Amphenol ICC 67096-014LF Equivalent & Substitute Parts

Part Overview

The Amphenol ICC 67096-014LF is a 14-position rectangular connector housing with 0.100" (2.54mm) pitch, designed for free-hanging in-line applications. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and procurement planning. The housing accommodates female socket contacts with friction lock fastening and operates without moisture sensitivity constraints (MSL 1 - Unlimited).

Substiute Parts

67096-014LF

Amphenol ICC (FCI)In Stock: 84367096-014LF Datasheet

Current PartRFQ

1-1734006-4

TE Connectivity AMP ConnectorsIn Stock: 11671-1734006-4 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 67096-014LF is determined by the following critical parameters:

• Position Count: Must be 14 positions
• Contact Type: Must be female socket
• Mounting Configuration: Must support free-hanging in-line installation
• Row Configuration: Must be single-row design
• Pitch Tolerance: Pitch variations within standard connector families may be acceptable depending on PCB layout constraints

The TE Connectivity AMP Connectors 1-1734006-4 qualifies as a functional substitute based on matching position count, contact type, row configuration, and mounting style. The pitch specification differs (0.098" vs. 0.100"), which represents a 0.002" variance. This variance must be evaluated against specific application requirements and PCB footprint compatibility.

Parameter Comparison

Engineering Selection Recommendations

The TE Connectivity 1-1734006-4 is an active product with current manufacturing support and RoHS compliance certification. The 67096-014LF, being obsolete, presents supply chain risk for new procurement or system refresh initiatives.

Selection of the 1-1734006-4 as a substitute requires verification that the 0.002" pitch difference (2.54mm vs. 2.50mm) is compatible with the receiving PCB footprint. Both components share identical position count, row configuration, contact type, and mounting methodology, establishing functional equivalence at the housing level.

Both parts maintain MSL 1 classification and REACH Unaffected status, ensuring environmental compliance consistency.

Frequently Asked Questions (FAQ)

Q: Can the TE Connectivity 1-1734006-4 directly replace the Amphenol ICC 67096-014LF?

A: Functional replacement is possible provided PCB footprint accommodates the 0.002" pitch variance. Both housings are 14-position, single-row, female socket designs with free-hanging in-line mounting. Mechanical fit and electrical continuity depend on receiving connector compatibility and PCB layout specifications.

Q: What is the significance of the pitch difference between these parts?

A: The main part specifies 0.100" (2.54mm) pitch, while the substitute specifies 0.098" (2.50mm) pitch. This 0.002" difference affects PCB footprint spacing. Substitution is valid only if the receiving PCB design accommodates this tolerance or if the application allows for mechanical adjustment.

Q: Why is the 67096-014LF classified as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The TE Connectivity 1-1734006-4 remains in active production, making it the preferred choice for new designs or system replacements requiring long-term supply availability.

Q: Are there compliance differences between these parts?

A: The 1-1734006-4 carries RoHS Compliant certification, while the 67096-014LF does not specify RoHS status. Both maintain MSL 1 (Unlimited) moisture sensitivity and REACH Unaffected classification. For applications requiring RoHS compliance, the substitute is the appropriate selection.

Q: What role does contact termination play in substitution?

A: The 67096-014LF does not specify contact termination method, while the 1-1734006-4 uses crimp termination. Both housings are supplied without contacts included. Termination compatibility must be verified against the specific contact types and assembly processes used in the application.