Equivalent & Substitute Parts for Renesas Electronics 7133LA55G

Part Overview

The Renesas Electronics 7133LA55G is a 32Kbit dual-port asynchronous SRAM with parallel interface, organized as 2K x 16 bits. This component operates at 55 ns access time and write cycle time, with supply voltage range of 4.5V to 5.5V. The part is mounted in a 68-pin ball grid array (68-BPGA) package measuring 29.46x29.46mm through-hole configuration.

The 7133LA55G is classified as obsolete. Equivalent and substitute parts are necessary to support legacy system maintenance, board redesigns, and production continuity where original components are no longer available or inventory is depleted.

Substiute Parts

7133LA55G
Renesas Electronics CorporationIn Stock: 11167133LA55G Datasheet
7133LA55G
Current Part
7133LA20JG
Renesas Electronics CorporationIn Stock: 9957133LA20JG Datasheet
7133LA20JG
MFR Recommended
7133SA90GB
Renesas Electronics CorporationIn Stock: 8647133SA90GB Datasheet
7133SA90GB
MFR Recommended

Key Parameters

Parameter Value
Memory Type Volatile SRAM
Memory Format Dual Port, Asynchronous
Memory Size 32Kbit
Memory Organization 2K x 16
Memory Interface Parallel
Access Time 55 ns
Write Cycle Time 55 ns
Voltage Supply 4.5V ~ 5.5V
Operating Temperature 0°C ~ 70°C
Package Type 68-BPGA
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution eligibility for the 7133LA55G is determined by the following critical parameters:

  • Memory capacity (32Kbit) and organization (2K x 16)
  • Dual-port asynchronous SRAM technology
  • Parallel interface configuration
  • Supply voltage compatibility (4.5V ~ 5.5V)
  • Access time and write cycle time specifications
  • Package type and mounting method

Two substitute parts meet these criteria with specific trade-offs:

7133LA20JG: Faster access time (20 ns vs. 55 ns), surface-mount 68-PLCC package, active product status, RoHS3 compliant. Suitable for designs where improved performance is acceptable and surface-mount assembly is available.

7133SA90GB: Slower access time (90 ns vs. 55 ns), through-hole 68-BPGA package (same as original), extended operating temperature range (-55°C to 125°C vs. 0°C to 70°C), active product status. Suitable for designs requiring through-hole mounting and extended temperature operation.

Parameter Comparison

Parameter 7133LA55G (Main) 7133LA20JG (Substitute) 7133SA90GB (Substitute)
Manufacturer Renesas Electronics Renesas Electronics Renesas Electronics
Memory Size 32Kbit 32Kbit 32Kbit
Memory Organization 2K x 16 2K x 16 2K x 16
Memory Type Dual Port Asynchronous SRAM Dual Port Asynchronous SRAM Dual Port Asynchronous SRAM
Access Time 55 ns 20 ns 90 ns
Write Cycle Time 55 ns 20 ns 90 ns
Voltage Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C -55°C ~ 125°C
Package Type 68-BPGA 68-PLCC 68-BPGA
Mounting Type Through Hole Surface Mount Through Hole
Product Status Obsolete Active Active
RoHS Status Non-compliant RoHS3 Compliant Non-compliant
Moisture Sensitivity Level 1 (Unlimited) 3 (168 Hours) 1 (Unlimited)

Engineering Selection Recommendations

For through-hole assembly designs: The 7133SA90GB maintains the same 68-BPGA package and through-hole mounting as the original 7133LA55G. This part is active and available. The 90 ns access time is slower than the original specification; designs must accommodate this timing difference. The extended operating temperature range (-55°C to 125°C) provides additional environmental capability beyond the original part.

For surface-mount assembly or performance-critical designs: The 7133LA20JG offers superior access time (20 ns) and is RoHS3 compliant, supporting modern manufacturing and environmental standards. This part requires surface-mount assembly capability and a different package footprint (68-PLCC vs. 68-BPGA). The higher moisture sensitivity level (MSL 3) requires controlled storage conditions.

For legacy system maintenance with minimal redesign: The 7133SA90GB is the preferred substitute when board layout and assembly methods cannot be changed, as it uses the same through-hole package and mounting type as the original part.

Frequently Asked Questions (FAQ)

Q: Can the 7133LA20JG be used as a direct replacement for the 7133LA55G?

A: The 7133LA20JG is functionally compatible in terms of memory capacity, organization, and interface. However, it requires surface-mount assembly instead of through-hole mounting, necessitating board redesign. The faster 20 ns access time is backward-compatible with designs specified for 55 ns operation.

Q: What is the impact of the 90 ns access time in the 7133SA90GB compared to the original 55 ns specification?

A: The 7133SA90GB has a longer access time by 35 ns. Designs must accommodate this timing difference in memory access cycles. If the original design has timing margins, this part may operate within specification. Critical timing paths must be re-evaluated.

Q: Are there package compatibility issues between the substitute parts and the original?

A: Yes. The 7133LA55G and 7133SA90GB both use 68-BPGA through-hole packages and are mechanically compatible. The 7133LA20JG uses a 68-PLCC surface-mount package and requires different board layout and assembly processes.

Q: What are the compliance differences between these parts?

A: The 7133LA20JG is RoHS3 compliant, meeting modern environmental regulations. The 7133LA55G and 7133SA90GB are RoHS non-compliant. All three parts are REACH unaffected. The 7133LA20JG has higher moisture sensitivity (MSL 3) requiring controlled storage, while the other two have unlimited moisture sensitivity (MSL 1).

Q: Which substitute part should be selected for new designs?

A: For new designs, the 7133LA20JG is preferred due to active product status, RoHS3 compliance, and superior performance. The 7133SA90GB is suitable for legacy system support where through-hole mounting is required and timing margins exist.

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