Amphenol ICC 68464-372 Equivalent & Substitute Parts

Part Overview

The Amphenol ICC 68464-372 is a rectangular connector header featuring 72 positions with 0.100" (2.54mm) pitch, designed for through-hole board-to-board applications. This component is classified as obsolete, making identification of active equivalent parts essential for ongoing production and maintenance requirements. The BERGSTIK® II series connector provides solder termination with push-pull fastening in an unshrouded configuration.

Substiute Parts

68464-372
Amphenol ICC (FCI)In Stock: 65768464-372 Datasheet
68464-372
Current Part
BBD-136-G-C
Samtec Inc.In Stock: 1177BBD-136-G-C Datasheet
BBD-136-G-C
MFR Recommended
BBD-136-T-C
Samtec Inc.In Stock: 933BBD-136-T-C Datasheet
BBD-136-T-C
MFR Recommended

Key Parameters

Parameter Value
Connector Type Header
Contact Type Male Pin
Number of Positions 72
Number of Rows 2
Pitch - Mating 0.100" (2.54mm)
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Style Board to Board
Shrouding Unshrouded
Operating Temperature Range -65°C ~ 130°C
Current Rating 3A
Material Flammability Rating UL94 V-0
RoHS Status RoHS non-compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the Amphenol ICC 68464-372 is determined by strict alignment of the following critical parameters:

  • Connector Type & Contact Configuration: Header with male pins
  • Position Count & Row Configuration: 72 positions in 2 rows
  • Pitch Specification: 0.100" (2.54mm) mating pitch with 0.100" row spacing
  • Mounting & Termination: Through-hole solder termination
  • Fastening Mechanism: Push-pull fastening
  • Board Interface Style: Board-to-board unshrouded design

The Samtec Inc. BBD series connectors (BBD-136-G-C and BBD-136-T-C) satisfy these core substitution criteria. Both parts maintain identical position count, pitch, row configuration, mounting type, termination method, and fastening type. Variations exist in contact finish specifications and operating temperature ranges, which are documented in the parameter comparison table below.

Parameter Comparison

Parameter 68464-372 (Amphenol ICC) BBD-136-G-C (Samtec) BBD-136-T-C (Samtec)
Manufacturer Amphenol ICC (FCI) Samtec Inc. Samtec Inc.
Product Status Obsolete Active Active
Series BERGSTIK® II BBD BBD
Connector Type Header Header Header
Contact Type Male Pin Male Pin Male Pin
Number of Positions 72 72 72
Number of Rows 2 2 2
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Row Spacing - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Mounting Type Through Hole Through Hole Through Hole
Termination Solder Solder Solder
Fastening Type Push-Pull Push-Pull Push-Pull
Style Board to Board Board to Board Board to Board
Shrouding Unshrouded Unshrouded Unshrouded
Contact Finish - Mating Gold or Gold, GXT™ Gold Tin
Contact Finish - Post Not specified Nickel Nickel
Operating Temperature -65°C ~ 130°C -55°C ~ 125°C -55°C ~ 125°C
Insulation Color Black Black Black
RoHS Status RoHS non-compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99 EAR99

Engineering Selection Recommendations

BBD-136-G-C (Gold Finish): This substitute maintains the gold contact finish specification of the original 68464-372, providing direct functional equivalence for applications requiring gold-plated mating surfaces. The part is ROHS3 compliant and carries active product status with 1087 units in stock. The operating temperature range of -55°C ~ 125°C is narrower than the original specification; applications requiring operation below -55°C or above 125°C require thermal performance validation.

BBD-136-T-C (Tin Finish): This alternative provides tin-plated mating contacts and is functionally equivalent for applications where tin finish is acceptable. ROHS3 compliance and active product status are maintained. The identical operating temperature range and electrical characteristics apply as with the gold-finish variant.

Both Samtec substitutes provide active product availability, ROHS3 compliance, and equivalent mechanical and electrical performance within their specified operating ranges. Selection between BBD-136-G-C and BBD-136-T-C depends on contact finish requirements and application-specific environmental conditions.

Frequently Asked Questions (FAQ)

Q: Can BBD-136-G-C and BBD-136-T-C be used interchangeably with 68464-372?

A: Both Samtec parts satisfy the core substitution criteria: identical 72-position, 2-row configuration with 0.100" pitch, through-hole solder termination, and push-pull fastening. Selection between them depends on contact finish requirements. The operating temperature range is narrower (-55°C ~ 125°C versus -65°C ~ 130°C); applications operating outside this range require thermal validation.

Q: What are the key differences between BBD-136-G-C and BBD-136-T-C?

A: The primary difference is mating contact finish: BBD-136-G-C features gold plating, while BBD-136-T-C features tin plating. Both maintain identical position count, pitch, row spacing, mounting type, and termination method. Contact finish selection should align with application requirements and PCB pad specifications.

Q: Are the Samtec substitutes RoHS compliant?

A: Yes, both BBD-136-G-C and BBD-136-T-C are ROHS3 compliant. The original 68464-372 is RoHS non-compliant. Applications subject to RoHS requirements must transition to the Samtec alternatives.

Q: What is the packaging format for substitute parts?

A: Both BBD-136-G-C and BBD-136-T-C are supplied in tube packaging, with 1087 and 878 units in stock respectively.

Q: Are there any mechanical compatibility concerns when substituting these parts?

A: Both Samtec parts maintain identical pitch, row spacing, and through-hole mounting specifications. PCB footprints designed for 68464-372 are mechanically compatible with BBD-136-G-C and BBD-136-T-C. Contact length and insulation height specifications differ; verify that mating connector specifications accommodate the Samtec part dimensions before implementation.

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