop logic integrated circuit manufactured by onsemi, featuring 1 element with 8-bit positive edge triggering in a 20-SOIC package. This part is classified as obsolete, which necessitates identification of equivalent substitute components for ongoing design requirements and procurement needs. The 74ABT574 series provides standard D-type flip-flop functionality with tri-state output capability suitable for digital logic applications requiring edge-triggered storage and output control.

Substiute Parts

74ABT574CSJX
onsemiIn Stock: 99074ABT574CSJX Datasheet
74ABT574CSJX
Current Part
CY74FCT574ATSOC
Texas InstrumentsIn Stock: 1800CY74FCT574ATSOC Datasheet
CY74FCT574ATSOC
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SN74ABT574ADW
Texas InstrumentsIn Stock: 2413SN74ABT574ADW Datasheet
SN74ABT574ADW
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SN74ABT574ADWR
Texas InstrumentsIn Stock: 3176SN74ABT574ADWR Datasheet
SN74ABT574ADWR
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SN74ABT574ANSR
Texas InstrumentsIn Stock: 3182SN74ABT574ANSR Datasheet
SN74ABT574ANSR
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Key Parameters

Parameter Value
Manufacturer Part Number 74ABT574CSJX
Manufacturer onsemi
Series 74ABT
Type D-Type Flip-Flop
Number of Elements 1
Number of Bits per Element 8
Clock Frequency 200 MHz
Trigger Type Positive Edge
Output Type Tri-State, Inverted
Voltage Supply Range 4.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Package / Case 20-SOIC (0.209", 5.30mm Width)
Mounting Type Surface Mount
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the 74ABT574CSJX is determined by the following critical parameters:

Functional Equivalence Requirements:

  • D-Type flip-flop architecture with 1 element and 8-bit configuration
  • Positive edge trigger mechanism
  • Tri-state output capability
  • 200 MHz clock frequency operation
  • 4.5V to 5.5V supply voltage compatibility
  • -40°C to 85°C operating temperature range

Package Compatibility Considerations:

  • 20-SOIC package format (physical pin count and spacing)
  • Surface mount mounting type
  • Package width variations (0.209" or 0.295") affect PCB layout compatibility

Output Configuration:

  • The main part features inverted tri-state outputs
  • Substitute parts with non-inverted outputs require circuit-level evaluation for logic compatibility

Substitute parts are grouped into two categories based on package dimensions and output inversion characteristics. Parts maintaining the 0.209" package width (SN74ABT574ANSR) provide direct physical compatibility. Parts with 0.295" package width (SN74ABT574ADW, SN74ABT574ADWR, CY74FCT574ATSOC) require PCB layout modification but maintain functional compatibility through equivalent electrical parameters.

Parameter Comparison

Parameter 74ABT574CSJX (Main) SN74ABT574ANSR SN74ABT574ADW SN74ABT574ADWR CY74FCT574ATSOC
Manufacturer onsemi Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Series 74ABT 74ABT 74ABT 74ABT 74FCT
Product Status Obsolete Active Active Active Active
Type D-Type D-Type D-Type D-Type D-Type
Number of Elements 1 1 1 1 1
Number of Bits per Element 8 8 8 8 8
Clock Frequency 200 MHz 200 MHz 200 MHz 200 MHz Not specified
Trigger Type Positive Edge Positive Edge Positive Edge Positive Edge Positive Edge
Output Type Tri-State, Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted Tri-State, Non-Inverted
Max Propagation Delay @ 5V, 50pF 5ns 6.6ns 4.8ns 4.8ns 7.2ns
Current - Output High, Low 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA 32mA, 64mA
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.75V ~ 5.25V
Current - Quiescent (Iq) 50 µA 250 µA 250 µA 250 µA 200 µA
Input Capacitance 5 pF 4.6 pF 4.6 pF 4.6 pF 5 pF
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 20-SOIC (0.209", 5.30mm) 20-SOIC (0.209", 5.30mm) 20-SOIC (0.295", 7.50mm) 20-SOIC (0.295", 7.50mm) 20-SOIC (0.295", 7.50mm)
Mounting Type Surface Mount Tape & Reel Tube Tape & Reel Tube
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant Not specified
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

SN74ABT574ANSR is the primary substitute for direct replacement. This part maintains identical package dimensions (0.209", 5.30mm width), operates within the same voltage and temperature specifications, and is currently in active production status. The output configuration differs (non-inverted versus inverted), requiring circuit-level verification. Quiescent current is elevated at 250 µA compared to 50 µA in the original part. This part is ROHS3 compliant and available in Tape & Reel packaging.

