Equivalent & Substitute Parts for 7130LA55TFI

Part Overview

The 7130LA55TFI is a dual-port asynchronous SRAM memory IC with 8Kbit capacity, organized as 1K x 8, manufactured by Renesas Electronics Corporation. This component is classified as obsolete and operates with a 55 ns access time in a 64-TQFP surface mount package. Due to its obsolete status, identifying compatible substitute parts is essential for system redesign, board revisions, or inventory replenishment where the original part is no longer available through standard distribution channels.

Substiute Parts

7130LA55TFI
Renesas Electronics CorporationIn Stock: 10877130LA55TFI Datasheet
7130LA55TFI
Current Part
7130LA25TFGI
Renesas Electronics CorporationIn Stock: 11537130LA25TFGI Datasheet
7130LA25TFGI
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Key Parameters

Parameter Value
Memory Type Volatile SRAM
Memory Format Dual Port, Asynchronous
Memory Size 8Kbit
Memory Organization 1K x 8
Memory Interface Parallel
Access Time 55 ns
Write Cycle Time 55 ns
Supply Voltage 4.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Package Type 64-TQFP (10x10)
Mounting Type Surface Mount
Moisture Sensitivity Level MSL 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the 7130LA55TFI is determined by strict alignment with the following core parameters:

  • Memory Capacity & Organization: Substitute parts must provide identical 8Kbit capacity with 1K x 8 organization to ensure pin-compatible operation and functional equivalence.
  • Memory Technology: Only dual-port asynchronous SRAM devices qualify as substitutes, maintaining the same access methodology and timing characteristics.
  • Parallel Interface: The memory interface must remain parallel to preserve signal compatibility with existing PCB designs.
  • Package & Pinout: The 64-TQFP (10x10) surface mount package is mandatory for mechanical and electrical compatibility.
  • Supply Voltage Range: Substitute parts must operate within the 4.5V ~ 5.5V range to ensure compatibility with existing power distribution systems.
  • Operating Temperature Range: The -40°C ~ 85°C operating range must be maintained or exceeded.
  • Moisture Sensitivity: MSL 3 classification ensures equivalent handling and storage requirements.

The 7130LA25TFGI qualifies as a direct substitute based on these parameters. The primary distinction is improved access time performance (25 ns versus 55 ns), which represents a performance upgrade rather than a functional incompatibility.

Parameter Comparison

Parameter 7130LA55TFI (Main Part) 7130LA25TFGI (Substitute)
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Memory Type Volatile SRAM Volatile SRAM
Memory Format Dual Port, Asynchronous Dual Port, Asynchronous
Memory Size 8Kbit 8Kbit
Memory Organization 1K x 8 1K x 8
Memory Interface Parallel Parallel
Access Time 55 ns 25 ns
Write Cycle Time 55 ns 25 ns
Supply Voltage 4.5V ~ 5.5V 4.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Package Type 64-TQFP (10x10) 64-TQFP (10x10)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level MSL 3 (168 Hours) MSL 3 (168 Hours)
Product Status Obsolete Active
RoHS Compliance Non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The 7130LA25TFGI is a qualified substitute for the 7130LA55TFI based on functional and electrical equivalence. The substitute part offers the following advantages:

  • Active Product Status: The 7130LA25TFGI maintains active production status, ensuring long-term availability and supply chain reliability compared to the obsolete 7130LA55TFI.
  • RoHS3 Compliance: The substitute part meets ROHS3 compliance requirements, whereas the original part is non-compliant. This distinction is significant for applications subject to environmental regulations or customer specifications requiring RoHS compliance.
  • Performance Enhancement: The 25 ns access and write cycle time represents a performance improvement over the 55 ns specification of the original part. This faster timing is backward-compatible with designs originally specified for the slower part.
  • Identical Electrical & Mechanical Specifications: All core parameters—memory capacity, organization, interface type, voltage range, temperature range, package, and MSL rating—remain identical, ensuring drop-in compatibility.

Selection of the 7130LA25TFGI is appropriate for new designs, board revisions, or inventory replenishment where the original obsolete part is unavailable.

Frequently Asked Questions (FAQ)

Q: Can the 7130LA25TFGI be used as a direct replacement for the 7130LA55TFI?

A: Yes. Both parts share identical memory capacity (8Kbit), organization (1K x 8), interface type (parallel dual-port asynchronous SRAM), package (64-TQFP), voltage range (4.5V ~ 5.5V), and operating temperature range (-40°C ~ 85°C). The 25 ns timing of the substitute is faster than the original 55 ns specification and is functionally compatible with designs originally specified for the slower part.

Q: What is the primary reason to substitute the 7130LA55TFI?

A: The 7130LA55TFI is classified as obsolete. The 7130LA25TFGI is an active product with guaranteed availability, making it the appropriate choice for new designs and production continuity.

Q: Are there any compliance differences between these parts?

A: Yes. The 7130LA55TFI is RoHS non-compliant, while the 7130LA25TFGI is ROHS3 compliant. For applications requiring RoHS compliance, the substitute part is mandatory.

Q: Will the faster access time of the 7130LA25TFGI cause any compatibility issues?

A: No. Faster access time is backward-compatible. Designs specified for 55 ns access time will operate correctly with a 25 ns part, as the faster device meets or exceeds all timing requirements of the original specification.

Q: Are the package and pinout identical?

A: Yes. Both parts use the 64-TQFP (10x10) surface mount package with identical pinout, enabling direct PCB compatibility without layout modifications.

Q: What is the moisture sensitivity level for both parts?

A: Both parts are classified as MSL 3 (168 Hours), requiring identical handling, storage, and reflow procedures.

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