Equivalent & Substitute Parts for Renesas 7130SA55C

Part Overview

The Renesas 7130SA55C is an 8Kbit dual-port asynchronous SRAM with parallel interface, organized as 1K x 8, housed in a 48-DIP package with 55 ns access time. This part is classified as obsolete, making substitute identification critical for ongoing system support and new design implementations. The original part's through-hole mounting and legacy packaging require evaluation against modern surface-mount alternatives that maintain functional compatibility.

Substiute Parts

7130SA55C

Renesas Electronics CorporationIn Stock: 8257130SA55C Datasheet

Current PartRFQ

7130LA20JG

Renesas Electronics CorporationIn Stock: 9327130LA20JG Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 7130SA55C is determined by the following mandatory parameters:

• Memory capacity: 8Kbit minimum
• Memory organization: 1K x 8 configuration
• Memory type: Volatile SRAM, dual-port asynchronous
• Memory interface: Parallel
• Voltage supply range: 4.5V ~ 5.5V compatibility
• Operating temperature range: 0°C ~ 70°C minimum coverage
• Access time: Equal to or faster than 55 ns

The 7130LA20JG qualifies as a direct functional substitute. It maintains identical memory capacity, organization, interface type, voltage specifications, and temperature range. The substitute offers improved access time (20 ns versus 55 ns), representing a performance enhancement. The primary difference is packaging: the substitute uses surface-mount 52-PLCC technology instead of through-hole 48-DIP, requiring PCB redesign for implementation.

Parameter Comparison

Engineering Selection Recommendations

The 7130LA20JG is functionally equivalent to the 7130SA55C for all electrical and logical operations. Selection between these parts depends on system constraints:

For legacy through-hole PCB designs requiring direct socket compatibility, the 7130SA55C remains the only option, though availability is limited to existing inventory (803 pcs). The part's obsolete status indicates no future manufacturing.

For new designs or PCB redesigns, the 7130LA20JG is the preferred selection. It offers active product status with confirmed availability (868 pcs), ROHS3 compliance for regulatory alignment, and superior access time performance (20 ns). The surface-mount 52-PLCC package requires PCB layout modification but enables modern manufacturing processes.

Both parts maintain identical electrical specifications for voltage supply and operating temperature, ensuring functional interchangeability within these parameters.

Frequently Asked Questions (FAQ)

Q: Can the 7130LA20JG replace the 7130SA55C in an existing through-hole design?

A: Electrical substitution is valid. However, the 7130LA20JG uses surface-mount 52-PLCC packaging versus the original 48-DIP through-hole package. Direct socket replacement is not possible without PCB redesign and adapter solutions.

Q: What is the performance difference between these parts?

A: The 7130LA20JG provides faster memory access (20 ns versus 55 ns). This represents a 2.75x speed improvement and is backward-compatible with designs specified for 55 ns operation.

Q: Are there compliance differences between the parts?

A: Yes. The 7130SA55C is RoHS non-compliant. The 7130LA20JG is ROHS3 compliant, meeting current environmental and regulatory requirements for new product designs and manufacturing.

Q: What is the inventory status for each part?

A: The 7130SA55C has 803 pcs available as new original stock. The 7130LA20JG has 868 pcs available. Both are listed as new original inventory.

Q: Are the pin counts different between these packages?

A: Yes. The 7130SA55C uses 48-DIP packaging (48 pins). The 7130LA20JG uses 52-PLCC packaging (52 pins). Pin configuration differences require schematic and layout verification before substitution.

Q: Can I use the 7130LA20JG in a new design if the original specification called for the 7130SA55C?

A: Yes, provided the PCB layout accommodates the 52-PLCC surface-mount package. All electrical parameters, memory capacity, organization, interface type, voltage supply, and operating temperature specifications are compatible.