SN74ABT574ADW and SN74ABT574ADWR provide functional equivalence with improved propagation delay (4.8ns versus 5ns) and are available in active production status. These parts feature a wider 20-SOIC package (0.295", 7.50mm width), necessitating PCB layout modification. Both are ROHS3 compliant. SN74ABT574ADWR is supplied in Tape & Reel format, while SN74ABT574ADW is supplied in Tube packaging.

CY74FCT574ATSOC operates within the same functional and electrical parameters but belongs to the 74FCT series rather than 74ABT. This part exhibits slightly higher propagation delay (7.2ns) and elevated quiescent current (200 µA). The 0.295" package width requires PCB layout modification. This part is available in active production status and supplied in Tube packaging.

All substitute parts maintain tri-state output capability, positive edge triggering, 8-bit configuration, and surface mount mounting type. Selection should prioritize SN74ABT574ANSR for minimal design modification, or SN74ABT574ADW/ADWR for improved performance characteristics if PCB layout modification is acceptable.

Frequently Asked Questions (FAQ)

Q: Can SN74ABT574ANSR be used as a direct pin-for-pin replacement for 74ABT574CSJX?

A: SN74ABT574ANSR maintains identical pinout and package dimensions (20-SOIC, 0.209" width), enabling direct physical replacement on the PCB. However, the output configuration differs: the original part features inverted tri-state outputs while the substitute provides non-inverted outputs. Circuit-level evaluation is required to determine logic compatibility with downstream components.

Q: What are the implications of the wider package width in SN74ABT574ADW and SN74ABT574ADWR?

A: These parts use a 0.295" wide 20-SOIC package compared to the 0.209" width of the original part. The pin count and spacing remain identical, but the physical package footprint is larger. PCB layout modification is necessary, including potential adjustments to component placement and routing around the wider package body.

Q: How do propagation delay differences affect circuit performance?

A: The original 74ABT574CSJX specifies 5ns maximum propagation delay at 5V with 50pF load. Substitute parts range from 4.8ns (SN74ABT574ADW/ADWR) to 7.2ns (CY74FCT574ATSOC). Faster propagation delays (4.8ns) improve timing margins, while slower delays (7.2ns) may require timing analysis verification in critical path applications.

Q: Why do substitute parts show higher quiescent current?

A: The original part specifies 50 µA quiescent current, while most substitutes specify 250 µA (74ABT series) or 200 µA (74FCT series). This represents a 4-5x increase in standby power consumption. For battery-powered or low-power applications, this difference may be significant and requires power budget reassessment.

Q: Are all substitute parts ROHS3 compliant?

A: SN74ABT574ANSR, SN74ABT574ADW, and SN74ABT574ADWR are explicitly ROHS3 compliant. CY74FCT574ATSOC does not specify RoHS status in the provided data. Compliance verification with CY74FCT574ATSOC is required for applications with RoHS mandates.

Q: What is the difference between 74ABT and 74FCT series logic?

A: Both series provide D-type flip-flop functionality with similar electrical characteristics. The 74ABT series (Advanced BiCMOS Technology) and 74FCT series (Fast CMOS Technology) differ in internal architecture and performance characteristics. CY74FCT574ATSOC exhibits slightly higher propagation delay (7.2ns) and different quiescent current (200 µA) compared to 74ABT variants, but maintains functional compatibility for standard logic applications.

Q: Can packaging format (Tube versus Tape & Reel) affect substitution decisions?

A: Packaging format affects procurement and assembly processes but does not impact electrical or functional compatibility. Tube packaging (SN74ABT574ADW, CY74FCT574ATSOC) is suitable for manual assembly or small-volume production. Tape & Reel packaging (SN74ABT574ANSR, SN74ABT574ADWR) is optimized for automated assembly equipment. Selection should align with manufacturing process requirements.

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