72V283L7-5PFGI8 Equivalent & Substitute Parts

Part Overview

The 72V283L7-5PFGI8 is a synchronous FIFO logic IC manufactured by Renesas Electronics Corporation. This component provides 576K memory capacity (64K x 9 configuration) with 5ns access time and 133.3MHz data rate in an 80-TQFP surface mount package. The part is currently in active product status with full RoHS3 compliance. Equivalent and substitute parts are identified for applications requiring alternative sourcing, extended temperature ranges, or different performance specifications within compatible electrical and mechanical parameters.

Substiute Parts

72V283L7-5PFGI8

Renesas Electronics CorporationIn Stock: 78572V283L7-5PFGI8 Datasheet

Current PartRFQ

SN74V283-10PZA

Texas InstrumentsIn Stock: 777SN74V283-10PZA Datasheet

MFR RecommendedRFQ

SN74V283-15PZA

Texas InstrumentsIn Stock: 785SN74V283-15PZA Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 72V283L7-5PFGI8 are qualified based on the following electrical and mechanical compatibility criteria:

Core Compatibility Requirements:

• Memory size: 576K (32K x 18)(64K x 9) configuration
• Function: Synchronous FIFO
• Bus directional: Uni-Directional
• Voltage supply range: 3.15V ~ 3.45V
• Current supply maximum: 35mA
• Mounting type: Surface Mount
• Package type: 80-pin LQFP/TQFP (14x14mm)
• Expansion type: Depth, Width

Performance Variation Parameters: Substitute parts may differ in data rate and access time specifications. The 72V283L7-5PFGI8 operates at 133.3MHz with 5ns access time. Substitute parts with lower data rates (100MHz, 66.7MHz) and longer access times (6.5ns, 10ns) are electrically compatible for applications not requiring maximum performance specifications.

Environmental and Compliance Considerations: Operating temperature ranges may vary between the main part (-40°C ~ 85°C) and substitutes (0°C ~ 70°C). Product status varies between Active and Obsolete designations. All identified substitutes maintain RoHS3 compliance and REACH unaffected status.

Parameter Comparison

Engineering Selection Recommendations

SN74V283-10PZA (Texas Instruments): This part is electrically compatible with the 72V283L7-5PFGI8 across all core parameters. The SN74V283-10PZA operates at 100MHz with 6.5ns access time, representing a performance reduction from the Renesas part. This substitute is suitable for applications where maximum performance is not required. The part carries Obsolete product status, limiting long-term availability. Operating temperature range is restricted to 0°C ~ 70°C, which may not accommodate extended temperature applications. Moisture sensitivity level is 4 (72 hours), requiring more stringent handling compared to the main part's MSL 3 rating.

SN74V283-15PZA (Texas Instruments): This part maintains full electrical compatibility with the 72V283L7-5PFGI8 for core FIFO functionality. The SN74V283-15PZA operates at 66.7MHz with 10ns access time, providing the lowest performance specification among the three parts. This substitute is appropriate for low-speed FIFO applications. The part maintains Active product status, supporting long-term availability and supply continuity. Operating temperature range is 0°C ~ 70°C, which is narrower than the main part. Moisture sensitivity level is 4 (72 hours). Packaging is specified as Tray rather than Tape & Reel.

Selection Criteria: Choose the 72V283L7-5PFGI8 for applications requiring maximum performance (133.3MHz, 5ns), extended temperature operation (-40°C ~ 85°C), or long-term supply assurance with Active status. Select SN74V283-15PZA for cost-optimized designs with lower speed requirements and confirmed Active product status. The SN74V283-10PZA is not recommended for new designs due to Obsolete status, despite electrical compatibility.

Frequently Asked Questions (FAQ)

Q: Are the SN74V283 parts pin-compatible with the 72V283L7-5PFGI8? A: The parts share identical 80-pin LQFP/TQFP package configurations (14x14mm) with the same pin count and signal assignments for synchronous FIFO operation. Pin compatibility is confirmed for uni-directional FIFO applications with matching memory configurations.

Q: What is the difference between TQFP and LQFP packaging? A: Both TQFP (Thin Quad Flat Package) and LQFP (Low-profile Quad Flat Package) are 80-pin surface mount packages with 14x14mm body dimensions. The primary difference is package height and lead formation. Both are mechanically compatible for PCB assembly with standard reflow processes.

Q: Can I use the SN74V283-15PZA in place of the 72V283L7-5PFGI8 in a high-speed application? A: The SN74V283-15PZA operates at 66.7MHz with 10ns access time, compared to the 72V283L7-5PFGI8 at 133.3MHz with 5ns access time. This substitute is not suitable for applications requiring the higher data rate and faster access time of the main part. System timing analysis is required to confirm compatibility with lower performance specifications.

Q: What does Obsolete product status mean for the SN74V283-10PZA? A: Obsolete status indicates that Texas Instruments has discontinued manufacturing and support for this part. While existing inventory may be available, long-term supply cannot be assured. New designs should not incorporate obsolete parts.

Q: Are all three parts RoHS3 compliant? A: Yes, the 72V283L7-5PFGI8, SN74V283-10PZA, and SN74V283-15PZA all carry RoHS3 compliance certification and REACH unaffected status, meeting environmental regulatory requirements for electronic components.

Q: What is the significance of Moisture Sensitivity Level (MSL) differences? A: The 72V283L7-5PFGI8 has MSL 3 (168 hours), allowing longer exposure to ambient humidity before soldering. The SN74V283 parts have MSL 4 (72 hours), requiring more stringent moisture control and shorter storage times after package opening. This affects component handling, storage, and assembly procedures.

Q: Can I substitute parts between Tape & Reel and Tray packaging? A: Tape & Reel and Tray are packaging formats for component delivery and handling. The electrical and mechanical specifications of the IC itself remain identical. Substitution is possible, but procurement and assembly processes may differ based on packaging format availability and equipment compatibility.